公开(公告)号：US20210071017A1

公开(公告)日：2021-03-11

申请号：US16681700

申请日：2019-11-12

Applicant: Applied Materials, Inc.

Inventor： Atul Bhaskar Chaudhari ,  Sivapackia Ganapathiappan ,  Srobona Sen

IPC: C09D11/102 ,  B24B37/24 ,  C08G18/10 ,  C08G18/42 ,  C08G18/67 ,  C08G18/24 ,  C09D11/30 ,  B33Y70/00

Abstract: A system, formulation, and method for additive manufacturing of a polishing layer of a polishing pad. The formulation includes a urethane acrylate oligomer based on a difunctional polyol or difunctional polythiol. The techniques includes selecting the difunctional polyol or the difunctional polythiol to affect a property of the polishing layer. The formulation also includes a monomer and a photoinitiator. The viscosity of the formulation is applicable for 3D printing of the polishing layer.

公开(公告)号：US12297367B2

公开(公告)日：2025-05-13

申请号：US17004114

申请日：2020-08-27

Applicant: Applied Materials, Inc.

Inventor： Srobona Sen ,  Tapashree Roy ,  Prerna Sonthalia Goradia ,  Robert Jan Visser

IPC: C09D127/18 ,  C09D183/08

Abstract: Embodiments described herein relate to flat optical devices and encapsulation materials for flat optical devices. One or more embodiments include a substrate having a first arrangement of a first plurality of pillars formed thereon. The first arrangement of the first plurality of pillars includes pillars having a height h and a lateral distance d. The first arrangement of the first plurality of pillars includes a gap g corresponding to a distance between adjacent pillars of the first plurality of pillars. An aspect ratio of the gap g to the height h is between about 1:1 and about 1:20. A first adhesion-promoting material is disposed over the first arrangement of the first plurality of pillars. A first encapsulation layer is disposed over the first adhesion-promoting material. The first encapsulation layer fills the gap g between adjacent pillars of the first plurality of pillars. The first encapsulation layer includes a fluoropolymer.

公开(公告)号：US12216243B2

公开(公告)日：2025-02-04

申请号：US16905703

申请日：2020-06-18

Applicant: Applied Materials, Inc.

Inventor： Ludovic Godet ,  Tapashree Roy ,  Prerna Sonthalia Goradia ,  Srobona Sen ,  Robert Jan Visser ,  Nitin Deepak ,  Tapash Chakraborty

IPC: G02F1/1339 ,  B32B3/20 ,  G02B1/06

Abstract: Embodiments described herein relate to flat optical devices and methods of forming flat optical devices. One embodiment includes a substrate having a first arrangement of a first plurality of pillars formed thereon. The first arrangement of the first plurality of pillars includes pillars having a height h and a lateral distance d, and a gap g corresponding to a distance between adjacent pillars of the first plurality of pillars. An aspect ratio of the gap g to the height h is between about 1:1 and about 1:20. A first encapsulation layer is disposed over the first arrangement of the first plurality of pillars. The first encapsulation layer has a refractive index of about 1.0 to about 1.5. The first encapsulation layer, the substrate, and each of the pillars of the first arrangement define a first space therebetween. The first space has a refractive index of about 1.0 to about 1.5.

公开(公告)号：US12006442B2

公开(公告)日：2024-06-11

申请号：US16681700

申请日：2019-11-12

Applicant: Applied Materials, Inc.

Inventor： Atul Bhaskar Chaudhari ,  Sivapackia Ganapathiappan ,  Srobona Sen

IPC: B33Y70/00 ,  B24B37/24 ,  C08G18/10 ,  C08G18/24 ,  C08G18/42 ,  C08G18/67 ,  C09D11/102 ,  C09D11/30

CPC classification number: C09D11/102 ,  B24B37/24 ,  B33Y70/00 ,  C08G18/10 ,  C08G18/246 ,  C08G18/4238 ,  C08G18/6755 ,  C09D11/30

Abstract: A system, formulation, and method for additive manufacturing of a polishing layer of a polishing pad. The formulation includes a urethane acrylate oligomer based on a difunctional polyol or difunctional polythiol. The techniques includes selecting the difunctional polyol or the difunctional polythiol to affect a property of the polishing layer. The formulation also includes a monomer and a photoinitiator. The viscosity of the formulation is applicable for 3D printing of the polishing layer.

公开(公告)号：US20210069860A1

公开(公告)日：2021-03-11

申请号：US16681714

申请日：2019-11-12

Applicant: Applied Materials, Inc.

Inventor： Atul Bhaskar Chaudhari ,  Sivapackia Ganapathiappan ,  Srobona Sen

IPC: B24B53/017 ,  B24D3/00 ,  C08L75/06

Abstract: A system, formulation, and method for additive manufacturing of a polishing layer of a polishing pad. The formulation includes a urethane acrylate oligomer based on a difunctional polyol or difunctional polythiol. The techniques includes selecting the difunctional polyol or the difunctional polythiol to affect a property of the polishing layer. The formulation also includes a monomer and a photoinitiator. The viscosity of the formulation is applicable for 3D printing of the polishing layer.