公开(公告)号：US20240250030A1

公开(公告)日：2024-07-25

申请号：US18100570

申请日：2023-01-23

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Chien Lin CHANG CHIEN ,  Yuan-Chun TAI ,  Chiu-Wen LEE ,  Yu-Hsun CHANG ,  Tai-Yuan HUANG

IPC分类号： H01L23/532 ,  H01L23/31 ,  H01L23/498

CPC分类号： H01L23/5329 ,  H01L23/31 ,  H01L23/49816 ,  H01L28/10

摘要： An electronic device is provided. The electronic device includes an inductor and a dielectric layer. The inductor includes a first magnetic layer, a conductive trace over the first magnetic layer, and a second magnetic layer over the conductive trace. The dielectric layer includes a first portion between the second magnetic layer and an inclined surface of the first magnetic layer. A substantially constant distance between the second magnetic layer and the inclined surface of the first magnetic layer is defined by the dielectric layer.

公开(公告)号：US20240155758A1

公开(公告)日：2024-05-09

申请号：US17981338

申请日：2022-11-04

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Chien Lin CHANG CHIEN ,  Yuan-Chun TAI ,  Yu Hsin CHANG CHIEN ,  Chiu-Wen LEE ,  Chang Chi LEE

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC分类号： H05K1/0271 ,  H05K1/11 ,  H05K1/182 ,  H05K2201/068 ,  H05K2201/1003

摘要： An electronic device is provided. The electronic device includes a first dielectric layer, an electronic element, an encapsulant, and a second dielectric layer. The first dielectric layer has a first coefficient of thermal expansion (CTE). The electronic element is disposed over the first dielectric layer. The encapsulant encapsulates the electronic element and has a second CTE. The second dielectric layer is disposed over the encapsulant and having a third CTE. The second CTE ranges between the first CTE and the third CTE.