专利检索 ap:("APPLIED MATERIALS, INC.") AND inv:"Bonnie T Chia" 第 1 页

1.

发明授权
Physical vapor deposition (PVD) electrostatic chuck with improved thermal coupling for temperature sensitive processes 有权

公开(公告)号：US11031273B2

公开(公告)日：2021-06-08

申请号：US16213816

申请日：2018-12-07

申请人： APPLIED MATERIALS, INC.

发明人： Bonnie T Chia , Ross Marshall , Tomoharu Matsushita , Cheng-Hsiung Tsai

IPC分类号： H01L21/683 , H01L21/67 , F24F3/00 , H02N13/00

摘要： Embodiments of an electrostatic chuck are provided herein. In some embodiments an electrostatic chuck includes an electrode, a dielectric body having a disk shape and covering the electrode, the dielectric body including a central region and a peripheral region, and the dielectric body including a lower surface having a central opening and an upper surface having a first opening in the central region and a plurality of second openings in the peripheral region, wherein the upper surface includes a plurality of protrusions and a diameter of each of the plurality of second openings is greater than 25.0 mils, and gas distribution channels that extend from the lower surface to the upper surface to define a plenum within the dielectric body.