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公开(公告)号：US10234479B2
公开(公告)日：2019-03-19
申请号：US15482734
申请日：2017-04-08
Applicant: BEIHANG UNIVERSITY
Inventor： Zhaowen Yan , Jianwei Wang , Wei Zhang , Donglin Su
IPC: G01Q60/54
Abstract: The resonance structure is that two rows of ground via holes are placed symmetrically along two sides of the CB-CPW central conductor; each row of the via holes are equally spaced; every via hole connects a top shield plane layer, a first middle layer and a bottom shield plane layer of the magnetic probe; every via hole is placed out of a rectangle gap at the bottom of the magnetic probe; the via holes form a fence. The construction method: 1. constructing a simulation model formed by the magnetic probe and a 50Ω microstrip in a CST® microwave studio; 2. simulation setting; 3. placing via holes along two sides of the central conductor; 4. connecting a 50Ω matching load to the second end of the microstrip and defining the first end as microstrip port1; defining the end on which mount a SMA connector as probe port2; simulating S21.
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公开(公告)号：US10461386B2
公开(公告)日：2019-10-29
申请号：US15482735
申请日：2017-04-08
Applicant: BEIHANG UNIVERSITY
Inventor： Zhaowen Yan , Jianwei Wang , Wei Zhang , Donglin Su
Abstract: An impedance compensation structure for a broadband near-field magnetic-field probe, includes: a signal via; and a plurality of grounding vias provided around the signal via to form a coaxial via array; wherein the grounding via and the signal via have an identical size, all distances of each of the plurality of the grounding vias to the signal via are equal, and the plurality of the grounding vias forms a circle centered at the signal via; wherein each of the plurality of the grounding vias is connected with a magnetic field probe top layer shield plane and a magnetic field probe bottom layer shield plane; each of the plurality of the grounding vias keeps in a conducting state from a direct current to a high frequency, in such a manner that impedance matching of the broadband near-field magnetic-field probe is achieved.
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3.发明申请公开(公告)号：US20170215274A1
公开(公告)日：2017-07-27
申请号：US15482735
申请日：2017-04-08
Applicant: BEIHANG UNIVERSITY
Inventor： Zhaowen Yan , Jianwei Wang , Wei Zhang , Donglin Su
Abstract: An impedance compensation structure for a broadband near-field magnetic-field probe, includes: a signal via; and a plurality of grounding vias provided around the signal via to form a coaxial via array; wherein the grounding via and the signal via have an identical size, all distances of each of the plurality of the grounding vias to the signal via are equal, and the plurality of the grounding vias forms a circle centered at the signal via; wherein each of the plurality of the grounding vias is connected with a magnetic field probe top layer shield plane and a magnetic field probe bottom layer shield plane; each of the plurality of the grounding vias keeps in a conducting state from a direct current to a high frequency, in such a manner that impedance matching of the broadband near-field magnetic-field probe is achieved.
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