公开(公告)号：US20170154758A1

公开(公告)日：2017-06-01

申请号：US15310047

申请日：2014-11-27

申请人： BEIJING NMC CO., LTD.

发明人： Yanzhao ZHANG ,  Qing SHE ,  Peng CHEN

IPC分类号： H01J37/34 ,  H01L21/285 ,  H01J37/32 ,  C23C14/35 ,  C23C14/14

CPC分类号： H01J37/3441 ,  C23C14/14 ,  C23C14/35 ,  C23C14/564 ,  H01J37/32651 ,  H01J37/3405 ,  H01L21/00 ,  H01L21/2855

摘要： A reaction chamber and a semiconductor processing device, comprise a Faraday shielding ring (21) made of a magnetic insulation material and an insulating ring (22) made of an insulating material; the Faraday shielding ring (21) is provided with a slot thereon passing through a ring surface thereof in an axial direction; both the Faraday shielding ring (21) and the insulating ring (22) are disposed in the reaction chamber surrounding an inner peripheral wall of the reaction chamber, and the Faraday shielding ring (21) is stacked on the insulating ring (22) in a vertical direction. A shielding ring (211) is disposed surrounding an inner peripheral wall of the insulating ring (22), the shielding ring (211) is connected to an area of a lower surface of the Faraday shielding ring (21) adjacent to a center of the reaction chamber, and the shielding ring (211) is made of a magnetic insulation material and provided with a slot thereon passing through a ring surface thereof in an axis direction. The reaction chamber and the semiconductor processing device can not only avoid or reduce the risk of sparking, but also reduce the pollution of the reaction chamber caused by the flaking off of metal particles; and in addition, it is possible to increase an inner diameter and an available space of the reaction chamber.

公开(公告)号：US20170011892A1

公开(公告)日：2017-01-12

申请号：US15119658

申请日：2014-12-19

申请人： BEIJING NMC CO., LTD.

发明人： Hao GUO ,  Peng CHEN ,  Jue HOU

IPC分类号： H01J37/32 ,  C23C14/22 ,  C23C16/50

CPC分类号： H01J37/32715 ,  C23C14/22 ,  C23C14/50 ,  C23C16/50 ,  H01J37/20 ,  H01J37/32633 ,  H01J37/32733 ,  H01J2237/2007 ,  H01J2237/332 ,  H01L21/68721 ,  H01L21/68735 ,  H01L21/68742

摘要： Embodiments of the invention provide a bearing device and a plasma processing apparatus. According to at least one embodiment, the bearing device includes a base, a base driving mechanism, a pressing ring and a baffle ring. The base is used for bearing a workpiece to be processed; the base driving mechanism is used for driving the base to move up to a process position or down to a loading and unloading position; the pressing ring is used for clamping an edge region of the workpiece to be processed on the base when the base is at the process position; the baffle ring surrounds an outer peripheral wall of the base and is located under the pressing ring; surfaces of the pressing ring and the baffle ring opposite to each other include a pair of guiding tori, which are inclined outwardly at a same angle with respect to a centerline of the base in a vertical direction; and, during the process of driving the base to move up by the base driving mechanism, the guiding tori contact and move toward each other, so as to achieve positioning of the pressing ring and the base.

摘要翻译： 本发明的实施例提供一种轴承装置和等离子体处理装置。 根据至少一个实施例，轴承装置包括基座，基座驱动机构，按压环和挡板环。 该基座用于承受要加工的工件; 基座驱动机构用于驱动基座移动到处理位置或向下移动到装载和卸载位置; 当所述基座处于所述加工位置时，所述加压环用于在所述基座上夹持待处理的工件的边缘区域; 所述挡板环围绕所述基座的外周壁并且位于所述按压环下; 压环和相互相对的挡板的表面包括一对导向托盘，其相对于基座的中心线在垂直方向上以相同的角度向外倾斜; 并且在基座驱动机构驱动基座向上移动的过程中，导向托盘接触并相互移动，以实现按压环和底座的定位。