公开(公告)号：US09888528B2

公开(公告)日：2018-02-06

申请号：US14634711

申请日：2015-02-27

Applicant: APPLIED MATERIALS, INC.

Inventor： Tomoharu Matsushita ,  Jallepally Ravi ,  Cheng-Hsiung Tsai ,  Aravind Kamath ,  Xiaoxiong Yuan ,  Manjunatha Koppa

IPC: H05B3/26 ,  H01L21/67

CPC classification number: H05B3/26 ,  H01L21/67103 ,  H05B2203/037

Abstract: Embodiments of substrate supports are provided herein. In some embodiments, a substrate support may include a body having a support surface; and a first heater disposed within the body and having a first heating coil and multiple heating zones, wherein a pitch of windings of the first heating coil vary among each of the multiple heating zones to define a predetermined heating ratio between the multiple heating zones.

公开(公告)号：US11031273B2

公开(公告)日：2021-06-08

申请号：US16213816

申请日：2018-12-07

Applicant: APPLIED MATERIALS, INC.

Inventor： Bonnie T Chia ,  Ross Marshall ,  Tomoharu Matsushita ,  Cheng-Hsiung Tsai

IPC: H01L21/683 ,  H01L21/67 ,  F24F3/00 ,  H02N13/00

Abstract: Embodiments of an electrostatic chuck are provided herein. In some embodiments an electrostatic chuck includes an electrode, a dielectric body having a disk shape and covering the electrode, the dielectric body including a central region and a peripheral region, and the dielectric body including a lower surface having a central opening and an upper surface having a first opening in the central region and a plurality of second openings in the peripheral region, wherein the upper surface includes a plurality of protrusions and a diameter of each of the plurality of second openings is greater than 25.0 mils, and gas distribution channels that extend from the lower surface to the upper surface to define a plenum within the dielectric body.

公开(公告)号：US12228395B2

公开(公告)日：2025-02-18

申请号：US17530538

申请日：2021-11-19

Applicant: Applied Materials, Inc.

Inventor： Tomoharu Matsushita ,  Aravind Kamath ,  Jallepally Ravi ,  Cheng-Hsiung Tsai ,  Hiroyuki Takahama

IPC: G01B5/004 ,  H01L21/68 ,  H01L21/683 ,  B25J11/00

Abstract: Methods and apparatus for substrate position calibration for substrate supports in substrate processing systems are provided herein. In some embodiments, a method for positioning a substrate on a substrate support includes: obtaining a plurality of backside pressure values corresponding to a plurality of different substrate positions on a substrate support by repeatedly placing a substrate in a position on the substrate support, and vacuum chucking the substrate to the substrate support and measuring a backside pressure; and analyzing the plurality of backside pressure values to determine a calibrated substrate position.

公开(公告)号：US11201078B2

公开(公告)日：2021-12-14

申请号：US15468509

申请日：2017-03-24

Applicant: APPLIED MATERIALS, INC.

Inventor： Tomoharu Matsushita ,  Aravind Kamath ,  Jallepally Ravi ,  Cheng-Hsiung Tsai ,  Hiroyuki Takahama

IPC: H01L21/683 ,  G01L21/02 ,  H01L21/67

Abstract: Methods and apparatus for substrate position calibration for substrate supports in substrate processing systems are provided herein. In some embodiments, a method for positioning a substrate on a substrate support includes: obtaining a plurality of backside pressure values corresponding to a plurality of different substrate positions on a substrate support by repeatedly placing a substrate in a position on the substrate support, and vacuum chucking the substrate to the substrate support and measuring a backside pressure; and analyzing the plurality of backside pressure values to determine a calibrated substrate position.

公开(公告)号：US10134615B2

公开(公告)日：2018-11-20

申请号：US15019573

申请日：2016-02-09

Applicant: APPLIED MATERIALS, INC.

Inventor： Aravind Miyar Kamath ,  Cheng-Hsiung Tsai ,  Jallepally Ravi ,  Tomoharu Matsushita ,  Yu Chang

IPC: H01L21/687 ,  H01L21/67 ,  H01J37/32

Abstract: Apparatus for processing a substrate are provided herein. In some embodiments, a substrate support includes a body having a support surface; an RF electrode disposed in the body proximate the support surface to receive RF current from an RF source; a shaft to support the body; a conductive element having an interior volume and extending through the shaft, wherein the conductive element is coupled to the RF electrode; and an RF gasket; wherein the conductive element includes features that engage the RF gasket to return the RF current to ground.