公开(公告)号：US20240321620A1

公开(公告)日：2024-09-26

申请号：US18679357

申请日：2024-05-30

Applicant: Applied Materials, Inc.

Inventor： Vijay D. PARKHE ,  Steven E. BABAYAN ,  Konstantin MAKHRATCHEV ,  Zhiqiang GUO ,  Phillip R. SOMMER ,  Dan A. MAROHL

IPC: H01L21/683 ,  H01L21/67 ,  H05B1/02 ,  H05B3/02

CPC classification number: H01L21/6833 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/6831 ,  H05B1/023 ,  H05B1/0233 ,  H05B3/02

Abstract: Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heating assembly. The substrate support assembly comprises a body having a substrate support surface and a lower surface, one or more main resistive heaters disposed in the body, a plurality of spatially tunable heaters disposed in the body, and a spatially tunable heater controller coupled to the plurality of spatially tunable heaters, the spatially tunable heater controller configured to independently control an output one of the plurality of spatially tunable heaters relative to another of the plurality of spatially tunable heaters.

公开(公告)号：US20180061616A1

公开(公告)日：2018-03-01

申请号：US15687737

申请日：2017-08-28

Applicant: Applied Materials, Inc.

Inventor： Michael Thomas NICHOLS ,  Imad YOUSIF ,  John Anthony O'MALLEY, III ,  Steven E. BABAYAN

IPC: H01J37/32

CPC classification number: H01J37/32449 ,  H01J37/32715 ,  H01J37/32733 ,  H01J37/32834 ,  H01J37/32862 ,  H01J2237/006 ,  H01J2237/334

Abstract: Embodiments disclosed herein generally relate to a pumping system for a plasma processing apparatus. The pumping system includes a first pump path, a second pump path, a first valve, and a second valve. The first pump path couples an opening of a substrate support assembly of the processing chamber to an exhaust port of the processing chamber. The second pump path couples the opening of the substrate support assembly to an evacuation region of the processing chamber. The first valve is positioned in the first pump path. The first valve is configurable between a first state and a second state. The second valve is positioned in the second pump path. The second valve is configurable between the first state and the second state.

公开(公告)号：US20160027678A1

公开(公告)日：2016-01-28

申请号：US14717676

申请日：2015-05-20

Applicant: Applied Materials, Inc.

Inventor： Vijay D. PARKHE ,  Steven E. BABAYAN ,  Konstantin MAKHRATCHEV ,  Zhiqiang GUO ,  Phillip R. SOMMER ,  Dan A. MAROHL

IPC: H01L21/683 ,  H05B3/02

CPC classification number: H01L21/6833 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/6831 ,  H05B1/023 ,  H05B1/0233 ,  H05B3/02

Abstract: Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heating assembly. The substrate support assembly comprises a body having a substrate support surface and a lower surface, one or more main resistive heaters disposed in the body, a plurality of spatially tunable heaters disposed in the body, and a spatially tunable heater controller coupled to the plurality of spatially tunable heaters, the spatially tunable heater controller configured to independently control an output one of the plurality of spatially tunable heaters relative to another of the plurality of spatially tunable heaters.

公开(公告)号：US20240429088A1

公开(公告)日：2024-12-26

申请号：US18823303

申请日：2024-09-03

Applicant: Applied Materials, Inc.

Inventor： Michael R. RICE ,  Yogananda SARODE VISHWANATH ,  Sunil SRINIVASAN ,  Rajinder DHINDSA ,  Steven E. BABAYAN ,  Olivier LUERE ,  Denis Martin KOOSAU ,  Imad YOUSIF

IPC: H01L21/687 ,  H01J37/32 ,  H01L21/67 ,  H01L21/683

Abstract: Apparatuses including a height-adjustable edge ring, and methods for use thereof are described herein. In one example, a process kit for processing a substrate is provided. The process kit has a support ring comprising an upper surface having an inner edge disposed at a first height and an outward edge disposed at a second height less than the first height, the inner edge having a greater thickness than the outward edge. An edge ring is disposed on the support ring, an inner surface of the edge ring interfaced with the inner edge of the support ring. A cover ring is disposed outward of the edge ring, the edge ring independently moveable relative to the support ring and the cover ring. Push pins are disposed inward of the cover ring, the push pins operable to elevate the edge ring while constraining radial movement of the support ring.

公开(公告)号：US20210082730A1

公开(公告)日：2021-03-18

申请号：US16997300

申请日：2020-08-19

Applicant: Applied Materials, Inc.

Inventor： Yogananda SARODE VISHWANATH ,  Steven E. BABAYAN ,  Stephen Donald PROUTY ,  Alvaro Garcia DE GORORDO ,  Andreas SCHMID ,  Andrew Antoine NOUJAIM

IPC: H01L21/683 ,  H01J37/32

Abstract: Embodiments described herein relate to a substrate support assembly which enables a cryogenic temperature operation of an electrostatic chuck (ESC) so that a substrate disposed thereon is maintained at a cryogenic processing temperature suitable for processing while other surfaces of a processing chamber are maintained at a different temperature. The substrate support assembly includes an electrostatic chuck (ESC), an ESC base assembly coupled to the ESC having a base channel disposed therein, and a facility plate having a facility channel disposed therein. The facility plate includes a plate portion and a wall portion. The plate portion is coupled to the ESC base assembly and the wall portion coupled to the ESC with a seal assembly. A vacuum region is defined by the ESC, the ESC base assembly, the plate portion of the facility plate, the wall portion of the facility plate, and the seal assembly.

公开(公告)号：US20180144907A1

公开(公告)日：2018-05-24

申请号：US15405758

申请日：2017-01-13

Applicant: Applied Materials, Inc.

Inventor： Timothy Joseph FRANKLIN ,  Steven E. BABAYAN ,  Philip Allan KRAUS

IPC: H01J37/32 ,  B05B1/00 ,  B05B1/18 ,  B05B12/10

CPC classification number: H01J37/32449 ,  B05B1/005 ,  B05B1/18 ,  B05B12/10 ,  H01J37/32522 ,  H01J37/32981 ,  H01J2237/3341 ,  H01L21/67069 ,  H01L21/67248

Abstract: Embodiments described herein generally related to a substrate processing apparatus, and more specifically to an improved showerhead assembly for a substrate processing apparatus. The showerhead assembly includes a gas distribution plate and one or more temperature detection assemblies. The gas distribution plate includes a body having a top surface and a bottom surface. The one or more temperature detection assemblies are interfaced with the top surface of the gas distribution plate such that a thermal bond is formed between the gas distribution plate and each of the one or more temperature detection assemblies. Each temperature detection assembly includes a protruded feature and a temperature probe. The protruded feature is interfaced with the top surface of the gas distribution plate such that an axial load is placed on the gas distribution plate along an axis of the protruded feature. The temperature probe is positioned in a body of the protruded feature.

公开(公告)号：US20160329231A1

公开(公告)日：2016-11-10

申请号：US15212946

申请日：2016-07-18

Applicant: Applied Materials, Inc.

Inventor： Vijay D. PARKHE ,  Steven E. BABAYAN ,  Konstantin MAKHRATCHEV ,  Zhiqiang GUO ,  Phillip R. SOMMER ,  Dan A. MAROHL

IPC: H01L21/683 ,  H05B1/02 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/6831 ,  H05B1/023 ,  H05B1/0233 ,  H05B3/02

Abstract: Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heating assembly. The substrate support assembly comprises a body having a substrate support surface and a lower surface, one or more main resistive heaters disposed in the body, a plurality of spatially tunable heaters disposed in the body, and a spatially tunable heater controller coupled to the plurality of spatially tunable heaters, the spatially tunable heater controller configured to independently control an output one of the plurality of spatially tunable heaters relative to another of the plurality of spatially tunable heaters.

Abstract translation: 本文所述的实施方案提供了一种基板支撑组件，其能够实现静电卡盘和加热组件之间的热传递的侧向和方位调节。 基板支撑组件包括具有基板支撑表面和下表面的主体，设置在主体中的一个或多个主电阻加热器，设置在主体中的多个可空调的加热器，以及耦合到多个 空间可调谐加热器，空间可调加热器控制器被配置为相对于多个空间可调谐加热器中的另一个来独立地控制多个空间可调加热器中的输出一个。

公开(公告)号：US20220262664A1

公开(公告)日：2022-08-18

申请号：US17174591

申请日：2021-02-12

Applicant: Applied Materials, Inc.

Inventor： Yogananda SARODE VISHWANATH ,  Steven E. BABAYAN ,  Andreas SCHMID ,  Stephen Donald PROUTY ,  Andrew Antoine NOUJAIM

IPC: H01L21/683 ,  H05K7/20

Abstract: Embodiments described herein relate to a substrate support assembly. The substrate support assembly includes an ESC base assembly having a base channel disposed therein, a facility plate, the facility plate coupled to the ESC base assembly with a vacuum region therebetween, and a seal assembly. The seal assembly includes an upper flange coupled to the base channel of the ESC base assembly, the upper flange disposed in the facility plate, a lower flange coupled to the upper flange, the lower flange disposed in the facility plate, a gasket disposed between the upper flange and the lower flange, and an insulator tube coupled to the lower flange. A passage is connected to the base channel, the passage is defined by connected openings of the upper flange, the gasket, the lower flange, the insulator tube, and the base assembly.

公开(公告)号：US20200185248A1

公开(公告)日：2020-06-11

申请号：US16217036

申请日：2018-12-11

Applicant: Applied Materials, Inc.

Inventor： Yogananda SARODE VISHWANATH ,  Steven E. BABAYAN ,  Stephen Donald PROUTY ,  Álvaro GARCÍA DE GORORDO ,  Andreas SCHMID ,  Andrew Antoine NOUJAIM

IPC: H01L21/683 ,  H01L21/67

Abstract: Embodiments described herein relate to a substrate support assembly which enables a cryogenic temperature operation of an electrostatic chuck (ESC) so that a substrate disposed thereon is maintained at a cryogenic processing temperature suitable for processing while other surfaces of a processing chamber are maintained at a different temperature. The substrate support assembly includes an electrostatic chuck (ESC), an ESC base assembly coupled to the ESC having a refrigerant channel disposed therein, and a facility plate having a coolant channel disposed therein. The facility plate includes a plate portion and a flange portion. The plate portion is coupled to the ESC base assembly and the flange portion coupled to the ESC with a seal assembly. A vacuum region is defined by the ESC, the ESC base assembly, the plate portion of the facility plate, the flange portion of the facility plate, and the seal assembly.

公开(公告)号：US20200037399A1

公开(公告)日：2020-01-30

申请号：US16595801

申请日：2019-10-08

Applicant: Applied Materials, Inc.

Inventor： Chunlei ZHANG ,  Phillip CRIMINALE ,  Steven E. BABAYAN ,  David ULLSTROM

IPC: H05B1/02 ,  H01L21/67 ,  H01L21/683 ,  H01L21/66

Abstract: Implementations described herein provide a method for processing a substrate on a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a substrate. The method includes processing a first substrate using a first temperature profile on a substrate support assembly having primary heaters and spatially tunable heaters. A deviation profile is determined from a result of processing the first substrate. The spatially tunable heaters are controlled in response to the deviation profile to enable discrete lateral and azimuthal tuning of local hot or cold spots on the substrate support assembly in forming a second temperature profile. A second substrate is then processed using the second temperature profile.