公开(公告)号：US20220364263A1

公开(公告)日：2022-11-17

申请号：US17731414

申请日：2022-04-28

申请人： Applied Materials, Inc.

发明人： Shawn Joseph BONHAM ,  Xinning LUAN ,  Hui CHEN ,  James M. AMOS ,  John NEWMAN ,  Kirk Allen FISHER ,  Aimee S. ERHARDT ,  Philip Michael AMOS ,  Zhiyuan YE ,  Shu-Kwan LAU ,  Lori D. WASHINGTON

IPC分类号： C30B25/12 ,  C23C16/458

摘要： Systems and apparatus for a reduced mass substrate support are disclosed, according to certain embodiments. A front side pocket is provided for support of a substrate, while a backside pocket is provided that reduces the mass of the substrate support. By providing the backside pocket, the mass of the overall substrate support is reduced, providing faster thermal cycling times for the substrate support and reducing the weight of the substrate support for transport. Lift pin systems, according to disclosed embodiments, are compatible with existing pedestal systems by providing a hollow extension from each lift pin hole that extends from a bottom of the backside pocket to provide support for lift pin insertion and operation.

公开(公告)号：US20240304492A1

公开(公告)日：2024-09-12

申请号：US18667082

申请日：2024-05-17

申请人： Applied Materials, Inc.

发明人： Hui CHEN ,  Xinning LUAN ,  Kirk Allen FISHER ,  Shawn Joseph BONHAM ,  Aimee S. ERHARDT ,  Zhepeng CONG ,  Shaofeng CHEN ,  Schubert S. CHU ,  James M. AMOS ,  Philip Michael AMOS ,  John NEWMAN

IPC分类号： H01L21/687 ,  C23C16/32 ,  C23C16/458

CPC分类号： H01L21/68757 ,  C23C16/325 ,  C23C16/4583

摘要： A susceptor for use in a processing chamber for supporting a wafer includes a susceptor substrate having a front side and a back side opposite the front side, and a coating layer deposited on the susceptor substrate. The front side has a pocket configured to hold a wafer to be processed in a processing chamber, the pocket being textured with a first pattern. The back side is textured with a second pattern.

公开(公告)号：US20220076988A1

公开(公告)日：2022-03-10

申请号：US17191786

申请日：2021-03-04

申请人： Applied Materials, Inc.

发明人： Hui CHEN ,  Xinning LUAN ,  Kirk Allen FISHER ,  Shawn Joseph BONHAM ,  Aimee S. ERHARDT ,  Zhepeng CONG ,  Shaofeng CHEN ,  Schubert S. CHU ,  James M. AMOS ,  Philip Michael AMOS ,  John NEWMAN

IPC分类号： H01L21/687 ,  C23C16/458 ,  C23C16/32

摘要： A susceptor for use in a processing chamber for supporting a wafer includes a susceptor substrate having a front side and a back side opposite the front side, and a coating layer deposited on the susceptor substrate. The front side has a pocket configured to hold a wafer to be processed in a processing chamber, the pocket being textured with a first pattern. The back side is textured with a second pattern.

公开(公告)号：US20240014065A1

公开(公告)日：2024-01-11

申请号：US17860891

申请日：2022-07-08

申请人： Applied Materials, Inc.

发明人： Zhepeng CONG ,  Balakrishnam R. JAMPANA ,  Masato ISHII ,  Shawn Joseph BONHAM ,  James M. AMOS ,  Kirk Allen FISHER ,  Philip Michael AMOS ,  Cathryne A. RYAN ,  Aimee S. ERHARDT ,  Xinning LUAN ,  Hui CHEN

IPC分类号： H01L21/687

CPC分类号： H01L21/68757 ,  H01L21/68785

摘要： A susceptor for use in a processing chamber for supporting a wafer includes a susceptor substrate having a susceptor ledge on an outer circumferential edge of a front side of the susceptor substrate, wherein a pocket within the susceptor ledge is configured to hold a wafer to be processed in a processing chamber, and a coating layer deposited on the susceptor substrate, wherein a surface of the susceptor ledge is textured with a plurality of venting groove lines, a surface of the pocket is textured with a first pattern, and a surface of a back side of the susceptor substrate opposite the front side is textured with a second pattern.

公开(公告)号：US20230114751A1

公开(公告)日：2023-04-13

申请号：US17450418

申请日：2021-10-08

申请人： Applied Materials, Inc.

发明人： Zhepeng CONG ,  Nyi Oo MYO ,  Hui CHEN ,  Huy D. NGUYEN ,  Shaofeng CHEN ,  Xinning LUAN ,  Kirk Allen FISHER ,  Aimee S. ERHARDT ,  Shawn Joseph BONHAM ,  Philip Michael AMOS ,  James M. AMOS

IPC分类号： C23C16/458

摘要： A substrate support assembly and processing chamber having the same are disclosed herein. In one embodiment, a substrate support assembly is provided that includes a body. The body has a center, an outer perimeter connecting a substrate support surface and a backside surface. The body additionally has a pocket disposed on the substrate support surface at the center and a lip disposed between the pocket and the outer perimeter. A layer is formed in the pocket of the substrate support surface. A plurality of discreet islands are disposed in the layer, wherein the discreet islands are disposed about a center line extending perpendicular from the substrate support surface.