公开(公告)号：US20230121211A1

公开(公告)日：2023-04-20

申请号：US17955185

申请日：2022-09-28

Applicant: Applied Materials, Inc.

Inventor： Jianji YANG ,  David SELL ,  Samarth BHARGAVA ,  Guannan CHEN

IPC: G02B1/00 ,  H01P1/00

Abstract: Embodiments of the present disclosure generally relate to metasurface devices and methods of forming metasurfaces. The metasurface devices include a plurality of device structures. Each of the device structures are formed from multiple layers, at least one of which is an impedance matching layer. The impedance matching layer may be formed as either an inner impedance matching layer between the substrate and the device layer or as a separate outer impedance matching layer on top of the device layer. The refractive indices of the impedance matching layers are chosen to be between the refractive index of the mediums on either side of the impedance matching layer.

公开(公告)号：US20230194784A1

公开(公告)日：2023-06-22

申请号：US18076242

申请日：2022-12-06

Applicant: Applied Materials, Inc.

Inventor： Rutger MEYER TIMMERMAN THIJSSEN ,  Guannan CHEN

IPC: G02B6/122 ,  G02B6/136

CPC classification number: G02B6/122 ,  G02B6/136

Abstract: An optical device and a method of forming an optical device having multi-depth optical device structures with a refractive index greater than or equal to 2.0 are provided. The optical devices and method include forming first matrix stack structures and second matrix stack structures. Adjacent first matrix stack structures form first vias having a first depth and adjacent second matrix stack structures form second vias having a second depth. The first depth of the first vias being different than the second depth of the second vias provides from the formation of submicron, multi-depth optical device structures when the vias are backfilled with a device material.