公开(公告)号：US10076029B2

公开(公告)日：2018-09-11

申请号：US14633582

申请日：2015-02-27

申请人： Ajinomoto Co., Inc.

发明人： Masanori Ohkoshi ,  Ikumi Sawa ,  Genjin Mago ,  Eiichi Hayashi

IPC分类号： H05K1/03 ,  C09J163/00 ,  H05K3/00 ,  B32B38/10 ,  B32B37/00 ,  B32B37/06 ,  B32B37/18 ,  H05K3/46 ,  C09J7/22 ,  C09J7/25 ,  C08K3/013

CPC分类号： H05K1/0373 ,  B32B37/025 ,  B32B37/06 ,  B32B2309/025 ,  B32B2457/08 ,  C08K3/013 ,  C09J7/22 ,  C09J7/255 ,  C09J163/00 ,  C09J2201/122 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2467/006 ,  H05K3/4673 ,  H05K2201/0209 ,  H05K2203/06 ,  Y10T428/24843 ,  Y10T428/2826

摘要： Printed wiring boards, in which the insulating layer exhibits excellent peel strength with respect to a conductive layer after a roughening treatment, even when using a resin composition having a high content of inorganic filler, may be obtained by: (A) laminating, onto an internal layer substrate, an adhesive sheet which includes a support and a resin composition layer in contact with the support, so that the resin composition layer is in contact with the internal layer substrate; (B) thermally curing the resin composition layer to form an insulating layer; and (C) removing the support, when the support satisfies certain conditions (TD1) and (TD2) in a TD direction thereof when it is heated under specific heating conditions.

公开(公告)号：US11482437B2

公开(公告)日：2022-10-25

申请号：US16824106

申请日：2020-03-19

申请人： Ajinomoto Co., Inc.

发明人： Masanori Ohkoshi ,  Hirohisa Narahashi ,  Eiichi Hayashi

IPC分类号： B32B7/06 ,  H01L21/683 ,  H05K3/46 ,  H05K3/00 ,  B32B37/06 ,  B32B37/12 ,  H01L21/48 ,  H01L23/14

摘要： A method for manufacturing a printed wiring board which includes: Step (A) of laminating an adhesive sheet including a support and a resin composition layer bonded to the support to an inner layer board so that the resin composition layer is bonded to the inner layer board; Step (B) of thermally curing the resin composition layer to form an insulating layer; and Step (C) of removing the support, in this order, in which the support satisfies a condition (MD1): a maximum expansion coefficient EMD in an MD direction at 120° C. or more is less than 0.2% and a condition (TD1): a maximum expansion coefficient ETD in a TD direction at 120° C. or more is less than 0.2% below, when being heated under predetermined heating conditions, does not lower the yield even when the insulating layer is formed by thermally curing the resin composition layer with a support attached to the resin composition layer.

公开(公告)号：US11121020B2

公开(公告)日：2021-09-14

申请号：US15485603

申请日：2017-04-12

申请人： Ajinomoto Co., Inc.

发明人： Masanori Ohkoshi ,  Hirohisa Narahashi ,  Eiichi Hayashi

IPC分类号： H01L21/683 ,  H05K3/46 ,  B32B37/06 ,  B32B37/12 ,  H01L21/48 ,  H01L23/14

摘要： A method for manufacturing a printed wiring board which includes: Step (A) of laminating an adhesive sheet including a support and a resin composition layer bonded to the support to an inner layer board so that the resin composition layer is bonded to the inner layer board; Step (B) of thermally curing the resin composition layer to form an insulating layer; and Step (C) of removing the support, in this order, in which the support satisfies a condition (MD1): a maximum expansion coefficient EMD in an MD direction at 120° C. or more is less than 0.2% and a condition (TD1): a maximum expansion coefficient ETD in a TD direction at 120° C. or more is less than 0.2% below, when being heated under predetermined heating conditions, does not lower the yield even when the insulating layer is formed by thermally curing the resin composition layer with a support attached to the resin composition layer.