公开(公告)号：US20150348823A1

公开(公告)日：2015-12-03

申请号：US14450241

申请日：2014-08-02

Applicant: APPLIED MATERIALS, INC.

Inventor： BONNIE T. CHIA ,  JALLEPALLY RAVI ,  MANJUNATHA KOPPA ,  VINOD KONDA PURATHE ,  CHENG-HSIUNG MATTHEW TSAI ,  ARAVIND MIYAR KAMATH

IPC: H01L21/687

Abstract: Embodiments of lift pin assemblies are provided herein. In some embodiments, a lift pin assembly includes an elongate base formed of a first material and having a first feature formed in a distal end of the base to interface with and removably support a tip; and a tip formed of a second material different than the first material and having a support surface on a first side of the tip and an opposing second side of the tip, wherein the opposing second side includes a second feature to mate with the first feature of the base to removably retain the tip on the distal end of the base.

Abstract translation: 本文提供了提升销组件的实施例。 在一些实施例中，提升销组件包括由第一材料形成的细长基部，并且具有形成在基部的远端中的第一特征以与尖端相接合并可拆卸地支撑尖端; 以及由与所述第一材料不同的第二材料形成的尖端，并且在所述尖端的第一侧上具有支撑表面和所述尖端的相对的第二侧，其中所述相对的第二侧包括与所述第一特征相配合的第二特征 基部可移除地将尖端保持在基部的远端上。

公开(公告)号：US20180233396A1

公开(公告)日：2018-08-16

申请号：US15468509

申请日：2017-03-24

Applicant: APPLIED MATERIALS, INC.

Inventor： TOMOHARU MATSUSHITA ,  ARAVIND KAMATH ,  JALLEPALLY RAVI ,  CHENG-HSIUNG TSAI ,  HIROYUKI TAKAHAMA

IPC: H01L21/683 ,  H01L21/68 ,  G01L21/00

CPC classification number: H01L21/6838 ,  G01L21/02 ,  H01L21/67253

Abstract: Methods and apparatus for substrate position calibration for substrate supports in substrate processing systems are provided herein. In some embodiments, a method for positioning a substrate on a substrate support includes: obtaining a plurality of backside pressure values corresponding to a plurality of different substrate positions on a substrate support by repeatedly placing a substrate in a position on the substrate support, and vacuum chucking the substrate to the substrate support and measuring a backside pressure; and analyzing the plurality of backside pressure values to determine a calibrated substrate position.

公开(公告)号：US20160240426A1

公开(公告)日：2016-08-18

申请号：US15019573

申请日：2016-02-09

Applicant: APPLIED MATERIALS, INC.

Inventor： ARAVIND MIYAR KAMATH ,  CHENG-HSIUNG TSAI ,  JALLEPALLY RAVI ,  TOMOHARU MATSUSHITA ,  YU CHANG

IPC: H01L21/687 ,  H01L21/67

CPC classification number: H01L21/67248 ,  H01J37/32082 ,  H01J37/32532 ,  H01J37/32724 ,  H01L21/67103 ,  H01L21/68792

Abstract: Apparatus for processing a substrate are provided herein. In some embodiments, a substrate support includes a body having a support surface; an RF electrode disposed in the body proximate the support surface to receive RF current from an RF source; a shaft to support the body; a conductive element having an interior volume and extending through the shaft, wherein the conductive element is coupled to the RF electrode; and an RF gasket; wherein the conductive element includes features that engage the RF gasket to return the RF current to ground.

Abstract translation: 本文提供了用于处理基板的装置。 在一些实施例中，衬底支撑件包括具有支撑表面的本体; RF电极，设置在靠近支撑表面的本体中以从RF源接收RF电流; 轴支撑身体; 具有内部体积并延伸穿过所述轴的导电元件，其中所述导电元件耦合到所述RF电极; 和RF垫片; 其中所述导电元件包括​​接合所述RF垫圈以将所述RF电流返回地面的特征。

公开(公告)号：US20160002778A1

公开(公告)日：2016-01-07

申请号：US14476238

申请日：2014-09-03

Applicant: APPLIED MATERIALS, INC.

Inventor： JALLEPALLY RAVI ,  TOMOHARU MATSUSHITA ,  ARAVIND MIYAR KAMATH ,  XIAOXIONG YUAN ,  CHENG-HSIUNG MATTHEW TSAI ,  MANJUNATHA KOPPA

IPC: C23C16/458 ,  C23C16/455 ,  C23C16/46

CPC classification number: C23C16/455 ,  C23C16/4586

Abstract: Embodiments of substrate supports are provided herein. In some embodiments, a substrate support may include a first plate for supporting a substrate, the first plate having a plurality of purge gas channels on its backside; a second plate disposed beneath and supporting the first plate; and an edge ring surrounding the first plate and disposed above the second plate, wherein the plurality of purge gas channels extend from a single inlet in a central portion to a plurality of outlets at a periphery of the first plate, and wherein the plurality of purge gas channels have a substantially equal flow conductance.

Abstract translation: 本文提供了基板支撑件的实施例。 在一些实施例中，衬底支撑件可以包括用于支撑衬底的第一板，第一板在其背面具有多个吹扫气体通道; 设置在第一板下方并支撑第一板的第二板; 以及围绕所述第一板并设置在所述第二板上方的边缘环，其中所述多个吹扫气体通道从所述第一板的周边处的中心部分中的单个入口延伸到多个出口，并且其中所述多个吹扫 气体通道具有基本相等的流动电导。

公开(公告)号：US20150203960A1

公开(公告)日：2015-07-23

申请号：US14600915

申请日：2015-01-20

Applicant: APPLIED MATERIALS, INC

Inventor： SRINIVASA YEDLA ,  SUNDARAPANDIAN REDDY ,  UDAY PAI ,  KIRANKUMAR SAVANDAIAH ,  THANH X. NGUYEN ,  MUHAMMAD M. RASHEED ,  JALLEPALLY RAVI

IPC: C23C14/50 ,  B25B5/08

CPC classification number: H01J37/3435

Abstract: Embodiments of target retaining apparatus and substrate processing chambers incorporating same are provided herein. In some embodiments, a target retaining apparatus includes a housing including a first slot and a second slot; a cam movably disposed in the housing, wherein movement of the cam is constrained along the first slot; a retaining arm movably coupled to the cam, wherein movement of the retaining arm is constrained along the second slot; a linking member including a first end rotatably coupled to the cam and a second end rotatably coupled to the retaining arm; and a biasing element biasing the cam towards a first position in which the retaining arm extends away from the housing.

Abstract translation: 本文提供了包含相同的目标保持装置和基板处理室的实施例。 在一些实施例中，目标保持装置包括壳体，其包括第一槽和第二槽; 可移动地设置在所述壳体中的凸轮，其中所述凸轮的运动沿着所述第一狭槽被限制; 可移动地联接到所述凸轮的保持臂，其中所述保持臂的运动沿着所述第二狭槽被限制; 连接构件，其包括可旋转地联接到所述凸轮的第一端和可旋转地联接到所述保持臂的第二端; 以及将所述凸轮偏压到所述保持臂远离所述壳体延伸的第一位置的偏压元件。