MULTILAYER METASURFACE ARCHITECTURES WITH IMPEDANCE MATCHING

    公开(公告)号:US20230121211A1

    公开(公告)日:2023-04-20

    申请号:US17955185

    申请日:2022-09-28

    Abstract: Embodiments of the present disclosure generally relate to metasurface devices and methods of forming metasurfaces. The metasurface devices include a plurality of device structures. Each of the device structures are formed from multiple layers, at least one of which is an impedance matching layer. The impedance matching layer may be formed as either an inner impedance matching layer between the substrate and the device layer or as a separate outer impedance matching layer on top of the device layer. The refractive indices of the impedance matching layers are chosen to be between the refractive index of the mediums on either side of the impedance matching layer.

    PARTIALLY METALLIZED GRATING AS HIGH-PERFORMANCE WAVEGUIDE INCOUPLER

    公开(公告)号:US20230119056A1

    公开(公告)日:2023-04-20

    申请号:US17954100

    申请日:2022-09-27

    Abstract: Embodiments of the present disclosure waveguides having device structures with a metallized portion and a method of forming the waveguide having device structures with the metallized portion are described herein. The plurality of device structures are formed having a device portion and a metallized portion. The metallized portion is disposed over at least a device portion surface of the device portion such that a plurality of gaps are disposed between the plurality of device structures.

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