公开(公告)号：US11810766B2

公开(公告)日：2023-11-07

申请号：US16401871

申请日：2019-05-02

申请人： Applied Materials, Inc.

发明人： Karthikeyan Balaraman ,  Sathyanarayana Bindiganavale ,  Rajasekhar Patibandla ,  Balamurugan Ramasamy ,  Kartik Shah ,  Umesh M. Kelkar ,  Mats Larsson ,  Kevin A. Papke ,  William M. Lu

IPC分类号： H01J37/32 ,  H01L21/687 ,  C23C16/34 ,  C23C14/06 ,  C23C16/06 ,  C23C14/16

CPC分类号： H01J37/32477 ,  C23C14/0641 ,  C23C14/16 ,  C23C16/06 ,  C23C16/34 ,  H01L21/68757

摘要： Embodiments of the present disclosure are directed towards a protective multilayer coating for process chamber components exposed to temperatures from about 20° C. to about 300° C. during use of the process chamber. The protective multilayer coating comprises a bond layer and a top layer, the bond layer is formed on a chamber component to reduce the stress between the top layer and the chamber component. The reduced stress decreases or prevents particle shedding from the top layer of the multilayer coating during and after use of the process chamber. The bond layer comprises titanium, titanium nitride, aluminum, or combinations thereof, and the top layer comprises tungsten nitride.

公开(公告)号：US11072852B2

公开(公告)日：2021-07-27

申请号：US16456769

申请日：2019-06-28

申请人： Applied Materials, Inc.

发明人： Brian T. West ,  Lizhong Sun ,  William M. Lu

IPC分类号： H01J37/34 ,  C23C14/35 ,  C23C14/50 ,  C23C14/04 ,  H01J37/20 ,  H01J37/32 ,  C23C14/34

摘要： Embodiments of the disclosure generally relate to a process kit including a shield serving as an anode in a physical deposition chamber. The shield has a cylindrical band, the cylindrical band having a top and a bottom, the cylindrical band sized to encircle a sputtering surface of a sputtering target disposed adjacent the top and a substrate support disposed at the bottom, the cylindrical band having an interior surface. A texture is disposed on the interior surface. The texture has a plurality of features. A film is provided on a portion of the features. The film includes a porosity of about 2% to about 3.5%.