Abstract:
Certain gold alloys containing from about 12 to about 67 percent indium when used in ultrasonic bonds have been found to permit the operation of fused silica delay lines at temperatures of from 200 to 550* C. resulting in at least a 50 percent increase in frequency of acoustic waves transmitted for a given loss level as compared with room temperature operation.
Abstract:
An ultrasonic delay line, having as the delay medium a glass of the nominal composition in mole per cent 17 per cent lead oxide, 95 per cent barium oxide and 73.5 per cent silicon dioxide, exhibits an average temperature coefficient of delay time of not more than about + OR - 5 parts per million per degrees centigrade over the range 0* to 100* C., a thermal after-effect of not more than about 10 p.p.m., and an aging of delay time of not more than -10 parts per million per decade (decade is an order of magnitude of time in days).