公开(公告)号：US20230244153A1

公开(公告)日：2023-08-03

申请号：US18000299

申请日：2021-04-19

Applicant: ASML Netherlands B.V.

Inventor： Andrey Valerievich ROGACHEVSKIY ,  Bastiaan Andreas Wilhelmus Hubertus KNARREN ,  Doru Cristian TORUMBA ,  Arjan GIJSBERTSEN ,  Cristina CARESIO ,  Raymund CENTENO ,  Tabitha Wangari KINYANJUI ,  Jan Arie DEN BOER

IPC: G03F9/00 ,  G06T7/246 ,  G01C5/00

CPC classification number: G03F9/7034 ,  G06T7/246 ,  G01C5/00 ,  G03F9/7046 ,  G03F9/7092 ,  G03F9/7026 ,  G03F9/7019

Abstract: The present invention provides a method for calculating a corrected substrate height map of a first substrate using a height level sensor. The method comprises: sampling the first substrate by means of the height level sensor with the first substrate moving with a first velocity, wherein the first velocity is a first at least partially non-constant velocity of the first substrate with respect to the height level sensor, to generate a first height level data, generating a first height map based on the first height level data, and calculating a corrected substrate height map by subtracting a correction map from the first height map, wherein the correction map is calculated from the difference between a first velocity height map and a second velocity height map.

公开(公告)号：US20220260933A1

公开(公告)日：2022-08-18

申请号：US17628959

申请日：2020-07-16

Applicant: ASML NETHERLANDS B.V.

Inventor： István NAGY ,  Özer DUMAN ,  Arjan GIJSBERTSEN ,  Pieter Jacob HERES ,  Rudolf Michiel HERMANS ,  Erik JANSEN ,  Thomas Augustus MATTAAR ,  Norbertus Josephus Martinus VAN DEN NIEUWELAAR ,  Petrus Franciscus VAN GILS

IPC: G03F9/00

Abstract: A method of determining a mark measurement sequence for an object comprising a plurality of marks, the method including: receiving location data for the plurality of marks that are to be measured; obtaining a boundary model of a positioning device used for performing the mark measurement sequence; and determining the mark measurement sequence based on the location data and the boundary model.

公开(公告)号：US20230333488A1

公开(公告)日：2023-10-19

申请号：US18027094

申请日：2021-08-20

Applicant: ASML NETHERLANDS B.V.

Inventor： Krijn Frederik BUSTRAAN ,  Arjan GIJSBERTSEN ,  Paul VAN DONGEN ,  Ibrahim ACAN

IPC: G03F7/20

CPC classification number: G03F7/70716

Abstract: A substrate holder to hold a substrate in a substrate holding position, the substrate holder including: a frame, multiple surface clamping devices arranged on the frame to clamp a substrate at an upper surface thereof, wherein the surface clamping devices each have a clamping pad to be arranged on the upper surface of the substrate, the surface clamping pads being movable with respect to each other at least in a first direction substantially perpendicular to the upper surface of a substrate held by the surface clamping pads, and one or more actuators to move the surface clamping pads with respect to each other in the first direction.

公开(公告)号：US20230204352A1

公开(公告)日：2023-06-29

申请号：US17923535

申请日：2021-03-29

Applicant: ASML Netherlands B.V.

Inventor： Arjan GIJSBERTSEN ,  Viktor TROGRLIC ,  Peter Fernand William Jos DENDAS ,  Mihaita POPINCIUC ,  Andrey Valerievich ROGACHEVSKIY

IPC: G01B11/30 ,  G01B11/16 ,  G01B11/24 ,  G03F7/00

CPC classification number: G01B11/30 ,  G01B11/16 ,  G01B11/24 ,  G03F7/0005 ,  G01B2210/56

Abstract: Systems, apparatuses, and methods are provided for generating level data. An example method can include receiving first level data for a first region of a substrate. The first region can include a first subregion having a first surface level, and a second subregion having a second surface level. The example method can further include generating, based on the first level data, measurement control map data. The example method can further include generating, based on the measurement control map data, second level data for a second region of the substrate. The second region can include a plurality of third subregions each having a third surface level equal to about the first surface level, and, optionally, no region having a surface level equal to about the second surface level.

公开(公告)号：US20220244651A1

公开(公告)日：2022-08-04

申请号：US17625466

申请日：2020-06-15

Applicant: ASML Netherlands B.V.

Inventor： Andrey Valerievich ROGACHEVSKIY ,  Martin Jules Marie-Emile DE NIVELLE ,  Arjan GIJSBERTSEN ,  Willem Richard PONGERS ,  Viktor TROGRLIC

IPC: G03F9/00 ,  G03F7/20

Abstract: An apparatus for measuring a height of a substrate for processing in a lithographic apparatus is disclosed. The apparatus comprises a first sensor for sensing a height of the substrate over a first area. The apparatus also comprises a second sensor for sensing a height of the substrate over a second area. The apparatus further comprises a processor adapted to normalize first data corresponding to a signal from the first sensor with a second sensor footprint to produce a first normalized height data, and to normalize second data corresponding to a signal from the second sensor with a first sensor footprint to produce a second normalized height data. The processor is adapted to determine a correction to a measured height of the substrate based on a difference between the first and second normalized height data.