Electronic device substrate, manufacturing method thereof, and electronic device

    公开(公告)号:US11749691B2

    公开(公告)日:2023-09-05

    申请号:US17847877

    申请日:2022-06-23

    CPC classification number: H01L27/1244 H01L27/1259

    Abstract: An electronic device substrate, a manufacturing method thereof, and an electronic device are provided. The electronic device substrate includes a base substrate, a first insulating layer, and light-emitting sub-units, a first conductive member and a second conductive member, which are on a side of the first insulating layer away from the base substrate. The light-emitting sub-units and the first conductive member are respectively in array region and periphery region, and the second conductive member is between the first conductive member and the array region; orthogonal projections of the first and second conductive members on the base substrate are spaced apart; each light-emitting sub-unit includes first and second driving electrodes, second driving electrodes of the light-emitting sub-units are integrated to form a first common electrode layer; the periphery region further includes a second common electrode layer electrically connected to the first conductive member and the first common electrode layer.

    Electronic Device Substrate, Manufacturing Method Thereof, and Electronic Device

    公开(公告)号:US20220336503A1

    公开(公告)日:2022-10-20

    申请号:US17847877

    申请日:2022-06-23

    Abstract: An electronic device substrate, a manufacturing method thereof, and an electronic device are provided. The electronic device substrate includes a base substrate, a first insulating layer, and light-emitting sub-units, a first conductive member and a second conductive member, which are on a side of the first insulating layer away from the base substrate. The light-emitting sub-units and the first conductive member are respectively in array region and periphery region, and the second conductive member is between the first conductive member and the array region; orthogonal projections of the first and second conductive members on the base substrate are spaced apart; each light-emitting sub-unit includes first and second driving electrodes, second driving electrodes of the light-emitting sub-units are integrated to form a first common electrode layer; the periphery region further includes a second common electrode layer electrically connected to the first conductive member and the first common electrode layer.

    Organic Light-Emitting Diode Display Substrate and Manufacturing Method Thereof, Display Device

    公开(公告)号:US20230118463A1

    公开(公告)日:2023-04-20

    申请号:US16957292

    申请日:2019-08-27

    Abstract: An organic light-emitting diode (OLED) display substrate, a manufacturing method thereof, and a display device are disclosed. In the OLED display substrate, an anode pattern is located at a side of an insulating layer away from a base substrate and is located in an effective display region; an organic light-emitting layer is located on the anode pattern; a periphery region includes a lead wire region and a virtual region that are at least partly overlapped; a lead wire is located in the lead wire region; the virtual region is provided with a virtual anode pattern, the virtual anode pattern is insulated from the lead wire; the periphery region further includes an annular electrode surrounding the effective display region; a cathode is electrically connected with the annular electrode; the virtual region is located at an outer side of the annular electrode away from the effective display region.

Patent Agency Ranking