公开(公告)号：US20180224754A1

公开(公告)日：2018-08-09

申请号：US15947409

申请日：2018-04-06

Applicant: Applied Materials, Inc.

Inventor： Viachslav BABAYAN ,  Ludovic GODET ,  Kyle M. HANSON ,  Robert B. MOORE

IPC: G03F7/20

CPC classification number: G03F7/70716 ,  G03F7/38 ,  G03F7/70725 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/67109 ,  H01L21/67126 ,  H01L21/67167 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/67248

Abstract: Implementations described herein relate to apparatus for post exposure processing. More specifically, implementations described herein relate to field-guided post exposure process chambers and cool down/development chambers used on process platforms. In one implementation, a plurality of post exposure process chamber and cool/down development chamber pairs are positioned on a process platform in a stacked arrangement and utilize a shared plumbing module. In another implementation, a plurality of post exposure process chamber and cool down/development chambers are positioned on a process platform in a linear arrangement and each of the chambers utilize an individually dedicated plumbing module.

公开(公告)号：US20190187563A1

公开(公告)日：2019-06-20

申请号：US16272962

申请日：2019-02-11

Applicant: Applied Materials, Inc.

Inventor： Viachslav BABAYAN ,  Douglas A. BUCHBERGER, JR. ,  Qiwei LIANG ,  Ludovic GODET ,  Srinivas D. NEMANI ,  Daniel J. WOODRUFF ,  Randy HARRIS ,  Robert B. MOORE

IPC: G03F7/20 ,  G03F7/38 ,  H01L21/687 ,  G03F7/16 ,  G03F7/26

CPC classification number: G03F7/2035 ,  G03F7/168 ,  G03F7/26 ,  G03F7/38 ,  H01L21/68764

Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.

公开(公告)号：US20180044781A1

公开(公告)日：2018-02-15

申请号：US15349433

申请日：2016-11-11

Applicant: Applied Materials, Inc.

Inventor： Michael STOWELL ,  Viachslav BABAYAN ,  Jingjing LIU ,  Zhong Qiang HUA

IPC: C23C14/34 ,  H01J37/34 ,  C23C14/35 ,  H01L21/683

Abstract: Embodiments presented herein relate to a pulse control system for a substrate processing system. The pulse control system includes a power source, a system controller, and a pulse shape controller. The pulse shape controller is coupled to the power source and in communication with the system controller. The pulse shape controller includes a first switch assembly and a second switch assembly. The first switch assembly includes a first switch having a first end and a second end. The first switch is configurable between an open state and a closed state. The second switch assembly includes a second switch having a first end and a second end. The first switch is in the closed state and the second switch is in the open state. The first switch in the closed state is configured to allow a pulse supplied by the power source to transfer through the pulse shape controller.

公开(公告)号：US20180217504A1

公开(公告)日：2018-08-02

申请号：US15940388

申请日：2018-03-29

Applicant: Applied Materials, Inc.

Inventor： Kyle M. HANSON ,  Gregory J. WILSON ,  Viachslav BABAYAN

IPC: G03F7/38 ,  H01L21/67 ,  C23C16/54 ,  C23C16/56 ,  H01L21/677

CPC classification number: G03F7/38 ,  C23C16/54 ,  C23C16/56 ,  H01L21/67011 ,  H01L21/6719 ,  H01L21/67751

Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. Electrodes may be disposed adjacent the process volume and process fluid is provided to the process volume via a plurality of fluid conduits to facilitate immersion field guided post exposure bake processes. A post process chamber for rinsing, developing, and drying a substrate is also provided.

公开(公告)号：US20180190518A1

公开(公告)日：2018-07-05

申请号：US15448060

申请日：2017-03-02

Applicant: Applied Materials, Inc.

Inventor： Ludovic GODET ,  Christine Y. OUYANG ,  Viachslav BABAYAN

IPC: H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67069 ,  H01L21/0273 ,  H01L21/67103 ,  H01L21/67126 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/6838 ,  H01L21/68785

Abstract: Implementations described herein relate to apparatus and methods for processing a substrate. More specifically, a process chamber having movable electrodes for generating a parallel field within a process volume filled with a fluid is provided. In one implementation, a major axis of the process chamber is oriented vertically and a substrate support is disposed opposite a plurality of movable electrodes extending along the major axis of the process chamber. In certain implementations, the substrate support is electrically floating and capable of rotating about a minor axis of the process chamber during processing of a substrate.

公开(公告)号：US20220004104A1

公开(公告)日：2022-01-06

申请号：US17468536

申请日：2021-09-07

Applicant: Applied Materials, Inc.

Inventor： Viachslav BABAYAN ,  Douglas A. BUCHBERGER, JR. ,  Qiwei LIANG ,  Ludovic GODET ,  Srinivas D. NEMANI ,  Daniel J. WOODRUFF ,  Randy HARRIS ,  Robert B. MOORE

IPC: G03F7/20 ,  G03F7/16 ,  G03F7/26 ,  G03F7/38 ,  H01L21/67 ,  G03F7/40 ,  H01L21/687

Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.

公开(公告)号：US20190088457A1

公开(公告)日：2019-03-21

申请号：US16043117

申请日：2018-07-23

Applicant: Applied Materials, Inc.

Inventor： Viachslav BABAYAN ,  Zhong Qiang HUA ,  Menglu WU ,  Adolph Miller ALLEN ,  Bhargav CITLA

IPC: H01J37/34 ,  C23C14/35 ,  C23C14/34

Abstract: Embodiments presented herein relate to a method of and apparatus for processing a substrate in a semiconductor processing system. The method begins by initializing a pulse synchronization controller coupled between a pulse RF bias generator and a HIPIMs generator. A first timing signal is sent by the pulse synchronization controller to the pulse RF bias generator and the HIPIMs generator. A sputtering target and an RF electrode disposed in a substrate support is energized based on the first timing signal. The target and the electrode is de-energized based on an end of the timing signal. A second timing signal is sent by the pulse synchronization controller to the pulse RF bias generator and the electrode is energized and de-energized without energizing the target in response to the second timing signal.

公开(公告)号：US20180004094A1

公开(公告)日：2018-01-04

申请号：US15196725

申请日：2016-06-29

Applicant: Applied Materials, Inc.

Inventor： Kyle M. HANSON ,  Gregory J. WILSON ,  Viachslav BABAYAN

IPC: G03F7/38

CPC classification number: G03F7/38 ,  C23C16/54 ,  C23C16/56 ,  H01L21/67011 ,  H01L21/6719 ,  H01L21/67751

Abstract: Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. Electrodes may be disposed adjacent the process volume and process fluid is provided to the process volume via a plurality of fluid conduits to facilitate immersion field guided post exposure bake processes. A post process chamber for rinsing, developing, and drying a substrate is also provided.

公开(公告)号：US20170088949A1

公开(公告)日：2017-03-30

申请号：US14957440

申请日：2015-12-02

Applicant: Applied Materials, Inc.

Inventor： Viachslav BABAYAN ,  Qiwei LIANG ,  Tobin KAUFMAN-OSBORN ,  Ludovic GODET ,  Srinivas D. NEMANI

IPC: C23C16/448 ,  C23C16/44 ,  C23C16/458 ,  H01L21/687 ,  C23C16/46

CPC classification number: C23C16/4485 ,  C23C16/4401 ,  C23C16/4411 ,  C23C16/45517 ,  C23C16/4586 ,  C23C16/46 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/67754 ,  H01L21/68707 ,  H01L21/68764 ,  H01L21/68771

Abstract: The present disclosure generally relate to a semiconductor processing apparatus. In one embodiment, a processing chamber is disclosed herein. The processing chamber includes a chamber body and lid defining an interior volume, the lid configured to support a housing having a cap, a substrate support disposed in the interior volume, a vaporizer coupled to the cap and having an outlet open to the interior volume of the processing chamber, wherein the vaporizer is configured to deliver a precursor gas to a processing region defined between the vaporizer and the substrate support, and a heater disposed adjacent to the vaporizer, wherein the heater is configured to heat the vaporizer.

公开(公告)号：US20210026257A1

公开(公告)日：2021-01-28

申请号：US17062326

申请日：2020-10-02

Applicant: Applied Materials, Inc.

Inventor： Viachslav BABAYAN ,  Ludovic GODET ,  Kyle M. HANSON ,  Robert B. MOORE

IPC: G03F7/20 ,  G03F7/38 ,  H01L21/67

Abstract: Implementations described herein relate to apparatus for post exposure processing. More specifically, implementations described herein relate to field-guided post exposure process chambers and cool down/development chambers used on process platforms. In one implementation, a plurality of post exposure process chamber and cool/down development chamber pairs are positioned on a process platform in a stacked arrangement and utilize a shared plumbing module. In another implementation, a plurality of post exposure process chamber and cool down/development chambers are positioned on a process platform in a linear arrangement and each of the chambers utilize an individually dedicated plumbing module.