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公开(公告)号:US20250008757A1
公开(公告)日:2025-01-02
申请号:US18291905
申请日:2023-05-30
Applicant: BOE Technology Group Co., Ltd.
Inventor: Jing WANG , Hongwei TIAN , Ran LI , Shantao CHEN
IPC: H10K39/34 , H10K59/12 , H10K59/121 , H10K59/124 , H10K59/80
Abstract: The present disclosure provides a display substrate and a method for manufacturing the same, and a display apparatus, belonging to the field of displaying technologies. The display substrate includes a base substrate, and a circuit layer, and has an island area, a hole area and a bridge area. The circuit layer includes a driving circuit located in the island area, a via hole located in the hole area, and at least one photoelectric sensor that is electrically connected to the driving circuit. The photoelectric sensor includes a first electrode layer, a photoelectric structure layer and a second electrode layer which are laminated. The photoelectric sensor is located in the island area or the bridge area.
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公开(公告)号:US20240339077A1
公开(公告)日:2024-10-10
申请号:US18578656
申请日:2023-05-23
Applicant: BOE Technology Group Co., Ltd.
Inventor: Ran LI , Xueyan TIAN , Hongwei TIAN , Tuo SUN , Xiyu ZHAO
IPC: G09G3/3233
CPC classification number: G09G3/3233 , G09G2300/0426 , G09G2300/0819 , G09G2300/0842 , G09G2300/0861
Abstract: A pixel driving circuit is provided. The pixel driving circuit includes a light emission control circuit and a drive circuit. The light emission control circuit controls a potential of a control terminal of the drive circuit under the control of a coupled signal terminal, and the drive circuit drives a coupled light-emitting element to emit light based on the potential of the control terminal thereof. The drive circuit includes two drive transistors connected in parallel, and subthreshold swings of the two drive transistors are different.
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公开(公告)号:US20230075199A1
公开(公告)日:2023-03-09
申请号:US17800902
申请日:2021-10-13
Applicant: BOE Technology Group Co., Ltd.
Abstract: A display substrate and a manufacturing method therefor, and a display device. The display substrate comprises a plurality of island areas that are spaced apart from each other, a plurality of hole areas, and bridge areas for connecting adjacent island areas. The island areas or/and the bridge areas comprise an edge area adjacent to the hole area; the edge area comprises a composite structure layer provided on a base substrate; a stepped structure is formed at a side surface of the composite structure layer facing the hole areas; the edge area further comprises an inorganic encapsulation layer disposed on the composite structure layer and the stepped structure.
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公开(公告)号:US20240304631A1
公开(公告)日:2024-09-12
申请号:US18020601
申请日:2022-05-31
Applicant: BOE Technology Group Co., Ltd.
Inventor: Hongwei TIAN , Yanan NIU , Jing WANG , Ran LI , Xueyan TIAN , Zheng LIU , Libin LIU , Shiming SHI
IPC: H01L27/12 , G06V40/13 , G09G3/3225
CPC classification number: H01L27/1225 , H01L27/127 , G06V40/1318 , G09G3/3225 , G09G2300/0426 , G09G2300/0819 , G09G2300/0852 , G09G2300/0861 , G09G2310/08
Abstract: Provided is a drive backplane. The drive backplane includes: a base substrate and a circuit structure. The circuit structure includes a plurality of first thin film transistors and a plurality of second thin film transistors; wherein a first active layer of the first thin film transistor includes a first oxide layer and a second oxide layer, wherein the second oxide layer is disposed on a side of the first oxide layer away from the base substrate, a mobility of the second oxide layer is lower than a mobility of the first oxide layer, and a source and a drain of the first thin film transistor are connected to the second oxide layer; and a second active layer of the second thin film transistor includes a third oxide layer, wherein a mobility of the third oxide layer is lower than the mobility of the first oxide layer.
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