QUANTUM DOT LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS

    公开(公告)号:US20240306412A1

    公开(公告)日:2024-09-12

    申请号:US18270849

    申请日:2021-02-23

    Inventor: Dong LI

    CPC classification number: H10K50/115 H10K50/16 H10K71/421

    Abstract: Disclosed are a quantum dot light-emitting device and a manufacturing method therefor, and a display apparatus, including: coating a substrate with a quantum dot solution, wherein each quantum dot includes a quantum dot body and a first crosslinkable ligand connected to the surface of the quantum dot body, and when the quantum dots are in a solution state, the first crosslinkable ligand is in a decrosslinking state; carrying out cross-linking reaction on the first crosslinkable ligand of the quantum dots at a first temperature; using laser to irradiate a quantum dot region to be removed after the crosslinking reaction, the quantum dots in said region being decrosslinked at a second temperature generated by laser irradiation, and a difference between the second temperature and the first temperature being greater than a preset value; and removing the quantum dots in said region to form a patterned quantum dot layer.

    LIGHT-EMITTING DEVICES AND METHODS FOR MANUFACTURING THE SAME, DISPLAY PANELS AND DISPLAY APPARATUSES

    公开(公告)号:US20240274756A1

    公开(公告)日:2024-08-15

    申请号:US18042944

    申请日:2022-02-23

    Inventor: Dong LI

    CPC classification number: H01L33/502 H01L25/0753 H01L33/005 H01L33/04

    Abstract: A light-emitting device includes a first electrode, an electron transporting layer disposed on a side of the first electrode, a quantum dot light-emitting layer disposed on a side of the electron transporting layer away from the first electrode, a second electrode disposed on a side of the quantum dot light-emitting layer away from the first electrode, and a plurality of adjustment patterns disposed between the first electrode and the quantum dot light-emitting layer. Orthographic projections of the plurality of adjustment patterns on a reference plane are distributed at intervals. The plurality of adjustment patterns are each in contact with the electron transporting layer. At least a portion of an orthographic projection of the electron transporting layer on the reference plane is located in a gap between the orthographic projections of the plurality of adjustment patterns on the reference plane.

    FLEXIBLE SUBSTRATE, DISPLAY PANEL AND DISPLAY APPARATUS

    公开(公告)号:US20210343954A1

    公开(公告)日:2021-11-04

    申请号:US17281420

    申请日:2020-06-04

    Abstract: A flexible substrate has at least one bendable region. The flexible substrate includes a flexible base, a first electrode layer disposed on the base, a first insulating layer disposed on a side of the first electrode layer away from the base, and a second electrode layer disposed on a side of the first insulating layer away from the base. The first electrode layer includes at least one first detection electrode, and the second electrode layer includes at least one second detection electrode. An orthogonal projection of a first detection electrode on the base overlaps at least partially with an orthogonal projection of a second detection electrode on the base. A region where orthogonal projections of the first detection electrode and the second detection electrode on the base are located overlaps with a bendable region.

    THIN FILM TRANSISTOR, METHOD FOR FABRICATING THE SAME, DISPLAY SUBSTRATE, AND DISPLAY DEVICE

    公开(公告)号:US20210193700A1

    公开(公告)日:2021-06-24

    申请号:US16077777

    申请日:2017-12-13

    Abstract: A thin film transistor, a method for fabricating the same, a display substrate, and a display device are disclosed. The thin film transistor includes a gate, a source, a drain, and an active layer. Forming the active layer includes: forming a pattern comprising a thermal insulation layer; forming a pattern comprising an amorphous silicon layer on the thermal insulation layer, wherein the pattern comprising the amorphous silicon layer includes a first portion on the thermal insulation layer and a second portion extending beyond the thermal insulation layer; and treating the pattern comprising the amorphous silicon layer with a laser annealing process, so that the amorphous silicon layer grows grain in a direction from the second portion to the first portion to form the active layer from polycrystalline silicon.

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