公开(公告)号：US20240404803A1

公开(公告)日：2024-12-05

申请号：US18647819

申请日：2024-04-26

Applicant: Applied Materials, Inc.

Inventor： Yoon Ah SHIN ,  Jiajie CEN ,  Zhiyuan WU ,  Bencherki MEBARKI ,  Kevin KASHEFI ,  Joung Joo LEE ,  Xianmin TANG

IPC: H01J37/32

Abstract: Embodiments of the present disclosure generally relate to a low temperature non-plasma containing preclean process to selectively remove contaminants from the surface of a substrate, such as halogen containing and/or metal oxide containing contaminants. The non-plasma containing precleaning process is performed at a low temperature by use of a microwave source that is configured to provide microwave energy to the processing gases disposed within a processing chamber. The non-plasma low temperature preclean process is effective in reducing halogen containing residues, such as fluorine and chlorine containing residues formed on a surface of a substrate.