公开(公告)号：US6005773A

公开(公告)日：1999-12-21

申请号：US879478

申请日：1997-06-20

Applicant: Allen Frank Rozman ,  David Leonard Stevens

Inventor： Allen Frank Rozman ,  David Leonard Stevens

IPC: H02M3/00 ,  H02M3/28 ,  H05K3/28 ,  H05K5/02 ,  H05K7/20

CPC classification number: H05K5/0247 ,  H02M3/00 ,  H02M3/28 ,  H05K3/284 ,  H05K7/209

Abstract: A power supply module package suitable for both high packaged power density and cost effective manufacture. In an exemplary embodiment, the power supply module includes: (1) at least one printed circuit board containing conductors for interconnecting components of the power supply, (2) a thermally conductive baseplate or case operable for transferring heat generated inside the module to the outside environment, wherein the external package dimensions are of a sufficiently small size to allow the user the greatest flexibility in the design of the overall circuit assembly, (3) at least one power magnetic device operable for providing electrical isolation between the input and the output of the power module, and (4) a set of electrical leads to facilitate communication and power flow between the module and circuitry being powered. The present invention provides a highly compact, thermally conductive package for a power supply module (perhaps a DC/DC converter) that is cost effective, readily manufacturable, durable, and easily mounted to a circuit card, allowing the power module to, for example, form a portion of a distributed power architecture.

Abstract translation: 电源模块封装，适用于高封装功率密度和成本有效的制造。 在一个示例性实施例中，电源模块包括：（1）至少一个印刷电路板，其包含用于互连电源组件的导体，（2）导热基板或壳体，可操作用于将模块内部产生的热量传递到外部 环境，其中外部封装尺寸具有足够小的尺寸以允许用户在整个电路组件的设计中具有最大的灵活性，（3）至少一个功率磁性装置，其可操作以在输入和输出之间提供电隔离 电源模块，以及（4）一组电引线，以促进模块和被供电的电路之间的通信和功率流动。 本发明提供了一种用于电源模块（可能是DC / DC转换器）的高度紧凑的导热封装，其具有成本效益，易于制造，耐用且易于安装到电路卡，从而允许功率模块例如 ，形成分布式电源架构的一部分。

公开(公告)号：US06377150B1

公开(公告)日：2002-04-23

申请号：US09615304

申请日：2000-07-13

Applicant: Randy Thomas Heinrich ,  Robert Joseph Roessler ,  David Leonard Stevens ,  Matthew Anthony Wilkowski ,  William Lonzo Woods

Inventor： Randy Thomas Heinrich ,  Robert Joseph Roessler ,  David Leonard Stevens ,  Matthew Anthony Wilkowski ,  William Lonzo Woods

IPC: H01F2708

CPC classification number: H01F27/22 ,  H01F27/2804

Abstract: An apparatus is disclosed for facilitating heat dissipation in an electrical device hat includes a core structure traversing a substrate when the core structure is in an installed orientation. The apparatus comprises: (a) at least one aperture through the substrate for accommodating traversing by the core structure; each respective aperture has periphery defined by a respective circumjacent face extending a height substantially equal with the substrate thickness; (b) a layer of thermally conductive material situated discontinuously on the circumjacent face of at least one respective aperture. The respective aperture is configured to establish a thermally conductive engagement with at least one facing portion of the core structure traversing the respective aperture in the installed orientation. The method comprises the steps of: (a) providing at least one aperture through the substrate for accommodating the traversing by the core structure; each respective aperture having a circumjacent face extending a height substantially equal with the substrate thickness; (b) providing a layer of thermally conductive material situated discontinuously on the circumjacent face of at least one respective aperture; and (c) assembling the electrical device in the installed orientation. The respective aperture is configured to establish a thermally conductive engagement with at least one facing portion of the core structure traversing the aperture in the installed orientation.

Abstract translation: 公开了一种用于促进电气装置中的散热的装置，当芯结构处于安装方向时，帽子包括穿过基板的芯结构。 所述装置包括：（a）通过所述基板的至少一个孔，用于容纳所述芯结构的横移; 每个相应的孔具有由相应的周向面限定的周边，该相邻的外表面的基底厚度基本相等; （b）一层导热材料，其不连续地位于至少一个相应的孔的周向表面上。 相应的孔被构造成与所设置的取向中穿过相应的孔的芯结构的至少一个面对部分建立导热接合。 该方法包括以下步骤：（a）提供穿过基底的至少一个孔，以容纳由芯结构穿过的物体; 每个相应的孔具有延伸与衬底厚度基本相等的高度的周向表面; （b）提供不连续地位于至少一个相应孔的周向表面上的导热材料层; 和（c）以所安装的方向组装电气装置。 相应的孔被构造成建立与沿安装方位穿过孔的芯结构的至少一个面对部分的导热接合。

公开(公告)号：US06473304B1

公开(公告)日：2002-10-29

申请号：US09427538

申请日：1999-10-26

Applicant: David Leonard Stevens

Inventor： David Leonard Stevens

IPC: H05K720

CPC classification number: H05K5/0247 ,  H02M3/00 ,  H02M3/28 ,  H05K3/284 ,  H05K7/209

Abstract: A power supply and a method of manufacture therefor. The power supply includes a circuit board containing conductors for interconnecting electrical components of the power supply and a thermally-conductive case having an integral electrically insulating layer. The thermally-conductive case forms a reservoir to receive the circuit board therein. The power supply further includes a power semiconductor device having a body connected in thermal communication with the thermally-conductive case and terminals coupled to the conductors of the circuit board. The power supply still further includes an encapsulant, located within the reservoir, capable of ensconcing the power semiconductor device and the electrical components. Additionally, electrical leads extend from the power supply that allows the power supply to be coupled to a printed wiring board.

Abstract translation: 电源及其制造方法。 电源包括电路板，其包含用于互连电源的电气部件的导体和具有整体电绝缘层的导热壳体。 导热壳体形成用于在其中容纳电路板的储存器。 电源还包括功率半导体器件，其具有与导热壳体热连通的主体和耦合到电路板的导体的端子。 电源还包括位于储存器内的密封剂，其能够固定功率半导体器件和电气部件。 此外，电引线从允许电源耦合到印刷电路板的电源延伸。

公开(公告)号：US06359784B1

公开(公告)日：2002-03-19

申请号：US09613404

申请日：2000-07-11

Applicant: David Leonard Stevens

Inventor： David Leonard Stevens

IPC: H05K720

CPC classification number: H05K5/0091 ,  H05K1/056 ,  H05K1/144

Abstract: A package for an electrical apparatus is disclosed. The electrical apparatus includes a plurality of electrical components; the package comprises: (a) a first circuit board having a top side and a bottom side, and having a first array of the plurality of components arranged on at least one side of the top side and the bottom side; (b) a second circuit board in electrical and mechanical connection with the first circuit board; the second circuit board has a first side and a second side. The first side faces the top side of the first circuit board. The second circuit board has a second array of the plurality of components arranged on the first side. The second circuit board preferably has at least one heat dissipating structure substantially integrally affixed on the second side. Preferably, the second side is a metal substrate and the first side is electrically insulated from the second side. The package may further include one circuit board presenting an integral connection structure extending a standoff distance measured substantially perpendicular to the plane of the circuit board. The connection structure is affixed with the other circuit board when the package is in an assembled orientation. The method for manufacturing the apparatus comprises the steps of: (a) providing an insulated metal substrate presenting a first component bearing side and a second metallic side electrically insulated from each other; (b) providing a heat dissipating structure; and (c) substantially integrally affixing the heat dissipating structure with the substrate at the second side.

Abstract translation: 公开了一种用于电气设备的包装。 电气设备包括多个电气部件; 该封装包括：（a）具有顶侧和底侧的第一电路板，并且具有布置在顶侧和底侧的至少一侧的多个部件的第一阵列; （b）与第一电路板电气和机械连接的第二电路板; 第二电路板具有第一侧和第二侧。 第一侧面向第一电路板的顶侧。 第二电路板具有布置在第一侧上的多个部件的第二阵列。 第二电路板优选地具有基本上一体地固定在第二侧上的至少一个散热结构。 优选地，第二面是金属基板，第一面与第二面电绝缘。 封装还可以包括一个电路板，其具有延伸基本上垂直于电路板的平面测量的间隔距离的整体连接结构。 当封装处于组装方向时，连接结构固定在另一个电路板上。 所述装置的制造方法包括以下步骤：（a）提供绝缘的金属基板，其具有彼此电绝缘的第一部件支承侧和第二金属侧; （b）提供散热结构; 和（c）在第二侧基本上整体地将散热结构与衬底相结合。