公开(公告)号：US12222447B1

公开(公告)日：2025-02-11

申请号：US18516646

申请日：2023-11-21

Applicant: Aurora Operations, Inc.

Inventor： Ashish Bhardwaj ,  Sen Lin ,  Dong Liu ,  Xue Liu ,  Andrew Steil Michaels

IPC: G01S7/00 ,  G01S7/481 ,  G01S17/42 ,  G01S17/89

Abstract: A light detection and ranging (LIDAR) system for a vehicle can include: a light source configured to output a beam; a photonics integrated circuit (PIC) including a semiconductor die, the semiconductor die comprising a substrate having two or more semiconductor devices formed on the substrate, the two or more semiconductor devices configured to receive the beam from the light source and modify the beam and at least one photonics die coupled to the semiconductor die, the at least one photonics die comprising at least a transmitter configured to receive the beam from the semiconductor die; and one or more optics configured to receive the beam from the transmitter and emit the beam towards an object in an environment of the vehicle.

公开(公告)号：US12222448B1

公开(公告)日：2025-02-11

申请号：US18516671

申请日：2023-11-21

Applicant: Aurora Operations, Inc.

Inventor： Ashish Bhardwaj ,  Sen Lin ,  Dong Liu ,  Xue Liu ,  Andrew Steil Michaels

IPC: G01S7/481 ,  G01S17/931 ,  H01L31/0352

Abstract: A light detection and ranging (LIDAR) sensor system for a vehicle can include: a light source configured to output a beam; a photonics integrated circuit (PIC) including a semiconductor die, the semiconductor die including a substrate having two or more semiconductor stacks respectively associated with two or more semiconductor devices formed on the substrate, the two or more semiconductor devices respectively configured to receive the beam from the light source and modify one or more features of the beam; a transmitter configured to receive the beam from the semiconductor die; and one or more optics configured to receive the beam from the transmitter and emit the beam towards an object.

公开(公告)号：US12199401B1

公开(公告)日：2025-01-14

申请号：US18511387

申请日：2023-11-16

Applicant: Aurora Operations, Inc.

Inventor： James Ferrara ,  Pruthvi Jujjavarapu ,  Sen Lin ,  Xue Liu ,  Andrew Steil Michaels ,  Parth Panchal ,  Zhizhong Tang

IPC: G01S17/88 ,  G02B6/122 ,  H01S5/00 ,  G02B6/12

Abstract: A LIDAR sensor system for a vehicle includes a silicon photonics substrate. The silicon photonics substrate includes: a semiconductor wafer; one or more surface features on a first surface of the semiconductor wafer; and a photoresist layer formed on the first surface of the semiconductor wafer, wherein the photoresist layer includes a laminated dry film. The silicon photonics substrate can be manufactured by obtaining a semiconductor wafer having one or more surface features; applying a dry film photoresist layer to a first surface of the semiconductor wafer; performing an adhesion bake process on the semiconductor wafer; developing the dry film photoresist layer to produce one or more developed regions in the dry film photoresist layer; and forming one or more solder bumps in the one or more developed regions.