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公开(公告)号：US20230269507A1
公开(公告)日：2023-08-24
申请号：US18095871
申请日：2023-01-11
Applicant: Apple Inc.
Inventor： Guo-Lun LUO , Gokhan HATIPOGLU , Peter C. HRUDEY , Scott C. GRINKER
IPC: H04R1/10
CPC classification number: H04R1/10 , H04R2201/003
Abstract: A micro-electromechanical systems (MEMS) package comprising: a MEMS package comprising a substrate and a lid coupled to the substrate; a piezoelectric valve coupled to the substrate and comprising a number of movable members operable to be deformed in opposite directions upon application of a voltage to modify an acoustic resistance of an acoustic port; and a first stopper defined by the substrate and a second stopper defined by the lid, the first stopper and the second stopper being aligned with the number of movable members and operable to prevent an undesirable defection of the number of movable members.
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公开(公告)号：US20220014853A1
公开(公告)日：2022-01-13
申请号：US17177178
申请日：2021-02-16
Applicant: Apple Inc.
Inventor： Gokhan HATIPOGLU , Onur I. ILLKORUR , Pablo Seoane VIEITES , Christopher WILK , Peter C. HRUDEY
Abstract: Aspects of the subject technology relate to electronic devices having speakers such as microelectromechanical systems (MEMS) speakers. A MEMS speaker can include an electrostatically driven, corrugated MEMS structure to move air without a magnet, coil, or traditional speaker membrane, and thus provide a low-power, compact speaker with a large acoustically active area in a small volume. Neighboring folds in the corrugated MEMS structure may form pairs of MEMS electrodes that can be pushed together and/or pulled apart to deform the MEMS structure in a breathing motion that generates pressure differentials on opposing sides of the corrugated MEMS structure to generate sound. Additional modes of operation are described.
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公开(公告)号：US20230270010A1
公开(公告)日：2023-08-24
申请号：US18095870
申请日：2023-01-11
Applicant: Apple Inc.
Inventor： Guo-Lun LUO , Gokhan HATIPOGLU , Peter C. HRUDEY
CPC classification number: H10N30/2042 , H10N30/87 , F16K31/006
Abstract: A piezoelectric valve comprising: a fixed portion defining an opening; and a number of movable portions extending from the fixed portion over the opening and separated from one another by radially oriented slits, each movable portion of the number of movable portions comprising a first material layer and a second material layer, and at least one of the first material layer or the second material layer comprises a piezoelectric material that is operable to drive a displacement of the movable portion in a direction opposite to an adjacent movable portion sharing a same radially oriented slit upon application of a voltage.
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公开(公告)号：US20240171915A1
公开(公告)日：2024-05-23
申请号：US18429342
申请日：2024-01-31
Applicant: Apple Inc.
Inventor： Gokhan HATIPOGLU , Onur I. ILKORUR , Pablo Seoane VIEITES , Christopher WILK , Peter C. HRUDEY
CPC classification number: H04R7/14 , B81B3/0021 , H04R19/02
Abstract: Aspects of the subject technology relate to electronic devices having speakers such as microelectromechanical systems (MEMS) speakers. A MEMS speaker can include an electrostatically driven, corrugated MEMS structure to move air without a magnet, coil, or traditional speaker membrane, and thus provide a low-power, compact speaker with a large acoustically active area in a small volume. Neighboring folds in the corrugated MEMS structure may form pairs of MEMS electrodes that can be pushed together and/or pulled apart to deform the MEMS structure in a breathing motion that generates pressure differentials on opposing sides of the corrugated MEMS structure to generate sound. Additional modes of operation are described.
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公开(公告)号：US20230262372A1
公开(公告)日：2023-08-17
申请号：US17670347
申请日：2022-02-11
Applicant: Apple Inc.
Inventor： Anthony D. MINERVINI , Peter C. HRUDEY , Gokhan HATIPOGLU
Abstract: Aspects of the subject technology relate to liquid-resistant microphone modules for electronic devices. A microphone module may include a non-porous membrane that seals the front volume of the microphone module from the external environment of the electronic device. The microphone module may also include a substrate having an opening that allows airflow between the front volume and an interior cavity within the housing of the electronic device. In various implementations, an inductive vent and/or a resistive vent may be provided over the opening in the substrate.
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Patent Agency Ranking
公开(公告)号：US20230179920A1
公开(公告)日：2023-06-08
申请号：US18102667
申请日：2023-01-27
Applicant: Apple Inc.
Inventor： Gokhan HATIPOGLU , Onur I. ILKORUR , Pablo Seoane VIEITES , Christopher WILK , Peter C. HRUDEY
CPC classification number: H04R7/14 , B81B3/0021 , H04R19/02
Abstract: Aspects of the subject technology relate to electronic devices having speakers such as microelectromechanical systems (MEMS) speakers. A MEMS speaker can include an electrostatically driven, corrugated MEMS structure to move air without a magnet, coil, or traditional speaker membrane, and thus provide a low-power, compact speaker with a large acoustically active area in a small volume. Neighboring folds in the corrugated MEMS structure may form pairs of MEMS electrodes that can be pushed together and/or pulled apart to deform the MEMS structure in a breathing motion that generates pressure differentials on opposing sides of the corrugated MEMS structure to generate sound. Additional modes of operation are described.
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公开(公告)号：US20240121559A1
公开(公告)日：2024-04-11
申请号：US18239114
申请日：2023-08-28
Applicant: Apple Inc.
Inventor： Onur I. ILKORUR , Christopher WILK , Gokhan HATIPOGLU , Peter C. HRUDEY
CPC classification number: H04R19/02 , B81B3/0021 , H04R1/025 , B81B2201/0257 , H04R2201/003
Abstract: Aspects of the subject technology relate to electronic devices having speakers such as microelectromechanical systems (MEMS) speakers. A MEMS speaker can include cylindrical corrugated MEMS structure. The cylindrical corrugated MEMS structure may include a contiguous MEMS structure with corrugations that run around an open cylindrical core that is defined, in part, by interior folds of the corrugations. The cylindrical corrugated MEMS structure may be deformed, responsive to an applied voltage, such that a portion of the cylindrical corrugated MEMS structure bends into and/or out of the open cylindrical core to push air out of and/or pull air into the open cylindrical core. In one or more implementations, a MEMS speaker may include an array of cylindrical corrugated MEMS structures.
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公开(公告)号：US20240114277A1
公开(公告)日：2024-04-04
申请号：US18537741
申请日：2023-12-12
Applicant: Apple Inc.
Inventor： Anthony D. MINERVINI , Peter C. HRUDEY , Gokhan HATIPOGLU
Abstract: Aspects of the subject technology relate to liquid-resistant microphone modules for electronic devices. A microphone module may include a non-porous membrane that seals the front volume of the microphone module from the external environment of the electronic device. The microphone module may also include a substrate having an opening that allows airflow between the front volume and an interior cavity within the housing of the electronic device. In various implementations, an inductive vent and/or a resistive vent may be provided over the opening in the substrate.
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公开(公告)号：US20230262370A1
公开(公告)日：2023-08-17
申请号：US17670387
申请日：2022-02-11
Applicant: Apple Inc.
Inventor： Anthony D. MINERVINI , Peter C. HRUDEY , Gokhan HATIPOGLU
CPC classification number: H04R1/023 , B81B7/02 , H04R1/2803 , H04R1/2873 , B81B2201/0257 , H04R2499/11
Abstract: Aspects of the subject technology relate to inductive acoustic filters for acoustic devices. An inductive filter may include a substrate, an etched serpentine channel in a surface of the substrate and extending within the substrate from a first port in the substrate to a second port in the substrate. The inductive filter may also include a polymer cover layer adhesively attached to the surface of the substrate over the etched serpentine channel. The inductive filter may be positioned over an opening in a substrate of an acoustic module, such as a microphone module or a speaker module.
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公开(公告)号：US20210258698A1
公开(公告)日：2021-08-19
申请号：US16792043
申请日：2020-02-14
Applicant: Apple Inc.
Inventor： Florence W. OW , Peter C. HRUDEY , Yu-Chun HSU , Anthony D. MINERVINI , John K. QUEENEY , Tavys Q. ASHCROFT
Abstract: Aspects of the subject technology relate to low noise microphone assemblies for electronic devices. A microphone assembly may include components for sensing sound, mounted on a substrate, under a cover disposed on the substrate. The components may receive sound through an opening in the substrate. The microphone assembly may include an interposer on the substrate. The interposer includes one or more contacts on a surface that is spatially separated from the surface of the substrate, in a direction perpendicular to the surface of the substrate. A first side of the substrate may be mounted to an inner surface of a housing of the electronic device. The components, the cover, and the interposer may be mounted to an opposing second side of the substrate. A flexible printed circuit may be coupled to the contacts on the surface of the interposer, and mechanically attached to a surface of the cover.
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