公开(公告)号：US20220403505A1

公开(公告)日：2022-12-22

申请号：US17348849

申请日：2021-06-16

Applicant: Applied Materials, Inc.

Inventor： Annamalai LAKSHMANAN ,  Jacqueline S. WRENCH ,  Feihu WANG ,  Yixiong YANG ,  Joung Joo LEE ,  Srinivas GANDIKOTA ,  Sang-heum KIM ,  Zhebo CHEN ,  Gang SHEN

IPC: C23C16/02 ,  C23C16/06 ,  C23C16/52 ,  C23C14/16 ,  C23C16/455 ,  C23C16/42 ,  C23C14/06 ,  C23C16/56 ,  C23C14/02 ,  C23C14/58

Abstract: Methods and apparatus for processing a substrate is provided herein. For example, a method for processing a substrate comprises depositing a silicide layer within a feature defined in a layer on a substrate, forming one of a metal liner layer or a metal seed layer atop the silicide layer within the feature via depositing at least one of molybdenum (Mo) or tungsten (W) using physical vapor deposition, and depositing Mo using at least one of chemical vapor deposition or atomic layer deposition atop the at least one of the metal liner layer or the metal seed layer, without vacuum break.

公开(公告)号：US20220336274A1

公开(公告)日：2022-10-20

申请号：US17857341

申请日：2022-07-05

Applicant: Applied Materials, Inc.

Inventor： Xi CEN ,  Kai WU ,  Min HEON ,  Wei Min CHAN ,  Tom Ho Wing YU ,  Peiqi WANG ,  Ju Ik KANG ,  Feihu WANG ,  Nobuyuki SASAKI ,  Chunming ZHOU

IPC: H01L21/768 ,  H01L21/02 ,  C23C16/04

Abstract: Method for forming tungsten gap fill on a structure, including high aspect ratio structures includes depositing a tungsten liner in the structure using a physical vapor deposition (PVD) process with high ionization and an ambient gas of argon or krypton. The PVD process is performed at a temperature of approximately 20 degrees Celsius to approximately 300 degrees Celsius. The method further includes treating the structure with a nitridation process and depositing bulk fill tungsten into the structure using a chemical vapor deposition (CVD) process to form a seam suppressed boron free tungsten fill. The CVD process is performed at a temperature of approximately 300 degrees Celsius to approximately 500 degrees Celsius and at a pressure of approximately 5 Torr to approximately 300 Torr.

公开(公告)号：US20220130724A1

公开(公告)日：2022-04-28

申请号：US17082602

申请日：2020-10-28

Applicant: Applied Materials, Inc.

Inventor： Xi CEN ,  Kai WU ,  Min HEON ,  Wei Min CHAN ,  Tom Ho Wing YU ,  Peiqi WANG ,  Ju Ik KANG ,  Feihu WANG ,  Nobuyuki SASAKI ,  Chunming ZHOU

IPC: H01L21/768 ,  C23C16/04 ,  H01L21/02

Abstract: Method for forming tungsten gap fill on a structure, including high aspect ratio structures includes depositing a tungsten liner in the structure using a physical vapor deposition (PVD) process with high ionization and an ambient gas of argon or krypton. The PVD process is performed at a temperature of approximately 20 degrees Celsius to approximately 300 degrees Celsius. The method further includes treating the structure with a nitridation process and depositing bulk fill tungsten into the structure using a chemical vapor deposition (CVD) process to form a seam suppressed boron free tungsten fill. The CVD process is performed at a temperature of approximately 300 degrees Celsius to approximately 500 degrees Celsius and at a pressure of approximately 5 Torr to approximately 300 Torr.