公开(公告)号：US12199132B1

公开(公告)日：2025-01-14

申请号：US18658422

申请日：2024-05-08

Applicant: Aurora Operations, Inc.

Inventor： Lei Wang

IPC: H01L27/146 ,  H01L21/306 ,  H01L21/3065 ,  H01L21/3105 ,  H01L21/78 ,  G01S7/481 ,  G01S17/931

Abstract: A method for manufacturing a semiconductor optical device for a LIDAR sensor system for a vehicle includes (a) forming a plurality of microlens structures at respective first locations on a first major surface of respective first and second semiconductor wafers. The method includes (b) forming a plurality of notch structures at respective second locations on a second major surface of the respective first and second semiconductor wafers, wherein the respective second locations on the second major surface are substantially opposite the respective first locations on the first major surface. The method includes (c) bonding the second major surface of the first semiconductor wafer to the second major surface of the second semiconductor wafer to form a semiconductor wafer pair. The method includes (d) dicing the semiconductor wafer pair to segment the semiconductor wafer pair into a plurality of individual semiconductor optical devices.

公开(公告)号：US12210121B1

公开(公告)日：2025-01-28

申请号：US18641011

申请日：2024-04-19

Applicant: Aurora Operations, Inc.

Inventor： Sen Lin ,  Lei Wang

IPC: G01C3/08 ,  G01S7/481 ,  G01S17/931

Abstract: A light detection and ranging (LIDAR) system for a vehicle can include: a light source configured to output a transmit beam at a first orientation; a reflective surface configured to redirect the transmit beam from the first orientation to a second orientation; and a lens interface configured to receive the transmit beam at the first orientation and focus the transmit beam onto the reflective surface; wherein the LIDAR system emits the transmit beam at the second orientation into an environment of the LIDAR system.

公开(公告)号：US20250035752A1

公开(公告)日：2025-01-30

申请号：US18794534

申请日：2024-08-05

Applicant: Aurora Operations, Inc.

Inventor： Lei Wang ,  Sen Lin ,  Andrew Steil Michaels

IPC: G01S7/481 ,  H01S5/02253

Abstract: A light detection and ranging (LIDAR) device includes a first wafer layer, a laser assembly disposed on the first wafer layer, a capping layer, a second wafer layer, and a photonic integrated circuit (PIC). The capping layer is coupled to the first wafer layer and configured to seal the laser assembly. The second wafer layer is at least partially coupled to the first wafer layer. The PIC is formed on the second wafer layer. The second wafer includes an exit feature configured to outcouple laser light from the laser assembly.

公开(公告)号：US12085674B2

公开(公告)日：2024-09-10

申请号：US17824820

申请日：2022-05-25

Applicant: Aurora Operations, Inc.

Inventor： Lei Wang ,  Sen Lin ,  Andrew Steil Michaels

IPC: G01C3/08 ,  G01S7/481 ,  H01S5/02253

CPC classification number: G01S7/4814 ,  H01S5/02253

Abstract: A light detection and ranging (LIDAR) device includes a first wafer layer, a laser assembly disposed on the first wafer layer, a capping layer, a second wafer layer, and a photonic integrated circuit (PIC). The capping layer is coupled to the first wafer layer and configured to seal the laser assembly. The second wafer layer is at least partially coupled to the first wafer layer. The PIC is formed on the second wafer layer. The second wafer includes an exit feature configured to outcouple laser light from the laser assembly.

公开(公告)号：US12222451B2

公开(公告)日：2025-02-11

申请号：US18184260

申请日：2023-03-15

Applicant: Aurora Operations, Inc.

Inventor： Sen Lin ,  Lei Wang

IPC: G01S7/481 ,  F21V8/00 ,  G01S17/86 ,  G01S17/931 ,  G02B6/02 ,  G02F1/01

Abstract: A light detection and ranging (LIDAR) device includes a substrate layer, a cladding layer, a waveguide, and an ohmic element. The cladding layer is disposed with the substrate layer. The waveguide runs through the cladding layer. The ohmic element runs through the cladding layer. The ohmic element is arranged to impart heat to the waveguide when an electrical current is driven through the ohmic element.

公开(公告)号：US12199411B2

公开(公告)日：2025-01-14

申请号：US18486208

申请日：2023-10-13

Applicant: Aurora Operations, Inc.

Inventor： Andrew Steil Michaels ,  Lei Wang ,  Sen Lin

IPC: H01S5/40 ,  B60R16/02 ,  G01S7/481 ,  G01S17/08 ,  G01S17/32 ,  G02B6/12 ,  G02B6/42 ,  H01S3/08 ,  H01S5/026

Abstract: A photonic integrated circuit (PIC) assembly comprising a semiconductor optical amplifier (SOA) array and a U-turn chip. The SOA array includes an input SOA and a plurality of SOAs. The input SOA and the plurality of SOAs are arranged parallel to one another. The U-turn chip includes an optical splitter and a waveguide assembly. The optical splitter is configured to receive amplified input light propagating in a first direction from the input SOA, and divide the amplified light into beams. The waveguide assembly guides the beams to a corresponding SOA of the plurality of SOAs, and adjusts a direction of prorogation of each of the guided beams to be substantially parallel to a second direction that is substantially opposite the first direction.