公开(公告)号：US20210356876A1

公开(公告)日：2021-11-18

申请号：US17386726

申请日：2021-07-28

Applicant: ASML NETHERLANDS B.V.

Inventor： Junichi KANEHARA

IPC: G03F9/00 ,  G03F7/20

Abstract: An exposure apparatus arranged to project a radiation beam onto a target portion of a substrate, the exposure apparatus having: a first substrate holder configured to hold the substrate; a second substrate holder configured to hold the substrate; a sensor holder configured to hold a sensor and/or detector; a first measurement device having a first alignment system having an alignment sensor configured to measure positions of a substrate alignment mark on the substrate; a second measurement device having a second alignment system having a further alignment sensor configured to measure positions of the substrate alignment mark on the substrate; a first scale arranged on a lower surface of the first substrate holder; and a first encoder head arranged to cooperate with the first scale, the first encoder head located beneath the first alignment system and held by a stationary support.

公开(公告)号：US20250028259A1

公开(公告)日：2025-01-23

申请号：US18908931

申请日：2024-10-08

Applicant: ASML Netherlands B.V.

Inventor： Junichi KANEHARA ,  Hans BUTLER ,  Paul Corné Henri DE WIT ,  Engelbertus Antonius Fransiscus VAN DER PASCH

IPC: G03F9/00 ,  G03F7/00

Abstract: A method of operating a lithographic apparatus that comprises: a projection system configured to provide exposure radiation for patterning a substrate underneath the projection system; a first stage configured to support a first substrate; a second stage configured to support a second substrate; and a third stage accommodating a component that includes at least one of a sensor and a cleaning device; wherein the method comprises starting a pre-exposure scrum sweep operation after starting a substrate exchange operation; wherein during the pre-exposure scrum sweep operation, the third stage moves away from underneath the projection system while the second stage moves to underneath the projection system; wherein during the substrate exchange operation, the first substrate is unloaded from the first stage.

公开(公告)号：US20210381826A1

公开(公告)日：2021-12-09

申请号：US17412525

申请日：2021-08-26

Applicant: ASML NETHERLANDS B.V.

Inventor： Franciscus Godefridus Casper BIJNEN ,  Junichi KANEHARA ,  Stefan Carolus Jacobus Antonius KEIJ ,  Thomas Augustus MATTAAR ,  Petrus Franciscus VAN GILS

IPC: G01B11/27

Abstract: In order to improve the throughput performance and/or economy of a measurement apparatus, the present disclosure provides a metrology apparatus including: a first measuring apparatus; a second measuring apparatus; a first substrate stage configured to hold a first substrate and/or a second substrate; a second substrate stage configured to hold the first substrate and/or the second substrate; a first substrate handler configured to handle the first substrate and/or the second substrate; and a second substrate handler configured to handle the first substrate and/or the second substrate, wherein the first substrate is loaded from a first, second or third FOUP, wherein the second substrate is loaded from the first, second or third FOUP, wherein the first measuring apparatus is an alignment measuring apparatus, and wherein the second measuring apparatus is a level sensor, a film thickness measuring apparatus or a spectral reflectance measuring apparatus.

公开(公告)号：US20240151520A1

公开(公告)日：2024-05-09

申请号：US18536402

申请日：2023-12-12

Applicant: ASML NETHERLANDS B.V.

Inventor： Franciscus Godefridus Casper BIJNEN ,  Junichi KANEHARA ,  Stefan Carolus Jacobus Antonius KEIJ ,  Thomas Augustus MATTAAR ,  Petrus Franciscus VAN GILS

IPC: G01B11/27

CPC classification number: G01B11/272

Abstract: In order to improve the throughput performance and/or economy of a measurement apparatus, the present disclosure provides a metrology apparatus including: a first measuring apparatus; a second measuring apparatus; a first substrate stage configured to hold a first substrate and/or a second substrate; a second substrate stage configured to hold the first substrate and/or the second substrate; a first substrate handler configured to handle the first substrate and/or the second substrate; and a second substrate handler configured to handle the first substrate and/or the second substrate, wherein the first substrate is loaded from a first, second or third FOUP, wherein the second substrate is loaded from the first, second or third FOUP, wherein the first measuring apparatus is an alignment measuring apparatus, and wherein the second measuring apparatus is a level sensor, a film thickness measuring apparatus or a spectral reflectance measuring apparatus.

公开(公告)号：US20180329292A1

公开(公告)日：2018-11-15

申请号：US15775602

申请日：2016-09-30

Applicant: ASML Netherlands B.V.

Inventor： Junichi KANEHARA ,  Hans BUTLER ,  Paul Cornè Henri DE WIT ,  Engelbertus Antonius Fransiscus VAN DER PASCH

IPC: G03F7/00 ,  G03F7/20 ,  G03F9/00

CPC classification number: G03F7/0002 ,  G03F7/70341 ,  G03F7/70733 ,  G03F7/70925 ,  G03F9/7042

Abstract: A method of operating a lithographic apparatus that comprises: a projection system configured to provide exposure radiation for patterning a substrate underneath the projection system; a first stage configured to support a first substrate; a second stage configured to support a second substrate; and a third stage accommodating a component that includes at least one of a sensor and a cleaning device; wherein the method comprises starting a pre-exposure scrum sweep operation after starting a substrate exchange operation; wherein during the pre-exposure scrum sweep operation, the third stage moves away from underneath the projection system while the second stage moves to underneath the projection system; wherein during the substrate exchange operation, the first substrate is unloaded from the first stage.