公开(公告)号：US20240199222A1

公开(公告)日：2024-06-20

申请号：US18541527

申请日：2023-12-15

申请人： Airbus SAS

发明人： Timin JACOB ,  Ludovic YBANEZ ,  Matteo TASSISTO ,  Swapnil KHARCHE ,  Ravi Kiran SURAPANENI ,  Gowtham GALLA

IPC分类号： B64D37/32 ,  F17C13/04

CPC分类号： B64D37/32 ,  F17C13/04 ,  F17C2223/0161 ,  F17C2250/043

摘要： A cryogenic system configured to cool down components and including a housing and a thermal coupling system able to thermally connect a cryogenic fluid tank and the housing, the housing being airtight and being arranged to contain at least one component. The cryogenic system includes: an inert fluid tank, the inert fluid including at least one of the inert gas or nitrogen; a first opening connected to the inert fluid tank; a second opening connected to a relief valve configured to release gas from the housing when the pressure inside the housing exceeds a predefined pressure value; a third opening connected to an exhaust line, and a shut-off valve disposed on the exhaust line. The component is thus thermally and chemically isolated from the outside of the housing without using vacuum.

公开(公告)号：US20230420168A1

公开(公告)日：2023-12-28

申请号：US18341222

申请日：2023-06-26

申请人： Airbus SAS

发明人： Gerhard STEINER ,  Florian KAPAUN ,  Ludovic YBANEZ ,  Ravi Kiran SURAPANENI ,  Gowtham GALLA

IPC分类号： H01F6/06 ,  H01F5/06 ,  H01F41/04

CPC分类号： H01F6/06 ,  H01F5/06 ,  H01F41/048

摘要： An inductive component comprising an inductive element comprising a stack of an outer plurality of first strips of magnetic material, a central plurality of second strips of superconducting material, and an outer plurality of third strips of magnetic material, the inductive element being flexible and configured to form at least one loop of said stack of first strips, second strips and third strips, wound on itself. Also an inductive device and an aircraft with such an inductive component or device.

公开(公告)号：US20230378952A1

公开(公告)日：2023-11-23

申请号：US18317223

申请日：2023-05-15

申请人： Airbus SAS

发明人： Gerhard STEINER ,  Florian KAPAUN ,  Ludovic YBANEZ ,  Ravi Kiran SURAPANENI ,  Gowtham GALLA

IPC分类号： H03K17/14 ,  H03K17/18 ,  B60L3/00

CPC分类号： H03K17/145 ,  H03K17/18 ,  B60L3/0084 ,  B64D2221/00 ,  H03K2017/0806

摘要： An electronic circuit comprising a power transistor of the MOSFET type comprising a gate connected to a control circuit of the gate. The control circuit of the gate configured to operate at a temperature called ambient temperature, non-cryogenic. The power transistor as well as an interfacing circuit connected between said gate and said control circuit configured to operate at a cryogenic temperature. Each component of the interfacing circuit established at a maximum distance (L) from the power transistor. At least one measurement means configured to measure at least one measurement signal, representative of a junction temperature of the power transistor, is connected between the interfacing circuit operating at a cryogenic temperature and the control circuit operating at ambient temperature.

公开(公告)号：US20240096574A1

公开(公告)日：2024-03-21

申请号：US18470019

申请日：2023-09-19

申请人： Airbus SAS

发明人： Ludovic YBANEZ ,  Ravi Kiran SURAPANENI ,  Gowtham GALLA

IPC分类号： H01H33/666 ,  H01F6/04 ,  H01H85/055

CPC分类号： H01H33/666 ,  H01F6/04 ,  H01H85/055

摘要： A cryogenic fuse comprising a superconducting element arranged in a first chamber, the first chamber containing a cryogenic fluid, the cryogenic fuse being such that the superconducting element comprises a breaker initiation zone configured to determine a melting current and the first chamber is surrounded by a second chamber, placed under vacuum. The melting current or a melting time of the breakdown initiation zone may be adjusted.

公开(公告)号：US20230343676A1

公开(公告)日：2023-10-26

申请号：US18301721

申请日：2023-04-17

申请人： Airbus SAS

发明人： Gowtham GALLA ,  Ravi Kiran SURAPANENI ,  Ludovic YBANEZ ,  Florian KAPAUN ,  Gerhard STEINER

IPC分类号： H01L23/473 ,  H01L23/467 ,  H01L23/00 ,  B64D27/24 ,  B64D33/08

CPC分类号： H01L23/473 ,  H01L23/467 ,  H01L24/32 ,  B64D27/24 ,  B64D33/08 ,  H01L2224/32221 ,  H01L24/48 ,  H01L2224/48221 ,  H01L2224/48091

摘要： An electronic component with a substrate connected a plurality of connection pins and on one face of which is affixed an electronic die fixing layer, and at least one electronic die assembled on said electronic die fixing layer. The electronic component includes a first heat exchanger and a layer of thermally conductive and electrically insulating material arranged in contact with said substrate. The first heat exchanger receives a circulating cryogenic fluid, and the electronic die, the electronic die fixing layer, the substrate, and the layer of thermally conductive and electrically insulating material as well as one end of each of said connection pins are enveloped in a volume of electrically insulating material at cryogenic temperature.