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公开(公告)号：US20250048769A1
公开(公告)日：2025-02-06
申请号：US18807492
申请日：2024-08-16
Applicant: Apple Inc.
Inventor： Saijin Liu , Tongbi T. Jiang , Saahil Mehra
Abstract: An integrated sensor package for an electronic device may include a matrix material defining a body structure of the integrated sensor package, a light emitting diode at least partially encapsulated in the matrix material, a photodiode at least partially encapsulated in the matrix material and configured to detect light emitted by the light emitting diode and reflected by an object external to the integrated sensor package, a via structure at least partially encapsulated in the matrix material, a permanent magnet at least partially encapsulated in the matrix material, a first conductive member on a first side of the integrated sensor package and conductively coupling the light emitting diode to a first end of the via structure, and a second conductive member on a second side of the integrated sensor package opposite the first side and conductively coupled to a second end of the via structure.
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公开(公告)号：US12074244B2
公开(公告)日：2024-08-27
申请号：US17473745
申请日：2021-09-13
Applicant: Apple Inc.
Inventor： Saijin Liu , Tongbi T. Jiang , Saahil Mehra
CPC classification number: H01L31/167 , A61B5/0059 , A61B5/681 , G04C10/00 , G04G21/025 , G06F1/163 , H02J50/10
Abstract: An integrated sensor package for an electronic device may include a matrix material defining a body structure of the integrated sensor package, a light emitting diode at least partially encapsulated in the matrix material, a photodiode at least partially encapsulated in the matrix material and configured to detect light emitted by the light emitting diode and reflected by an object external to the integrated sensor package, a via structure at least partially encapsulated in the matrix material, a permanent magnet at least partially encapsulated in the matrix material, a first conductive member on a first side of the integrated sensor package and conductively coupling the light emitting diode to a first end of the via structure, and a second conductive member on a second side of the integrated sensor package opposite the first side and conductively coupled to a second end of the via structure.
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公开(公告)号：US20230085860A1
公开(公告)日：2023-03-23
申请号：US17947823
申请日：2022-09-19
Applicant: Apple Inc.
Inventor： Zachary Gaubert , Jacky G. Ko , Han Bi , Saahil Mehra , Sinan Filiz , Xinsheng Chu , Adriaan Taal
Abstract: One embodiment described herein takes the form of a wearable electronic device, such as a watch, including a housing, a memory and a processor located in the housing, and three or more sensors. Each sensor of the three or more sensors is configured to generate a measurement of a parameter. Each sensor of the three or more sensors is located in a different region in the housing. The processor is configured to execute instructions stored in the memory. In response to execution of the instructions by the processor, the processor is configured to generate an adjusted measurement of the biometric parameter using at least the measurements of the parameter generated by the three or more sensors. The parameter is a temperature, and the biometric parameter is a body temperature of a user.
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公开(公告)号：US11573351B2
公开(公告)日：2023-02-07
申请号：US16812152
申请日：2020-03-06
Applicant: Apple Inc.
Inventor： Saahil Mehra , Jacky G. Ko , Saijin Liu
Abstract: An electronic watch includes a frame and a cover. The cover is attached to the frame, and the frame and cover at least partially define an interior volume of the electronic watch. An optical sensor assembly including a light emitter and a light receiver is positioned within the inter volume of the frame. An optical barrier is positioned between the optical sensor assembly and the cover and includes a magnetic material that forms a light blocking-wall between the light emitter and the light receiver. The magnetic material is configured to removably couple the electronic watch with a charging device via a magnetic attraction between the magnetic material and a magnetic component of the charging device.
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公开(公告)号：US20220254941A1
公开(公告)日：2022-08-11
申请号：US17174076
申请日：2021-02-11
Applicant: Apple Inc.
Inventor： Mathieu Charbonneau-Lefort , Saahil Mehra , Tongbi T. Jiang , Saijin Liu
IPC: H01L31/0352 , H01L25/16 , H01L31/02 , H01L31/0203
Abstract: An optoelectronic module may include one or more non-rectangular optoelectronic dies e.g., light emitting diodes and photodiodes, arranged to maximize the usage of surface area when mounted to a base circuit board. Multi-axis and non-orthogonal axis dicing processes can be used to form the dies which have non-rectangular shapes.
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Patent Agency Ranking
公开(公告)号：US20220085231A1
公开(公告)日：2022-03-17
申请号：US17473745
申请日：2021-09-13
Applicant: Apple Inc.
Inventor： Saijin Liu , Tongbi T. Jiang , Saahil Mehra
Abstract: An integrated sensor package for an electronic device may include a matrix material defining a body structure of the integrated sensor package, a light emitting diode at least partially encapsulated in the matrix material, a photodiode at least partially encapsulated in the matrix material and configured to detect light emitted by the light emitting diode and reflected by an object external to the integrated sensor package, a via structure at least partially encapsulated in the matrix material, a permanent magnet at least partially encapsulated in the matrix material, a first conductive member on a first side of the integrated sensor package and conductively coupling the light emitting diode to a first end of the via structure, and a second conductive member on a second side of the integrated sensor package opposite the first side and conductively coupled to a second end of the via structure.
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公开(公告)号：US11646384B2
公开(公告)日：2023-05-09
申请号：US17174076
申请日：2021-02-11
Applicant: Apple Inc.
Inventor： Mathieu Charbonneau-Lefort , Saahil Mehra , Tongbi T. Jiang , Saijin Liu
IPC: H01L31/0352 , H01L31/0203 , H01L31/02 , H01L25/16 , H01L25/04
CPC classification number: H01L31/035281 , H01L25/167 , H01L31/0203 , H01L31/02005 , H01L25/042
Abstract: An optoelectronic module may include one or more non-rectangular optoelectronic dies e.g., light emitting diodes and photodiodes, arranged to maximize the usage of surface area when mounted to a base circuit board. Multi-axis and non-orthogonal axis dicing processes can be used to form the dies which have non-rectangular shapes.
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公开(公告)号：US20230093738A1
公开(公告)日：2023-03-23
申请号：US17891838
申请日：2022-08-19
Applicant: Apple Inc.
Inventor： Jacky G. Ko , Han Bi , Saahil Mehra , Sinan Filiz , Xinsheng Chu , Zachary Gaubert
Abstract: Disclosed herein are electronic devices, including wearable electronic devices, and components and configurations thereof, having one or more temperature sensors separated from the point of contact of the electronic device and an object, such as a user, whose temperature is being measured. In some embodiments, the electronic device includes both a temperature sensor and a light (visible, UV, and/or IR) emitter and sensor. Various embodiments are disclosed by which a temperature sensor may be shielded or separated from a light emitter/detector. A spacer may be used to separate the temperature sensor from the device's housing that contacts the object. The spacer may include a thermal path from the housing to the temperature sensor, and may be opaque to the light detected by a light detector.
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公开(公告)号：US20210278561A1
公开(公告)日：2021-09-09
申请号：US16812152
申请日：2020-03-06
Applicant: Apple Inc.
Inventor： Saahil Mehra , Jacky G. Ko , Saijin Liu
Abstract: An electronic watch includes a frame and a cover. The cover is attached to the frame, and the frame and cover at least partially define an interior volume of the electronic watch. An optical sensor assembly including a light emitter and a light receiver is positioned within the inter volume of the frame. An optical barrier is positioned between the optical sensor assembly and the cover and includes a magnetic material that forms a light blocking-wall between the light emitter and the light receiver. The magnetic material is configured to removably couple the electronic watch with a charging device via a magnetic attraction between the magnetic material and a magnetic component of the charging device.
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公开(公告)号：US10353506B2
公开(公告)日：2019-07-16
申请号：US15625952
申请日：2017-06-16
Applicant: Apple Inc.
Inventor： Michael Vosgueritchian , Sinan Filiz , James E. Pedder , John Stephen Smith , Saahil Mehra , Xiaofan Niu
Abstract: Structures and methods are disclosed for an electronic device having an input surface that uses dual sensors to measure forces applied to the input surface. The forces can be estimated over a greater range of values than would be possible with either sensor alone. A second sensor can be used after a first sensor has reached a limit. A first sensor can be a strain sensor and a second sensor a pressure sensor. Both sensors may be resistance based, with signals from both sensors can be combined and measured by processing circuitry. Each sensor type may be part of planar arrays disposed beneath the input surface.
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