Substrate processing apparatus including top reflector above annular lamp assembly

    公开(公告)号:US10978276B2

    公开(公告)日:2021-04-13

    申请号:US16749631

    申请日:2020-01-22

    Abstract: Embodiments of a method and apparatus for annealing a substrate are disclosed herein. In some embodiments, a substrate anneal chamber includes a chamber body having a chamber wall and an interior volume; a lamp assembly disposed in the interior volume and having a plurality of lamps configured to heat a substrate; a slit valve disposed through a wall of the chamber body and above the lamp assembly to allow the substrate to pass into and out of the interior volume; an annular lamp assembly having at least one lamp disposed in a processing volume in an upper portion of the substrate anneal chamber above the slit valve; and a top reflector disposed above the annular lamp assembly to define an upper portion of the processing volume and to reflect radiation downwards towards the lamp assembly, wherein a bottom surface of the top reflector is exposed to the interior volume.

    Substrate processing chamber having improved process volume sealing

    公开(公告)号:US10998172B2

    公开(公告)日:2021-05-04

    申请号:US16132962

    申请日:2018-09-17

    Abstract: Embodiments of process chambers are provided herein. In some embodiments, a process chamber includes: a chamber wall defining an inner volume within the process chamber; a substrate support disposed in the inner volume having a support surface to support a substrate, wherein the inner volume includes a processing volume disposed above the support surface and a non-processing volume disposed at least partially below the support surface; a gas supply plenum fluidly coupled to the processing volume via a gas supply channel disposed above the support surface; a pumping plenum fluidly coupled to the processing volume via an exhaust channel disposed above the support surface; and a sealing apparatus configured to fluidly isolate the processing volume from the non-processing volume when the substrate support is in a processing position, wherein the processing volume and the non-processing volume are fluidly coupled when the substrate support is in a non-processing position.

    Substrate processing apparatus including annular lamp assembly

    公开(公告)号:US10573498B2

    公开(公告)日:2020-02-25

    申请号:US15402142

    申请日:2017-01-09

    Abstract: Embodiments of a method and apparatus for annealing a substrate are disclosed herein. In some embodiments, a substrate support includes a substrate support pedestal having an upper surface to support a substrate and an opposing bottom surface, wherein the substrate support pedestal is formed of a material that is transparent to radiation; a lamp assembly disposed below the substrate support pedestal and having a plurality of lamps configured to heat the substrate; a pedestal support extending through the lamp assembly to support the substrate support pedestal in a spaced apart relation to the plurality of lamps; a shaft coupled to a second end of the pedestal support opposite the first end; and a rotation assembly coupled to the shaft opposite the pedestal support to rotate the shaft, the pedestal support, and the substrate support pedestal with respect to the lamp assembly.

    ON-END EFFECTOR MAGNETIC WAFER CARRIER ALIGNMENT
    7.
    发明申请
    ON-END EFFECTOR MAGNETIC WAFER CARRIER ALIGNMENT 审中-公开
    端接效应器磁性载波对准

    公开(公告)号:US20150332950A1

    公开(公告)日:2015-11-19

    申请号:US14280519

    申请日:2014-05-16

    Abstract: Embodiments include methods and apparatuses for transferring and aligning a carrier ring. In an embodiment, a method includes lifting the carrier ring from a first location with a robot arm that includes an end effector wrist and an end effector. Front dowel pins and rear dowel pins are coupled to the end effector. In an embodiment, the end effector wrist includes a plunger that has a gripping device. Embodiments include securing the plunger to the carrier ring with the gripping device and extending the plunger out from the end effector wrist until the carrier ring contacts the front dowel pins. Thereafter, the carrier ring is transferred from the first location to the second location. The plunger and the carrier ring are then retracted until the rear dowel pins engage an alignment notch and an alignment flat on the carrier ring.

    Abstract translation: 实施例包括用于传送和对准载体环的方法和装置。 在一个实施例中,一种方法包括用包括末端执行器腕部和末端执行器的机器人手臂从第一位置提升载体环。 前销销和后销销连接到末端执行器。 在一个实施例中,末端执行器腕部包括具有夹紧装置的柱塞。 实施例包括用夹持装置将柱塞固定到承载环上,并将柱塞从端部执行器手腕伸出,直到载体环接触前销钉。 此后,载波环从第一位置传送到第二位置。 柱塞和承载环然后缩回,直到后销定位销与载体环上的对准槽口和对准平面接合。

    WAFER CARRIER-RING LOADER FOR STANDARD SEMICONDUCTOR FACTORY INTERFACE
    8.
    发明申请
    WAFER CARRIER-RING LOADER FOR STANDARD SEMICONDUCTOR FACTORY INTERFACE 审中-公开
    用于标准半导体工厂接口的波形承载环加载器

    公开(公告)号:US20150314971A1

    公开(公告)日:2015-11-05

    申请号:US14268776

    申请日:2014-05-02

    Inventor: John Mazzocco

    CPC classification number: H01L21/67778 B65G65/00

    Abstract: Embodiments of the invention include methods and apparatuses for transferring a workpiece from a workpiece carrier to a system load rack. The system load rack includes slots for holding workpieces that are spaced apart from each other by a pitch that is greater than the pitch of slots in the workpiece carrier. The increased pitch of the system load rack enables a factory interface to accommodate non-standard workpieces. A method for transferring the workpieces includes contacting the workpiece in a workpiece carrier with an end-effector. Thereafter, the workpiece is removed from the workpiece carrier with the end-effector. The end-effector inserts the workpiece into a system load rack. After removing the end-effector from the system load rack, the system may be indexed to prepare for transferring a subsequent workpiece.

    Abstract translation: 本发明的实施例包括用于将工件从工件载体传送到系统负载架的方法和装置。 系统装载架包括用于保持彼此间隔开大于工件载体中的槽的间距的间距的工件的槽。 系统负载架的间距增加可使出厂界面适应非标准工件。 用于传送工件的方法包括使工件载体上的工件与端部执行器接触。 此后,通过端部执行器将工件从工件载体上移除。 末端执行器将工件插入系统负载架。 在从系统负载架上卸下末端执行器之后,系统可以进行索引,以准备传送随后的工件。

    Presence sensing and position correction for wafer on a carrier ring
    9.
    发明授权
    Presence sensing and position correction for wafer on a carrier ring 有权
    载体环上的晶片的存在感测和位置校正

    公开(公告)号:US09026244B1

    公开(公告)日:2015-05-05

    申请号:US14285560

    申请日:2014-05-22

    Abstract: Embodiments of the invention include apparatuses and systems for determining the position of a carrier ring assembly supported by an end effector. In an embodiment, the position of the carrier ring assembly is determined by passing the carrier ring assembly through a plurality of through beam sensors. As the carrier ring passes through the sensors, a plurality of sensor transitions along points on the carrier ring assembly are detected. Each sensor transition indicates that one of the through beam sensors changed from an unblocked state to a blocked state, or changed from an blocked state to an unblocked state. The position of the end effector is recorded at each sensor transition and is associated with the sensor transition that caused the end effector position to be recorded. A position of the carrier ring assembly is then calculated from the plurality of sensor transitions and their associated end effector positions.

    Abstract translation: 本发明的实施例包括用于确定由端部执行器支撑的载体环组件的位置的装置和系统。 在一个实施例中,通过使承载环组件穿过多个通过梁传感器来确定承载环组件的位置。 当载体环通过传感器时,检测到沿着载体环组件上的点的多个传感器转变。 每个传感器转换指示一个通过光束传感器从未阻塞状态改变到阻塞状态,或从阻塞状态改变为未阻塞状态。 在每个传感器转换处记录末端执行器的位置,并且与导致末端执行器位置被记录的传感器转换相关联。 然后从多个传感器转变及其相关联的末端执行器位置计算载体环组件的位置。

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