公开(公告)号：US3523208A

公开(公告)日：1970-08-04

申请号：US3523208D

申请日：1968-05-27

Applicant: BELL TELEPHONE LABOR INC

Inventor： BODMER MAX G ,  CROWELL MERTON H ,  GORDON EUGENE I ,  MORRIS FRANCIS J

IPC: H01J9/233 ,  H01J29/45 ,  H01L23/29 ,  H01L27/00 ,  H01L27/144 ,  H01J31/26

CPC classification number: H01L27/1446 ,  H01J29/455 ,  H01L23/29 ,  H01L27/00 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：US3616284A

公开(公告)日：1971-10-26

申请号：US3616284D

申请日：1968-08-21

Applicant: BELL TELEPHONE LABOR INC

Inventor： BODMER MAX G ,  CROWELL MERTON H ,  WITTWER NORMAN C JR

IPC: H01L21/316 ,  C23B5/48 ,  C23B7/00

CPC classification number: H01L21/02238 ,  H01L21/02258 ,  H01L21/31675

Abstract: The specification describes a method for processing junction or barrier layer arrays to eliminate leakage defects. The array is anodized under mild electrolytic conditions which reverse bias the diodes. Since the array is reverse biased, anodization occurs selectively at the sites of current leakage and in proportion to the amount of leakage until the leakage is effectively eliminated. Properly formed elements of the array are essentially unaffected.

公开(公告)号：US3265925A

公开(公告)日：1966-08-09

申请号：US20729462

申请日：1962-07-03

Applicant: BELL TELEPHONE LABOR INC

Inventor： BODMER MAX G

IPC: H01J23/087 ,  H01J37/14

CPC classification number: H01J23/0873 ,  H01J37/14

公开(公告)号：US3391299A

公开(公告)日：1968-07-02

申请号：US43600165

申请日：1965-03-01

Applicant: BELL TELEPHONE LABOR INC

Inventor： BODMER MAX G ,  WEST JOHN W

IPC: H01J19/74 ,  H01J23/027 ,  H01J23/26 ,  H01J23/30

CPC classification number: H01J23/027 ,  H01J19/74 ,  H01J23/26 ,  H01J23/30

公开(公告)号：US2947907A

公开(公告)日：1960-08-02

申请号：US78431458

申请日：1958-12-31

Applicant: BELL TELEPHONE LABOR INC

Inventor： BODMER MAX G

IPC: H01J23/26 ,  H01J25/38

CPC classification number: H01J25/38 ,  H01J23/26