公开(公告)号：US10545410B2

公开(公告)日：2020-01-28

申请号：US16076743

申请日：2017-02-07

Applicant: ASML NETHERLANDS B.V.

Inventor： Hakki Ergun Cekli ,  Masashi Ishibashi ,  Leon Paul Van Dijk ,  Richard Johannes Franciscus Van Haren ,  Xing Lan Liu ,  Reiner Maria Jungblut ,  Cedric Marc Affentauschegg ,  Ronald Henricus Johannes Otten

IPC: G03B27/42 ,  G03F7/20 ,  G03F9/00

Abstract: A lithographic process includes clamping a substrate onto a substrate support, measuring positions across the clamped substrate, and applying a pattern to the clamped substrate using the positions measured. A correction is applied to the positioning of the applied pattern in localized regions of the substrate, based on recognition of a warp-induced characteristic in the positions measured across the substrate. The correction may be generated by inferring one or more shape characteristics of the warped substrate using the measured positions and other information. Based on the one or more inferred shape characteristics, a clamping model is applied to simulate deformation of the warped substrate in response to clamping. A correction is calculated based on the simulated deformation.

公开(公告)号：US10324379B2

公开(公告)日：2019-06-18

申请号：US15737400

申请日：2016-06-07

Applicant: ASML Netherlands B.V.

Inventor： Cedric Marc Affentauschegg ,  Milenko Jovanovic ,  Richard Johannes Franciscus Van Haren ,  Reiner Maria Jungblut ,  Robertus Wilhelmus Van Der Heijden

IPC: G03B27/68 ,  G03F7/20

Abstract: A method to form on a substrate a first target comprising a first feature and a second target comprising a second feature, wherein the forming of the targets comprises applying the first feature and the second feature to the substrate by projection of a radiation beam through a production patterning device installed in a lithographic apparatus, the features corresponding to one or more features of the patterning device, and controlling a configuration of the lithographic apparatus to induce an aberration component, such that the first feature is applied to the substrate using a first value of an induced aberration component and the second feature is applied to the substrate using a second, different value of the induced aberration component; measuring a property of the targets; and using the measurements to determine a sensitivity of the property of the targets to changes in value of the induced aberration component.