公开(公告)号：US10854425B2

公开(公告)日：2020-12-01

申请号：US15013795

申请日：2016-02-02

Applicant: Applied Materials, Inc.

Inventor： Chetan Mahadeswaraswamy ,  Walter R Merry ,  Sergio Fukuda Shoji ,  Chunlei Zhang ,  Yashaswini Pattar ,  Duy D Nguyen ,  Tina Tsong ,  Shane C Nevil ,  Douglas A Buchberger, Jr. ,  Fernando M Silveira ,  Brad L Mays ,  Kartik Ramaswamy ,  Hamid Noorbakhsh

IPC: H01J37/32 ,  G05B6/02 ,  H05H1/00

Abstract: Methods and systems for controlling temperatures in plasma processing chamber with reduced controller response times and increased stability. Temperature control is based at least in part on a feedforward control signal derived from a plasma power input into the processing chamber. A feedforward control signal compensating disturbances in the temperature attributable to the plasma power may be combined with a feedback control signal counteracting error between a measured and desired temperature.