公开(公告)号：US10691169B2

公开(公告)日：2020-06-23

申请号：US15975522

申请日：2018-05-09

Applicant: Apple Inc.

Inventor： Jeffrey C. Mylvaganam ,  Erik G. de Jong ,  Dale N. Memering ,  Xiao Bing Cai ,  Palaniappan Chinnakaruppan ,  Jong Kong Lee ,  Srikanth Kamireddi ,  Sawako Kamei ,  Feng Min ,  Jing Zhang ,  Xiang Du ,  Sai Feng Liu

IPC: G06F1/16 ,  G04B37/00 ,  B24B7/22 ,  G04B39/00 ,  B23K26/402 ,  H01Q1/24 ,  B28D5/00 ,  B24B29/00 ,  B24B37/04 ,  B24C11/00 ,  B23K26/364 ,  B05D1/02 ,  B24C1/08 ,  B23K103/00

Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.

公开(公告)号：US10065289B2

公开(公告)日：2018-09-04

申请号：US14842962

申请日：2015-09-02

Applicant: Apple Inc.

Inventor： Palaniappan Chinnakaruppan ,  Srikanth Kamireddi

IPC: B24C1/08 ,  B24C3/32 ,  B24B31/116

Abstract: A polishing system and method for polishing a channel formed within a component is disclosed. The polishing system may include a tooling element operable to be positioned within a recess formed partially through a component. The tooling element may include an outer surface having a geometry corresponding to a geometry of the recess formed in the component. The tooling element forms a channel between the recess of the component and the tooling element when positioned in the recess. The system may also include a first member in fluid communication with a first opening of the channel, and a second member in fluid communication with a second opening of the channel. The second opening may be in fluid communication with the first opening via the channel. Additionally, the first and second member may be configured to continuously vary a pressure within the channel to move an abrasive slurry within the channel.

公开(公告)号：US10144107B2

公开(公告)日：2018-12-04

申请号：US15281025

申请日：2016-09-29

Applicant: Apple Inc.

Inventor： Srikanth Kamireddi ,  Alexander M. Hoffman

IPC: B24B37/07 ,  B24B37/04 ,  B24B57/02

Abstract: Ultrasonic polishing systems and methods of polishing brittle components for electronic devices using ultrasonic polishing systems are disclosed. The ultrasonic polishing system may include an ultrasonic driver and a polishing head operatively coupled to the ultrasonic driver. The ultrasonic drive may have a surface shape that corresponds to a non-planar feature formed in the brittle component. The ultrasonic polishing system may also include an abrasive slurry configured to be disposed between the non-planar feature of the brittle component and the polishing head. The ultrasonic driver may be configured to displace the polishing head toward and away from the non-planar feature formed in the brittle component.

公开(公告)号：US20160059383A1

公开(公告)日：2016-03-03

申请号：US14842962

申请日：2015-09-02

Applicant: Apple Inc.

Inventor： Palaniappan Chinnakaruppan ,  Srikanth Kamireddi

IPC: B24C1/08

CPC classification number: B24C1/08 ,  B24B31/116 ,  B24C1/083 ,  B24C3/32 ,  B24C3/327

Abstract: A polishing system and method for polishing a channel formed within a component is disclosed. The polishing system may include a tooling element operable to be positioned within a recess formed partially through a component. The tooling element may include an outer surface having a geometry corresponding to a geometry of the recess formed in the component. The tooling element forms a channel between the recess of the component and the tooling element when positioned in the recess. The system may also include a first member in fluid communication with a first opening of the channel, and a second member in fluid communication with a second opening of the channel. The second opening may be in fluid communication with the first opening via the channel. Additionally, the first and second member may be configured to continuously vary a pressure within the channel to move an abrasive slurry within the channel.

Abstract translation: 公开了一种用于抛光在部件内形成的通道的抛光系统和方法。 抛光系统可以包括可操作以定位在部分地通过部件形成的凹部内的工具元件。 工具元件可以包括具有对应于形成在部件中的凹部的几何形状的几何形状的外表面。 当定位在凹部中时，加工元件在部件的凹部和加工元件之间形成通道。 系统还可以包括与通道的第一开口流体连通的第一构件和与通道的第二开口流体连通的第二构件。 第二开口可以经由通道与第一开口流体连通。 另外，第一和第二构件可以构造成连续地改变通道内的压力以移动通道内的磨料浆料。

公开(公告)号：US09977464B2

公开(公告)日：2018-05-22

申请号：US14836943

申请日：2015-08-26

Applicant: Apple Inc.

Inventor： Jeffrey C. Mylvaganam ,  Erik G. de Jong ,  Dale N. Memering ,  Xiao Bing Cai ,  Palaniappan Chinnakaruppan ,  Jong Kong Lee ,  Srikanth Kamireddi ,  Sawako Kamei ,  Feng Min ,  Jing Zhang ,  Xiang Du ,  Sai Feng Liu

IPC: G06F1/16 ,  H01Q1/24 ,  B24B29/00 ,  B24B37/04 ,  B24C11/00 ,  B24B7/22 ,  G04B39/00 ,  B23K26/364 ,  B05D1/02 ,  B23K26/402 ,  B24C1/08 ,  G04B37/00 ,  B23K103/00

CPC classification number: G06F1/1637 ,  B05D1/02 ,  B23K26/364 ,  B23K26/402 ,  B23K2103/50 ,  B23K2103/54 ,  B24B7/228 ,  B24B29/005 ,  B24B37/04 ,  B24C1/08 ,  B24C11/00 ,  G04B37/0008 ,  G04B39/006 ,  G06F1/163 ,  H01Q1/243

Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.

公开(公告)号：US20170087687A1

公开(公告)日：2017-03-30

申请号：US15281025

申请日：2016-09-29

Applicant: Apple Inc.

Inventor： Srikanth Kamireddi ,  Alexander M. Hoffman

IPC: B24B37/07 ,  B24B57/02 ,  B24B37/04

CPC classification number: B24B37/07 ,  B24B37/042 ,  B24B57/02

Abstract: Ultrasonic polishing systems and methods of polishing brittle components for electronic devices using ultrasonic polishing systems are disclosed. The ultrasonic polishing system may include an ultrasonic driver and a polishing head operatively coupled to the ultrasonic driver. The ultrasonic drive may have a surface shape that corresponds to a non-planar feature formed in the brittle component. The ultrasonic polishing system may also include an abrasive slurry configured to be disposed between the non-planar feature of the brittle component and the polishing head. The ultrasonic driver may be configured to displace the polishing head toward and away from the non-planar feature formed in the brittle component.

公开(公告)号：US20170087683A1

公开(公告)日：2017-03-30

申请号：US14984275

申请日：2015-12-30

Applicant: Apple Inc.

Inventor： Palaniappan Chinnakaruppan ,  Srikanth Kamireddi

IPC: B24B1/00 ,  B44C1/22 ,  C09K3/14

CPC classification number: B24B1/00 ,  C09K3/1463

Abstract: A ceramic component and methods for making a ceramic component are disclosed. In particular, a sapphire component may be polished by positioning a compliant pad adjacent to a surface of the sapphire component. An abrasive slurry may be disposed or introduced between the compliant pad and the surface. The compliant pad may be moved with respect to the surface to produce a polished surface. The abrasive slurry may include a liquid component having a high pH level and medium-sized abrasive particulates.

公开(公告)号：US10112278B2

公开(公告)日：2018-10-30

申请号：US14984275

申请日：2015-12-30

Applicant: Apple Inc.

Inventor： Palaniappan Chinnakaruppan ,  Srikanth Kamireddi

IPC: B24B1/00 ,  C09K3/14 ,  B44C1/22

Abstract: A ceramic component and methods for making a ceramic component are disclosed. In particular, a sapphire component may be polished by positioning a compliant pad adjacent to a surface of the sapphire component. An abrasive slurry may be disposed or introduced between the compliant pad and the surface. The compliant pad may be moved with respect to the surface to produce a polished surface. The abrasive slurry may include a liquid component having a high pH level and medium-sized abrasive particulates.

公开(公告)号：US20180284843A1

公开(公告)日：2018-10-04

申请号：US15975522

申请日：2018-05-09

Applicant: Apple Inc.

Inventor： Jeffrey C. Mylvaganam ,  Erik G. de Jong ,  Dele N. Memering ,  Xiao Bing Cai ,  Palaniappan Chinnakaruppan ,  Jong Kong Lee ,  Srikanth Kamireddi ,  Sawako Kamei ,  Feng Min ,  Jing Zhang ,  Xiang Du ,  Sai Feng Liu

IPC: G06F1/16 ,  B24B37/04 ,  B05D1/02 ,  B23K26/402 ,  G04B39/00 ,  G04B37/00 ,  B24C11/00 ,  B24C1/08 ,  B23K26/364 ,  B24B29/00 ,  B24B7/22 ,  B23K103/00 ,  H01Q1/24

Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.

公开(公告)号：US20160062405A1

公开(公告)日：2016-03-03

申请号：US14836943

申请日：2015-08-26

Applicant: Apple Inc.

Inventor： Jeffrey C. Mylvaganam ,  Erik G. de Jong ,  Dale N. Memering ,  Xiao Bing Cai ,  Palaniappan Chinnakaruppan ,  Jong Kong Lee ,  Srikanth Kamireddi ,  Sawako Kamei ,  Feng Min ,  Jing Zhang ,  Xiang Du ,  Sai Feng Liu

IPC: G06F1/16 ,  B23K26/402 ,  B23K26/364 ,  B05D1/02 ,  B24C1/08

CPC classification number: G06F1/1637 ,  B05D1/02 ,  B23K26/364 ,  B23K26/402 ,  B23K2103/50 ,  B23K2103/54 ,  B24B7/228 ,  B24B29/005 ,  B24B37/04 ,  B24C1/08 ,  B24C11/00 ,  G04B37/0008 ,  G04B39/006 ,  G06F1/163 ,  H01Q1/243

Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.

Abstract translation: 公开了一种用于电子设备的盖和形成盖的方法。 电子设备可以包括壳体和联接到壳体的盖。 盖可以具有内表面，其具有中间抛光剂和最终抛光剂中的至少一种，形成在内表面上的凹槽和与内表面相对定位的外表面。 外表面可以具有中间抛光剂和最终抛光剂中的至少一种。 盖子还可以具有形成在内表面和外表面之间的圆形周边部分。 圆形的周边部分可以邻近凹槽定位。 用于形成盖的方法可以包括使用抛光工具对蓝宝石部件进行第一抛光处理，并且使用喷砂介质对形成盖的蓝宝石部件的凹槽进行第二抛光处理。