公开(公告)号：US20150348823A1

公开(公告)日：2015-12-03

申请号：US14450241

申请日：2014-08-02

Applicant: APPLIED MATERIALS, INC.

Inventor： BONNIE T. CHIA ,  JALLEPALLY RAVI ,  MANJUNATHA KOPPA ,  VINOD KONDA PURATHE ,  CHENG-HSIUNG MATTHEW TSAI ,  ARAVIND MIYAR KAMATH

IPC: H01L21/687

Abstract: Embodiments of lift pin assemblies are provided herein. In some embodiments, a lift pin assembly includes an elongate base formed of a first material and having a first feature formed in a distal end of the base to interface with and removably support a tip; and a tip formed of a second material different than the first material and having a support surface on a first side of the tip and an opposing second side of the tip, wherein the opposing second side includes a second feature to mate with the first feature of the base to removably retain the tip on the distal end of the base.

Abstract translation: 本文提供了提升销组件的实施例。 在一些实施例中，提升销组件包括由第一材料形成的细长基部，并且具有形成在基部的远端中的第一特征以与尖端相接合并可拆卸地支撑尖端; 以及由与所述第一材料不同的第二材料形成的尖端，并且在所述尖端的第一侧上具有支撑表面和所述尖端的相对的第二侧，其中所述相对的第二侧包括与所述第一特征相配合的第二特征 基部可移除地将尖端保持在基部的远端上。