-
公开(公告)号：US12228648B2
公开(公告)日：2025-02-18
申请号：US18187827
申请日：2023-03-22
Applicant: Aurora Operations, Inc.
Inventor： Sen Lin , Andrew Steil Michaels
Abstract: A light detection and ranging (LIDAR) system include one or more LIDAR pixels including a transmit optical antenna, a receive optical antenna, a first receiver, and a second receiver. The transmit optical antenna is configured to emit a transmit beam. The receive optical antenna is configured to detect (i) a first polarization orientation of a returning beam and (ii) a second polarization orientation of the returning beam.
-
公开(公告)号：US20250035752A1
公开(公告)日：2025-01-30
申请号：US18794534
申请日：2024-08-05
Applicant: Aurora Operations, Inc.
Inventor： Lei Wang , Sen Lin , Andrew Steil Michaels
IPC: G01S7/481 , H01S5/02253
Abstract: A light detection and ranging (LIDAR) device includes a first wafer layer, a laser assembly disposed on the first wafer layer, a capping layer, a second wafer layer, and a photonic integrated circuit (PIC). The capping layer is coupled to the first wafer layer and configured to seal the laser assembly. The second wafer layer is at least partially coupled to the first wafer layer. The PIC is formed on the second wafer layer. The second wafer includes an exit feature configured to outcouple laser light from the laser assembly.
-
公开(公告)号：US12085674B2
公开(公告)日：2024-09-10
申请号：US17824820
申请日：2022-05-25
Applicant: Aurora Operations, Inc.
Inventor： Lei Wang , Sen Lin , Andrew Steil Michaels
IPC: G01C3/08 , G01S7/481 , H01S5/02253
CPC classification number: G01S7/4814 , H01S5/02253
Abstract: A light detection and ranging (LIDAR) device includes a first wafer layer, a laser assembly disposed on the first wafer layer, a capping layer, a second wafer layer, and a photonic integrated circuit (PIC). The capping layer is coupled to the first wafer layer and configured to seal the laser assembly. The second wafer layer is at least partially coupled to the first wafer layer. The PIC is formed on the second wafer layer. The second wafer includes an exit feature configured to outcouple laser light from the laser assembly.
-
公开(公告)号：US20240219574A1
公开(公告)日：2024-07-04
申请号：US18404620
申请日：2024-01-04
Applicant: Aurora Operations, Inc.
Inventor： Sen Lin , Andrew Steil Michaels
IPC: G01S17/931 , G01S7/484 , G01S7/4863
CPC classification number: G01S17/931 , G01S7/484 , G01S7/4863
Abstract: A light detection and ranging (LIDAR) sensor system includes a plurality of LIDAR pixels and a local oscillator module. The local oscillator module is coupled to the plurality of LIDAR pixels. The local oscillator module includes a first local oscillator input configured to receive a first local oscillator signal and a second local oscillator input configured to receive a second local oscillator signal. The local oscillator module is configured to provide the first local oscillator signal or the second local oscillator signal to a first LIDAR pixel of the plurality of LIDAR pixels.
-
公开(公告)号：US20240151820A1
公开(公告)日：2024-05-09
申请号：US18412119
申请日：2024-01-12
Applicant: Aurora Operations, Inc.
Inventor： Sen Lin , Andrew Steil Michaels
IPC: G01S7/481 , G01S17/931
CPC classification number: G01S7/4813 , G01S17/931
Abstract: A structure of a silicon photonics device for LIDAR includes a first insulating structure and a second insulating structure disposed above one or more etched silicon structures overlying a substrate member. A metal layer is disposed above the first insulating structure without a prior deposition of a diffusion barrier and adhesion layer. A thin insulating structure is disposed above the second insulating structure. A first configuration of the metal layer, the first insulating structure and the one or more etched silicon structures forms a free-space coupler. A second configuration of the thin insulating structure above the second insulating structure forms an edge coupler.
-
Patent Agency Ranking
公开(公告)号：US12222447B1
公开(公告)日：2025-02-11
申请号：US18516646
申请日：2023-11-21
Applicant: Aurora Operations, Inc.
Inventor： Ashish Bhardwaj , Sen Lin , Dong Liu , Xue Liu , Andrew Steil Michaels
Abstract: A light detection and ranging (LIDAR) system for a vehicle can include: a light source configured to output a beam; a photonics integrated circuit (PIC) including a semiconductor die, the semiconductor die comprising a substrate having two or more semiconductor devices formed on the substrate, the two or more semiconductor devices configured to receive the beam from the light source and modify the beam and at least one photonics die coupled to the semiconductor die, the at least one photonics die comprising at least a transmitter configured to receive the beam from the semiconductor die; and one or more optics configured to receive the beam from the transmitter and emit the beam towards an object in an environment of the vehicle.
-
公开(公告)号：US12210126B2
公开(公告)日：2025-01-28
申请号：US17113218
申请日：2020-12-07
Applicant: Aurora Operations, Inc.
Inventor： Sen Lin
IPC: G01S7/497 , G01S7/481 , G01S7/4913 , G01S7/4915
Abstract: A light detection and ranging system. The system includes a solid-state optical antenna array, a phase monitor array, a phase controller, a plurality of phase shifters and a global phase shifter. The phase monitor array is configured to output a first mixed signal associated with one of the optical antenna subarrays, and a second mixed signal associated with two of the optical antenna subarrays. The phase controller is configured to output a first phase coefficient based on the first mixed signal and a second phase coefficient based on the second mixed signal. One of the phase shifters is configured to apply the first phase coefficient to compensate for temperature variation within one of the optical antenna subarrays. The global phase shifter is configured to apply the second phase coefficient to compensate for temperature variation between two of the optical antenna subarrays.
-
公开(公告)号：US12210099B2
公开(公告)日：2025-01-28
申请号：US17054250
申请日：2019-05-10
Applicant: Aurora Operations, Inc.
Inventor： Phillip Sandborn , Sen Lin , James Ferrara
Abstract: A FMCW LIDAR system for simultaneous beam scanning of the target environment. The system can include a photonics assembly couplable to a beam steering module. The photonics assembly is configured to receive a frequency modulated laser beam and can include an optical splitter and a coherent receiver. The optical splitter can be configured to optically split the frequency modulated laser beam into a local laser beam and a target laser beam, deliver the target laser beam to the beam steering module, and receive the target laser beam reflected by a target from the beam steering module. The coherent receiver can be configured to mix the local laser beam and the target laser beam to produce an output signal.
-
公开(公告)号：US20230161105A1
公开(公告)日：2023-05-25
申请号：US18051337
申请日：2022-10-31
Applicant: Aurora Operations, Inc.
Inventor： Sen Lin , Andrew Steil Michaels
CPC classification number: G02B6/136 , G01S7/4816 , G02B2006/12107
Abstract: A structure of a silicon photonics device for LIDAR includes a first insulating structure and a second insulating structure disposed above one or more etched silicon structures overlying a substrate member. A metal layer is disposed above the first insulating structure without a prior deposition of a diffusion barrier and adhesion layer. A thin insulating structure is disposed above the second insulating structure. A first configuration of the metal layer, the first insulating structure and the one or more etched silicon structures forms a free-space coupler. A second configuration of the thin insulating structure above the second insulating structure forms an edge coupler.
-
公开(公告)号：US20230161006A1
公开(公告)日：2023-05-25
申请号：US17853674
申请日：2022-06-29
Applicant: Aurora Operations, Inc.
Inventor： Sen Lin , Andrew Steil Michaels
IPC: G01S7/481 , G01S17/931
CPC classification number: G01S7/4813 , G01S17/931
Abstract: A structure of a silicon photonics device for LIDAR includes a first insulating structure and a second insulating structure disposed above one or more etched silicon structures overlying a substrate member. A metal layer is disposed above the first insulating structure without a prior deposition of a diffusion barrier and adhesion layer. A thin insulating structure is disposed above the second insulating structure. A first configuration of the metal layer, the first insulating structure and the one or more etched silicon structures forms a free-space coupler. A second configuration of the thin insulating structure above the second insulating structure forms an edge coupler.
-
-
-
-
-
-
-
-
-
Search Results
34
records
(took 0.021 seconds)
