Abstract:
The present disclosure provides an organic light-emitting diode display substrate and a manufacturing method thereof. The manufacturing method includes: sequentially forming a first electrode, a light-emitting layer and a second electrode on a base substrate; forming a protection layer having a first opening on a side of the second electrode distal to the base substrate; and forming a second opening in the second electrode, the second opening being located below the first opening. In the present disclosure, with the protection layer, only a portion of the second electrode below the first opening is removed, so that other portions of the second electrode are prevented from being damaged, thereby eliminating a poor display of the display device.
Abstract:
A display area drilling and packaging structure includes a back plate assembly, an emitting layer having a drilling area, and a hot melted adhesive layer. The emitting layer is disposed on the back plate assembly, and an annular cutting groove surrounding the drilling is disposed on the emitting layer. The hot melted adhesive layer at least covers an edge of a mouth of the annular cutting groove away from a center. A packaging layer is disposed on the back plate assembly, the hot melted adhesive layer, and the emitting layer.
Abstract:
The present disclosure discloses a flexible base substrate, a display substrate and methods of manufacturing the same, and a display device. A groove is provided in a surface of the flexible base substrate, the surface of the flexible base substrate having the groove is provided with a water-oxygen barrier film, and the thickness of the water-oxygen barrier film is smaller than the depth of the groove.
Abstract:
A flexible display substrate mother board and a method of manufacturing a flexible display substrate are provided. The method includes: forming a heating pattern layer on a support substrate, wherein the heating pattern layer includes a plurality of regional blocks spaced apart from each other; forming a flexible substrate on the substrate provided with the heating pattern layer, and forming display elements on the flexible substrate; and heating the flexible substrate by utilization of the heating pattern layer, cutting the flexible substrate, stripping the flexible substrate corresponding to the regional block from the support substrate, and forming flexible display substrates. The method can avoid the damage of the display elements on the flexible substrate when the flexible substrate and the support substrate are separated from each other, and avoid uneven separation.
Abstract:
Provided is a display panel. The display panel includes: a cutout region, a display region disposed on a periphery of the cutout region, and a winding region disposed between the cutout region and the display region. The display panel further includes: a substrate; a plurality of light-emitting devices disposed on the substrate, and a package layer and a light-shielding layer that are successively stacked and disposed on a side, distal from the substrate, of the plurality of light-emitting devices. The plurality of light-emitting devices are within the display region. The package layer is closer to the substrate relative to the light-shielding layer, and at least a portion of the light-shielding layer is within the winding region.
Abstract:
The present disclosure provides a display panel, a display device, and a manufacturing method. The display panel includes: a substrate including a display area and a non-display area and having a first groove in the non-display area; a driver circuit layer on a side of the display area of the substrate; a display function layer on a side of the driving circuit layer away from the substrate; an encapsulation layer on a side of the display function layer away from the driver circuit layer, the encapsulation layer including an inorganic encapsulation layer extending to the non-display area, and a part of the inorganic encapsulation layer being in the first groove; and a dam on the non-display area, an orthographic projection of the dam on the substrate being between the first groove and the display area, and the dam being covered by the inorganic encapsulation layer.
Abstract:
The present disclosure relates to a flexible display substrate and a flexible display device. The flexible display substrate includes a flexible base substrate and a pixel layer. The flexible base substrate includes: a plurality of opening regions, as well as a plurality of island regions and a plurality of bridge regions divided by the plurality of opening regions; and a pixel layer including a plurality of display units arranged in the plurality of island regions respectively, in which each of the plurality of display units is provided with a first groove, the first groove divides the corresponding display units into a display section and a dam section, and at least a part of the dam section is located between the display section and the bridge region adjacent to the display section.
Abstract:
The present disclosure relates to a display panel that includes: a separation layer disposed on a surface of a planarization layer facing away from a substrate in a transition area, and surrounds at least a part of an opening area of the substrate in a circumferential direction of the opening area, and a sidewall of the separation layer gradually is shrunk toward the substrate in a direction perpendicular to the substrate; and a barrier layer located in the transition area and at least covers a surface of the barrier layer facing away from the substrate. The barrier layer includes a material for blocking moisture and oxygen. The display layer covers the planarization layer and the barrier layer. The display layer includes a light-emitting layer, and the light-emitting layer is discontinuous at a sidewall position of the separation layer.
Abstract:
The present disclosure provides a display motherboard and a method for manufacturing the same, a display substrate and a method for manufacturing the same, and a display device, and belongs to the field of display technology. In the method for manufacturing the display motherboard of the present disclosure, the display motherboard includes a plurality of display substrate areas each including a sub display area and a sub bending area; and the method for manufacturing the display motherboard includes: forming an adhesive force variable back film material having a first adhesive force on a flexible underlying substrate; removing the back film material in positions above the sub bending areas; and treating the remaining back film material to form a back film having a second adhesive force, wherein the second adhesive force is greater than the first adhesive force.
Abstract:
A foldable substrate, a method for forming the same, and a flexible display device are provided. The foldable substrate includes a plurality of rigid supporting portions separated from each other, every two of which are not in contact with each other, and a flexible foldable portion connecting two adjacent rigid supporting portions of the plurality of rigid supporting portions.