SYSTEMS AND METHODS FOR MAGNETIC BARRIER ASSEMBLY

    公开(公告)号:US20230090608A1

    公开(公告)日:2023-03-23

    申请号:US17539745

    申请日:2021-12-01

    申请人: Apple Inc.

    IPC分类号: H05K5/02 G01V8/20 H01F7/02

    摘要: An embodiment of a barrier assembly includes a housing having an aperture and a magnet at least partially disposed within the housing. A first surface of the magnet is exposed. The barrier assembly also includes a light-emitting component disposed within the aperture. Another embodiment of a barrier assembly includes a housing having a plurality of apertures formed about a perimeter of the housing. The barrier assembly also includes a magnet at least partially embedded within the housing and the magnet includes an opening formed through a center of the magnet and a plurality of light-emitting components, each light-emitting component at least partially disposed within a corresponding aperture of the plurality of apertures.

    Systems and methods for magnetic barrier assembly

    公开(公告)号:US11917773B2

    公开(公告)日:2024-02-27

    申请号:US17539745

    申请日:2021-12-01

    申请人: Apple Inc.

    IPC分类号: H05K5/02 H01F7/02 G01V8/20

    CPC分类号: H05K5/02 G01V8/20 H01F7/02

    摘要: An embodiment of a barrier assembly includes a housing having an aperture and a magnet at least partially disposed within the housing. A first surface of the magnet is exposed. The barrier assembly also includes a light-emitting component disposed within the aperture. Another embodiment of a barrier assembly includes a housing having a plurality of apertures formed about a perimeter of the housing. The barrier assembly also includes a magnet at least partially embedded within the housing and the magnet includes an opening formed through a center of the magnet and a plurality of light-emitting components, each light-emitting component at least partially disposed within a corresponding aperture of the plurality of apertures.

    Display Systems with Light-Emitting Diodes
    3.
    发明公开

    公开(公告)号:US20230361153A1

    公开(公告)日:2023-11-09

    申请号:US18180758

    申请日:2023-03-08

    申请人: Apple Inc.

    摘要: An electronic device may have one or more displays that produce images for a user. The display may include an array of light-emitting diodes. Each light-emitting diode in the array of light-emitting diodes may include a plurality of vias. The vias may be arranged in an array of rows and columns. The light-emitting diodes in the array may share a common cathode. The common cathode may include a conductive layer formed from a reflective material. The conductive layer may be formed in a grid that defines a plurality of openings for the light-emitting diodes or may be formed around the periphery of the array. The array may include light-emitting diodes of two different colors in a head-to-tail arrangement, connected in series, or that share a common cathode. The array may include light-emitting diodes of three different colors that are vertically stacked.

    Optical Sensor Having a Magnetic Optical Barrier

    公开(公告)号:US20210278561A1

    公开(公告)日:2021-09-09

    申请号:US16812152

    申请日:2020-03-06

    申请人: Apple Inc.

    摘要: An electronic watch includes a frame and a cover. The cover is attached to the frame, and the frame and cover at least partially define an interior volume of the electronic watch. An optical sensor assembly including a light emitter and a light receiver is positioned within the inter volume of the frame. An optical barrier is positioned between the optical sensor assembly and the cover and includes a magnetic material that forms a light blocking-wall between the light emitter and the light receiver. The magnetic material is configured to removably couple the electronic watch with a charging device via a magnetic attraction between the magnetic material and a magnetic component of the charging device.

    Optical sensor package with magnetic component for device attachment

    公开(公告)号:US12074244B2

    公开(公告)日:2024-08-27

    申请号:US17473745

    申请日:2021-09-13

    申请人: Apple Inc.

    摘要: An integrated sensor package for an electronic device may include a matrix material defining a body structure of the integrated sensor package, a light emitting diode at least partially encapsulated in the matrix material, a photodiode at least partially encapsulated in the matrix material and configured to detect light emitted by the light emitting diode and reflected by an object external to the integrated sensor package, a via structure at least partially encapsulated in the matrix material, a permanent magnet at least partially encapsulated in the matrix material, a first conductive member on a first side of the integrated sensor package and conductively coupling the light emitting diode to a first end of the via structure, and a second conductive member on a second side of the integrated sensor package opposite the first side and conductively coupled to a second end of the via structure.

    Method of Fine Pitch Hybrid Bonding with Dissimilar CTE Wafers and Resulting Structures

    公开(公告)号:US20220336405A1

    公开(公告)日:2022-10-20

    申请号:US17654637

    申请日:2022-03-14

    申请人: Apple Inc.

    IPC分类号: H01L23/00

    摘要: Hybrid bonded structures and methods of manufacture are described. In an embodiment, a hybrid bonded structure includes a first plurality of first conductive bonding regions of a first substrate stack bonded directly to a second plurality of second conductive bonding regions of a second substrate stack, and a first dielectric layer of the first substrate stack bonded to a second dielectric layer of the second substrate stack with an intermediate organic adhesive layer.

    Display Systems Having Monolithic Arrays of Light-Emitting Diodes

    公开(公告)号:US20220005798A1

    公开(公告)日:2022-01-06

    申请号:US17475831

    申请日:2021-09-15

    申请人: Apple Inc.

    摘要: An electronic device may include a display having a monolithic array of light-emitting diodes mounted to a surface of a substrate layer. The diodes may include contact pads. Driver circuitry may independently drive each of the diodes in the array using drive signals. The driver circuitry may be formed on a driver integrated circuit. Bond pads may be formed on a surface of the integrated circuit. Copper pillars may be grown on the bond pads. In another suitable arrangement, the driver circuitry may be formed on a driver printed circuit board coupled to an interposer by a flexible printed circuit. The interposer may include bond pads and copper pillars grown on the bond pads. The contact pads on each of the diodes may be simultaneously bonded to the copper pillars. A surface of the substrate layer may be patterned to form light redirecting elements if desired.

    Display Systems Having Vertical Light-Emitting Diodes

    公开(公告)号:US20240170625A1

    公开(公告)日:2024-05-23

    申请号:US18551985

    申请日:2022-03-07

    申请人: Apple Inc.

    IPC分类号: H01L33/58 H01L25/16

    CPC分类号: H01L33/58 H01L25/167

    摘要: An electronic device may include a display having an array of light-emitting diodes mounted to a driver die with driver circuitry for controlling the light-emitting diodes. The diodes may include contact pads. Contact pads for one of the diode terminals (e.g., the anodes or the cathodes) may be individually addressable, whereas the other diode terminals may share a common contact pad. The individually addressable contact pads and the common contact pad may be vertically stacked to improve thermal dissipation. The common contact pad may be interposed between the driver die and the individually addressable contact pads. Alternatively, the individually addressable contact pads may be interposed between the driver die and the common contact pad. Each LED array may have a dedicated driver die or one driver die may be shared between multiple LED arrays. A single LED array may include LEDs of multiple different colors.

    Display Systems with Light-Emitting Diodes
    10.
    发明公开

    公开(公告)号:US20230361154A1

    公开(公告)日:2023-11-09

    申请号:US18180763

    申请日:2023-03-08

    申请人: Apple Inc.

    IPC分类号: H01L27/15

    CPC分类号: H01L27/156

    摘要: An electronic device may have one or more displays that produce images for a user. The display may include an array of light-emitting diodes. Each light-emitting diode in the array of light-emitting diodes may include a plurality of vias. The vias may be arranged in an array of rows and columns. The light-emitting diodes in the array may share a common cathode. The common cathode may include a conductive layer formed from a reflective material. The conductive layer may be formed in a grid that defines a plurality of openings for the light-emitting diodes or may be formed around the periphery of the array. The array may include light-emitting diodes of two different colors in a head-to-tail arrangement, connected in series, or that share a common cathode. The array may include light-emitting diodes of three different colors that are vertically stacked.