VIBRATION COMPONENTS AND LOUDSPEAKERS
    1.
    发明公开

    公开(公告)号:US20240259733A1

    公开(公告)日:2024-08-01

    申请号:US18430834

    申请日:2024-02-02

    CPC classification number: H04R7/14 H04R7/122

    Abstract: One or more embodiments of the present disclosure relate to a loudspeaker, comprising a driving component configured to generate a vibration based on an electrical signal; and a vibration component configured to receive the vibration of the driving component to vibrate. The vibration component includes an elastic element and a reinforcing member. The elastic element includes a central region, a folded ring region disposed at a periphery of the central region, and a fixed region disposed at a periphery of the folded ring region. The elastic element is configured to vibrate in a direction perpendicular to the central region. The reinforcing member is connected with the central region. The reinforcing member includes a reinforcing part and a plurality of hollow parts. Vibrations of the reinforcing member and the elastic element generate at least two resonance peaks within an audible range of human ears.

    A FULL-FREQUENCY BAND HIGH QUALITY SPEAKER WITH A BAR AND SOUND TUNNELS

    公开(公告)号:US20240236576A9

    公开(公告)日:2024-07-11

    申请号:US18026042

    申请日:2020-12-15

    CPC classification number: H04R7/14 H04R1/24 H04R7/18 H04R9/025 H04R9/041

    Abstract: A full-frequency band high quality speaker with a bar and sound tunnels includes a voice coil, magnet, diaphragm and magnetically conductive structure; the diaphragm is conical, a bridge-style bar is on the surface of at least one side of the diaphragm; the diaphragm includes at least two grooves, each horizontally radial; each groove crosses the bridge-type bar in the horizontal direction and the length direction of the groove is perpendicular to the bridge-type bar; the groove is concave on the surface of the diaphragm to form a sound tunnel. The diaphragm is changed to the current standard vibration mode, and the timbre of treble register is not bright and the timbre of bass register is not sonorous and mellow enough from the perspective of vibration, resonance and phonation. The practice proves that the improved scheme has outstanding substantive characteristics and remarkable technical progress, and has obtained obvious technical results.

    A FULL-FREQUENCY BAND HIGH QUALITY SPEAKER WITH A BAR AND SOUND TUNNELS

    公开(公告)号:US20240137705A1

    公开(公告)日:2024-04-25

    申请号:US18026042

    申请日:2020-12-15

    CPC classification number: H04R7/14 H04R1/24 H04R7/18 H04R9/025 H04R9/041

    Abstract: A full-frequency band high quality speaker with a bar and sound tunnels includes a voice coil, magnet, diaphragm and magnetically conductive structure; the diaphragm is conical, a bridge-style bar is on the surface of at least one side of the diaphragm; the diaphragm includes at least two grooves, each horizontally radial; each groove crosses the bridge-type bar in the horizontal direction and the length direction of the groove is perpendicular to the bridge-type bar; the groove is concave on the surface of the diaphragm to form a sound tunnel. The diaphragm is changed to the current standard vibration mode, and the timbre of treble register is not bright and the timbre of bass register is not sonorous and mellow enough from the perspective of vibration, resonance and phonation. The practice proves that the improved scheme has outstanding substantive characteristics and remarkable technical progress, and has obtained obvious technical results.

    Silicon speaker
    5.
    发明授权

    公开(公告)号:US10057689B2

    公开(公告)日:2018-08-21

    申请号:US15304058

    申请日:2014-08-26

    Applicant: GOERTEK INC.

    Inventor: Quanbo Zou

    Abstract: The present invention provides a silicon speaker comprising an MEMS acoustoelectric chip and a PCB substrate, wherein the MEMS acoustoelectric chip comprises a corrugated diaphragm on a silicon substrate; and one side surface of the MEMS acoustoelectric chip is metalized, and the metalized side surface of the MEMS acoustoelectric chip is connected with the PCB substrate. The corrugated diaphragm is electrically conductive and interconnected with metal paths on MEMS acoustoelectric chip, which is led out to a first PCB metal path as one electrode. A second PCB metal path below the MEMS chip forms another electrode of the electrostatic actuator. The silicon speaker provided by the present invention lowers manufacturing costs of the speaker, and allows the diaphragm to generate high and repeatable/reliable sound pressure upon large displacements so as to improve the sounding effects of the speaker.

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