公开(公告)号：US20240393466A1

公开(公告)日：2024-11-28

申请号：US18191621

申请日：2023-03-28

Applicant: Aurora Operations, Inc.

Inventor： James Ferrara ,  Amir Hosseini ,  Sen Lin ,  Zhizhong Tang

IPC: G01S17/931 ,  B60W60/00 ,  G01S7/481

Abstract: A LIDAR system includes a substrate and an emitter coupled to the substrate and configured to emit a light beam along a first axis of the substrate. The LIDAR system includes an optic device coupled to the substrate and configured to split the light beam into a plurality of light beams. The LIDAR system includes an optical amplifier array coupled to the substrate and configured to amplify the plurality of light beams received from the optic device to generate a plurality of amplified light beams. The LIDAR system includes a transceiver coupled to the substrate and configured to redirect the plurality of amplified light beams from traveling along the first axis of the substrate to traveling along a second axis of the substrate that is different from the first axis.

公开(公告)号：US11860308B1

公开(公告)日：2024-01-02

申请号：US18056171

申请日：2022-11-16

Applicant: Aurora Operations, Inc.

Inventor： Colin Delaney ,  James Ferrara ,  Stefan Heinemann ,  Amir Hosseini ,  Pruthvi Jujjavarapu ,  Yongxuan Liang ,  Parth Panchal ,  Zhizhong Tang

IPC: G01S7/481 ,  G01S17/931 ,  H05K7/20

CPC classification number: G01S7/4814 ,  G01S7/4816 ,  G01S7/4817 ,  G01S17/931 ,  H05K7/20509

Abstract: An integrated chip packaging for a LIDAR sensor mounted to a vehicle includes a laser assembly configured to output a beam, an optical amplifier array chip configured to amplify a beam, and a transceiver chip coupled to the laser assembly and the optical amplifier array chip. The transceiver chip may be configured to emit the beam with reference to a first surface of the transceiver chip through an optical window and receive a reflected beam from a target through the optical window. The integrated chip packaging for the LIDAR sensor defines the configuration of optical components for providing a path for the optical signal to travel in and out of the LIDAR sensor and dissipating the heat generated by the optical components for improved performance.

公开(公告)号：US12210099B2

公开(公告)日：2025-01-28

申请号：US17054250

申请日：2019-05-10

Applicant: Aurora Operations, Inc.

Inventor： Phillip Sandborn ,  Sen Lin ,  James Ferrara

IPC: G01S17/34 ,  G01S7/481 ,  G01S7/491 ,  G01S17/58 ,  G01S17/95

Abstract: A FMCW LIDAR system for simultaneous beam scanning of the target environment. The system can include a photonics assembly couplable to a beam steering module. The photonics assembly is configured to receive a frequency modulated laser beam and can include an optical splitter and a coherent receiver. The optical splitter can be configured to optically split the frequency modulated laser beam into a local laser beam and a target laser beam, deliver the target laser beam to the beam steering module, and receive the target laser beam reflected by a target from the beam steering module. The coherent receiver can be configured to mix the local laser beam and the target laser beam to produce an output signal.

公开(公告)号：US20240159874A1

公开(公告)日：2024-05-16

申请号：US18517431

申请日：2023-11-22

Applicant: Aurora Operations, Inc.

Inventor： Colin Delaney ,  James Ferrara ,  Stefan Heinemann ,  Amir Hosseini ,  Pruthvi Jujjavarapu ,  Yongxuan Liang ,  Parth Panchal ,  Zhizhong Tang

IPC: G01S7/481 ,  G01S17/931 ,  H05K7/20

CPC classification number: G01S7/4814 ,  G01S7/4816 ,  G01S7/4817 ,  G01S17/931 ,  H05K7/20509

Abstract: An integrated chip packaging for a LIDAR sensor mounted to a vehicle includes a laser assembly configured to output a beam, an optical amplifier array chip configured to amplify a beam, and a transceiver chip coupled to the laser assembly and the optical amplifier array chip. The transceiver chip may be configured to emit the beam with reference to a first surface of the transceiver chip through an optical window and receive a reflected beam from a target through the optical window. The integrated chip packaging for the LIDAR sensor defines the configuration of optical components for providing a path for the optical signal to travel in and out of the LIDAR sensor and dissipating the heat generated by the optical components for improved performance.

公开(公告)号：US11953628B2

公开(公告)日：2024-04-09

申请号：US17943969

申请日：2022-09-13

Applicant: Aurora Operations, Inc.

Inventor： James Ferrara ,  Sen Lin

IPC: G01S7/481 ,  G01S7/4911 ,  G01S17/931 ,  G02B6/42 ,  G02F1/01

CPC classification number: G01S7/4818 ,  G01S7/4911 ,  G01S17/931 ,  G02B6/4269 ,  G02B6/4272 ,  G02B6/4273 ,  G02F1/0147

Abstract: A phase shifter includes a substrate layer, a cladding layer, and a waveguide. The phase shifter includes a waveguide and a heating element. The phase shifter includes a thermally conductive structure disposed on the cladding layer to disperse heat from the waveguide. The thermally conductive structure may include a metal strip disposed longitudinally along the beam, may include thermally conductive pads, and/or may include thermally conductive vias coupled between the cladding layer and the substrate layer. The phase shifter may be incorporated into light detection and ranging (LIDAR) devices, telecommunications devices, and/or computing devices.

公开(公告)号：US20250035869A1

公开(公告)日：2025-01-30

申请号：US18359127

申请日：2023-07-26

Applicant: Aurora Operations, Inc.

Inventor： James Ferrara ,  Stefan Heinemann ,  Pruthvi Jujjavarapu ,  Sen Lin ,  Zhizhong Tang

IPC: G02B6/42 ,  G01S17/931

Abstract: Manufacturing an integrated chip packaging for a LIDAR sensor mounted to a vehicle includes obtaining a metallic housing including a cutout on a side of the metallic housing, obtaining a ceramic radio frequency (RF) circuit board including a flange, coupling the flange of the ceramic RF circuit board to the cutout on the side of the metallic housing, applying a sealing material to an interface between the flange of the ceramic RF circuit board and the cutout on the side of the metallic housing, and locally heating the flange of the ceramic RF circuit board to bond the flange of the ceramic RF circuit board to the cutout on the side of the metallic housing thereby forming a seal at the interface.

公开(公告)号：US12199401B1

公开(公告)日：2025-01-14

申请号：US18511387

申请日：2023-11-16

Applicant: Aurora Operations, Inc.

Inventor： James Ferrara ,  Pruthvi Jujjavarapu ,  Sen Lin ,  Xue Liu ,  Andrew Steil Michaels ,  Parth Panchal ,  Zhizhong Tang

IPC: G01S17/88 ,  G02B6/122 ,  H01S5/00 ,  G02B6/12

Abstract: A LIDAR sensor system for a vehicle includes a silicon photonics substrate. The silicon photonics substrate includes: a semiconductor wafer; one or more surface features on a first surface of the semiconductor wafer; and a photoresist layer formed on the first surface of the semiconductor wafer, wherein the photoresist layer includes a laminated dry film. The silicon photonics substrate can be manufactured by obtaining a semiconductor wafer having one or more surface features; applying a dry film photoresist layer to a first surface of the semiconductor wafer; performing an adhesion bake process on the semiconductor wafer; developing the dry film photoresist layer to produce one or more developed regions in the dry film photoresist layer; and forming one or more solder bumps in the one or more developed regions.