Invention Publication
- Patent Title: TUNABLE TEMPERATURE CONTROLLED SUBSTRATE SUPPORT ASSEMBLY
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Application No.: US18679357Application Date: 2024-05-30
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Publication No.: US20240321620A1Publication Date: 2024-09-26
- Inventor: Vijay D. PARKHE , Steven E. BABAYAN , Konstantin MAKHRATCHEV , Zhiqiang GUO , Phillip R. SOMMER , Dan A. MAROHL
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67 ; H05B1/02 ; H05B3/02

Abstract:
Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heating assembly. The substrate support assembly comprises a body having a substrate support surface and a lower surface, one or more main resistive heaters disposed in the body, a plurality of spatially tunable heaters disposed in the body, and a spatially tunable heater controller coupled to the plurality of spatially tunable heaters, the spatially tunable heater controller configured to independently control an output one of the plurality of spatially tunable heaters relative to another of the plurality of spatially tunable heaters.
Information query
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