公开(公告)号：US20180233396A1

公开(公告)日：2018-08-16

申请号：US15468509

申请日：2017-03-24

Applicant: APPLIED MATERIALS, INC.

Inventor： TOMOHARU MATSUSHITA ,  ARAVIND KAMATH ,  JALLEPALLY RAVI ,  CHENG-HSIUNG TSAI ,  HIROYUKI TAKAHAMA

IPC: H01L21/683 ,  H01L21/68 ,  G01L21/00

CPC classification number: H01L21/6838 ,  G01L21/02 ,  H01L21/67253

Abstract: Methods and apparatus for substrate position calibration for substrate supports in substrate processing systems are provided herein. In some embodiments, a method for positioning a substrate on a substrate support includes: obtaining a plurality of backside pressure values corresponding to a plurality of different substrate positions on a substrate support by repeatedly placing a substrate in a position on the substrate support, and vacuum chucking the substrate to the substrate support and measuring a backside pressure; and analyzing the plurality of backside pressure values to determine a calibrated substrate position.