公开(公告)号：US11591689B2

公开(公告)日：2023-02-28

申请号：US16791264

申请日：2020-02-14

Applicant: Applied Materials, Inc.

Inventor： Mats Larsson ,  Kevin A. Papke ,  Chirag Shaileshbhai Khairnar ,  Rajasekhar Patibandla ,  Karthikeyan Balaraman ,  Balamurugan Ramasamy ,  Kartik Shah ,  Umesh M. Kelkar

IPC: C23C16/02 ,  C23C16/40 ,  C23C16/56 ,  C23C16/513 ,  C23C16/44 ,  C04B35/18 ,  C04B35/44 ,  C04B35/10 ,  C04B35/20 ,  C04B35/505 ,  C04B35/14 ,  C04B35/04 ,  C04B35/16 ,  C04B35/01 ,  C04B35/195

Abstract: One embodiment of the disclosure provides a method of fabricating a chamber component with a coating layer disposed on an interface layer with desired film properties. In one embodiment, a method of fabricating a coating material includes providing a base structure comprising an aluminum or silicon containing material, forming an interface layer on the base structure, wherein the interface layer comprises one or more elements from at least one of Ta, Al, Si, Mg, Y, or combinations thereof, and forming a coating layer on the interface layer, wherein the coating layer has a molecular structure of SivYwMgxAlyOz. In another embodiment, a chamber component includes an interface layer disposed on a base structure, wherein the interface layer is selected from at least one of Ta, Al, Si, Mg, Y, or combinations thereof, and a coating layer disposed on the interface layer, wherein the coating layer has a molecular structure of SivYwMgxAlyOz.

公开(公告)号：US12170186B2

公开(公告)日：2024-12-17

申请号：US17721417

申请日：2022-04-15

Applicant: Applied Materials, Inc.

Inventor： Anantha K. Subramani ,  Seyyed Abdolreza Fazeli ,  Yang Guo ,  Chandrashekara Baginagere ,  Ramcharan Sundar ,  Yunho Kim ,  Rajasekhar Patibandla

IPC: H01J37/32 ,  C23C16/455 ,  C23C16/505

Abstract: Methods and apparatus for substrate processing are described. In some embodiments a showerhead assembly includes a heated showerhead having a heater and a gas diffusion plate coupled to the heater, the gas diffusion plate having a plurality of channels extending through the gas diffusion plate; an ion filter spaced from the heated showerhead, the ion filter having a first side facing the heated showerhead and a second side opposite the first side, the ion filter having a plurality of channels extending through the ion filter; a heat transfer ring in contact between the heated showerhead and the ion filter, the heat transfer ring being thermally conductive and electrically insulative, the heat transfer ring comprised of a plurality of elements spaced from one another along an interface between the heated showerhead and the ion filter; and a remote plasma region defined between the heated showerhead and the ion filter.

公开(公告)号：US11239058B2

公开(公告)日：2022-02-01

申请号：US16412109

申请日：2019-05-14

Applicant: Applied Materials, Inc.

Inventor： Karthikeyan Balaraman ,  Balamurugan Ramasamy ,  Kartik Shah ,  Mats Larsson ,  Kevin A. Papke ,  Rajasekhar Patibandla ,  Sathyanarayana Bindiganavale ,  Umesh M. Kelkar

IPC: H01L21/285 ,  H01L21/768 ,  H01L21/02 ,  H01J37/32 ,  C23C28/04

Abstract: Embodiments of the present disclosure provide protective coatings, i.e., diffusion and thermal barrier coatings, for aluminum alloy substrates. In particular, embodiments described herein provide a protective layer stack comprising a tantalum nitride layer disposed on an aluminum alloy substrate and a ceramic layer disposed on the tantalum nitride layer. In some embodiments, the aluminum alloy substrates comprise processing chambers and processing chamber components used in the field of electronic device manufacturing, e.g., semiconductor device manufacturing. In one embodiment, an article includes a substrate, a tantalum nitride layer disposed on the substrate, and a ceramic layer disposed on the tantalum nitride layer.

公开(公告)号：US11810766B2

公开(公告)日：2023-11-07

申请号：US16401871

申请日：2019-05-02

Applicant: Applied Materials, Inc.

Inventor： Karthikeyan Balaraman ,  Sathyanarayana Bindiganavale ,  Rajasekhar Patibandla ,  Balamurugan Ramasamy ,  Kartik Shah ,  Umesh M. Kelkar ,  Mats Larsson ,  Kevin A. Papke ,  William M. Lu

IPC: H01J37/32 ,  H01L21/687 ,  C23C16/34 ,  C23C14/06 ,  C23C16/06 ,  C23C14/16

CPC classification number: H01J37/32477 ,  C23C14/0641 ,  C23C14/16 ,  C23C16/06 ,  C23C16/34 ,  H01L21/68757

Abstract: Embodiments of the present disclosure are directed towards a protective multilayer coating for process chamber components exposed to temperatures from about 20° C. to about 300° C. during use of the process chamber. The protective multilayer coating comprises a bond layer and a top layer, the bond layer is formed on a chamber component to reduce the stress between the top layer and the chamber component. The reduced stress decreases or prevents particle shedding from the top layer of the multilayer coating during and after use of the process chamber. The bond layer comprises titanium, titanium nitride, aluminum, or combinations thereof, and the top layer comprises tungsten nitride.