公开(公告)号：US20180114762A1

公开(公告)日：2018-04-26

申请号：US15299236

申请日：2016-10-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Ta CHIU ,  Chiu-Wen LEE ,  Dao-Long CHEN ,  Po-Hsien SUNG ,  Ping-Feng YANG ,  Kwang-Lung LIN

IPC: H01L23/60 ,  H01L23/31 ,  H01L23/06 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/60 ,  H01L21/56 ,  H01L21/565 ,  H01L23/06 ,  H01L23/10 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/552 ,  H01L24/49 ,  H01L2224/48091

Abstract: A semiconductor package structure includes a substrate, a semiconductor element, an encapsulant, an adhesion layer and a metal cap. The semiconductor element is disposed on the substrate. The encapsulant covers the semiconductor element. The adhesion layer is disposed on the encapsulant. The metal cap is attached to the encapsulant by the adhesion layer, and the metal cap is conformal with the encapsulant.