公开(公告)号：US20220122876A1

公开(公告)日：2022-04-21

申请号：US17423689

申请日：2020-01-17

Applicant: Applied Materials, Inc.

Inventor： Jrjyan Jerry CHEN ,  Sanjay D. YADAV ,  Tae Kyung WON ,  Jun LI ,  Shouqian SHAO ,  Surendra Kanimihally SETTY

IPC: H01L21/683 ,  H01L21/687 ,  H01J37/32 ,  C23C16/50 ,  C23C16/458 ,  C23C16/04

Abstract: Embodiments of the disclosure include methods and apparatus for electrostatically coupling a mask to a substrate support in a deposition chamber. In one embodiment, a substrate support is disclosed that includes a substrate receiving surface, a recessed portion disposed about a periphery of the substrate receiving surface, an electrostatic chuck disposed below the substrate receiving surface, and a plurality of compressible buttons disposed within a respective opening formed in the recessed portion that form an electrical circuit with the electrostatic chuck.

公开(公告)号：US20190382891A1

公开(公告)日：2019-12-19

申请号：US16011381

申请日：2018-06-18

Applicant: Applied Materials, Inc.

Inventor： Shouqian SHAO ,  Jianhua ZHOU ,  Fu-Ting CHANG ,  Yi CUI ,  Jun LI

IPC: C23C16/458 ,  C23C16/455 ,  H01J37/32

Abstract: Embodiments described herein provide an apparatus for providing an inductance at positions that correspond to positions of substrate support pins. The apparatus includes one or more substrate support pins. Each substrate support pin includes a head portion, a first portion, and a second portion. The second portion is an inductor that provides inductance at positions of substrate support pins. The inductance provided by the second portion of the substrate support pin changes the impedance to match the impedance at areas of the substrate support without the substrate support pins. With matched impedance, the plasma density over the areas of the substrate support with the support pins and without the support pins is uniform, leading to improved film thickness uniformity. The uniform film thickness thus reduces or eliminates clouding or the “mura effect”.