AUTOMOTIVE HEADLAMPS
    2.
    发明申请
    AUTOMOTIVE HEADLAMPS 有权
    汽车头灯

    公开(公告)号:US20120163008A1

    公开(公告)日:2012-06-28

    申请号:US13393777

    申请日:2010-08-25

    IPC分类号: B60Q1/04

    摘要: An automotive headlamp is provided with: a light-emitting module; a control circuit unit configured to control the lighting of the light-emitting module; a support substrate configured to support both the light-emitting module and the control circuit unit; and a reflector configured to reflect, through an inner surface of the reflector, light emitted by the light-emitting module and collect the reflected light. The support substrate is arranged in a manner such that the control circuit unit is positioned in a region outside the reflector.

    摘要翻译: 汽车前照灯设有:发光模块; 被配置为控制所述发光模块的点亮的控制电路单元; 支撑基板,被配置为支撑发光模块和控制电路单元; 以及反射器,被配置为通过反射器的内表面反射由发光模块发射的光并收集反射光。 支撑基板的布置方式使得控制电路单元位于反射器外部的区域中。

    Automotive headlamps
    8.
    发明授权
    Automotive headlamps 有权
    汽车前大灯

    公开(公告)号:US08833992B2

    公开(公告)日:2014-09-16

    申请号:US13393777

    申请日:2010-08-25

    IPC分类号: B60Q1/00

    摘要: An automotive headlamp is provided with: a light-emitting module; a control circuit unit configured to control the lighting of the light-emitting module; a support substrate configured to support both the light-emitting module and the control circuit unit; and a reflector configured to reflect, through an inner surface of the reflector, light emitted by the light-emitting module and collect the reflected light. The support substrate is arranged in a manner such that the control circuit unit is positioned in a region outside the reflector.

    摘要翻译: 汽车前照灯设有:发光模块; 被配置为控制所述发光模块的点亮的控制电路单元; 支撑基板,被配置为支撑发光模块和控制电路单元; 以及反射器,被配置为通过反射器的内表面反射由发光模块发射的光并收集反射光。 支撑基板的布置方式使得控制电路单元位于反射器外部的区域中。

    LIGHT EMITTING MODULE, FABRICATION METHOD THEREFOR, AND LAMP UNIT
    9.
    发明申请
    LIGHT EMITTING MODULE, FABRICATION METHOD THEREFOR, AND LAMP UNIT 审中-公开
    发光模块,其制造方法及灯具单元

    公开(公告)号:US20100177527A1

    公开(公告)日:2010-07-15

    申请号:US12684052

    申请日:2010-01-07

    IPC分类号: B60Q1/00 F21V9/00 H01J9/24

    摘要: In a light emitting module board, an electrode receiving the supply of current for light emission is provided in the light emitting surface of a semiconductor light emitting device. A light wavelength conversion member is a plate-like member mounted on the light emitting surface, and emits light after converting the wavelength of the light emitted by the semiconductor light emitting device. A relay electrode is provided in the surface of the light wavelength conversion member. The relay electrode extends from a position in contact with the electrode to an exposed position in the external space in a state where the light wavelength conversion member is mounted on the light emitting surface. The relay electrode is provided so that the upper part of the relay electrode, which is the exposed position, extends to a position located opposite to the lower part of the relay electrode which is the contacted position.

    摘要翻译: 在发光模块板中,在半导体发光元件的发光面设置有接受发光用电流的电极。 光波长转换构件是安装在发光表面上的板状构件,并且在转换由半导体发光器件发射的光的波长之后发光。 在光波长转换部件的表面设置有继电器电极。 在光波长转换部件安装在发光面上的状态下,继电器电极从与电极接触的位置延伸到外部空间的露出位置。 继电器电极被设置为使得作为暴露位置的继电器电极的上部延伸到与作为接触位置的继电器电极的下部相对的位置。