公开(公告)号：US20140251374A1

公开(公告)日：2014-09-11

申请号：US13785834

申请日：2013-03-05

Applicant: APPLIED MATERIALS, INC.

Inventor： JAMES MATTHEW HOLDEN ,  SONG-MOON SUH ,  SHALINA D. SUDHEERAN ,  GLEN T. MORI

IPC: H01L21/02

CPC classification number: H01L21/02101 ,  H01L21/02057 ,  H01L21/0209 ,  H01L21/67051

Abstract: A substrate cleaning apparatus may include a substrate support member to support a substrate having a first side and a contaminated second side; a liquid carbon dioxide source; a gaseous carbon dioxide source; and one or more nozzles coupled to the liquid carbon dioxide source and to the gaseous carbon dioxide source, wherein the one or more nozzles are configured to receive liquid carbon dioxide and to discharge a first mixture of solid and gaseous carbon dioxide from the liquid carbon dioxide source to the second side of the substrate and to receive gaseous carbon dioxide and to discharge a second mixture of solid and gaseous carbon dioxide from the gaseous carbon dioxide source to the second side of the substrate. Methods of cleaning a substrate may be performed in the substrate cleaning apparatus.

Abstract translation: 基板清洁装置可以包括用于支撑具有第一侧和受污染的第二侧的基板的基板支撑构件; 液态二氧化碳源; 气态二氧化碳源; 以及耦合到液体二氧化碳源和气态二氧化碳源的一个或多个喷嘴，其中所述一个或多个喷嘴构造成接收液态二氧化碳并且从液态二氧化碳排出固体和气态二氧化碳的第一混合物 源至衬底的第二侧并接收气态二氧化碳，并将固体和气态二氧化碳的第二混合物从气态二氧化碳源排放到衬底的第二侧。 可以在基板清洗装置中进行清洗基板的方法。

公开(公告)号：US20140196848A1

公开(公告)日：2014-07-17

申请号：US13742692

申请日：2013-01-16

Applicant: APPLIED MATERIALS, INC.

Inventor： BONNIE T. CHIA ,  SONG-MOON SUH ,  CHENG-HSIUNG MATTHEW TSAI ,  ROBERT DINSMORE ,  GLEN T. MORI

IPC: B05C21/00

CPC classification number: H01J37/32715 ,  C23C14/564 ,  H01J37/32477 ,  H01J37/32853 ,  H01J37/3405 ,  H01J37/3417 ,  H01J37/3423 ,  H01J37/3447

Abstract: Shutter disks for use in process chambers are provided herein. In some embodiments, a shutter disk for use in a process chamber may include a body having an outer perimeter, a top surface of the body, wherein the top surface includes a central portion having a substantially horizontal planar surface, and at least one angled structure disposed radially outward of the central portion, each of the at least one angled structure having a top portion and an angled surface disposed at a downward angle in a radially outward direction from the top portion toward the outer perimeter, and a bottom surface of the body.

Abstract translation: 本文提供了用于处理室的快门盘。 在一些实施例中，用于处理室的快门盘可以包括具有外周边，主体顶表面的主体，其中顶表面包括具有基本上水平的平面表面的中心部分，以及至少一个倾斜结构 设置在所述中心部分的径向外侧，所述至少一个倾斜结构中的每一个具有顶部和从所述顶部朝向所述外周边沿径向向外的方向以向下的角度设置的成角度的表面，以及所述主体的底表面 。

公开(公告)号：US20140068962A1

公开(公告)日：2014-03-13

申请号：US13960236

申请日：2013-08-06

Applicant: APPLIED MATERIALS, Inc.

Inventor： GLEN T. MORI ,  Yueh Sheng Ow

IPC: H01L21/02 ,  H01L21/768

CPC classification number: H01L21/0206 ,  H01L21/31058 ,  H01L21/67115 ,  H01L21/67184 ,  H01L21/67207 ,  H01L21/76826 ,  H01L21/76828 ,  H01L23/00 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Methods and apparatus for processing a substrate are described herein. A vacuum multi-chamber deposition tool can include a degas chamber with both a heating mechanism and a variable frequency microwave source. A method for degassing a substrate can include positioning a substrate comprising a polymer or an epoxy within a processing chamber maintained between a degas temperature and a glass transition temperature, exposing the substrate to variable frequency microwave radiation, exposing the substrate to a plasma comprising an inert gas, removing oxygen containing compounds from the chamber, raising the pressure of inert gas in the chamber, and maintaining the pressure of inert gas while cooling the substrate to a temperature lower than the degas temperature.

Abstract translation: 本文描述了用于处理衬底的方法和设备。 真空多室沉积工具可以包括具有加热机构和可变频率微波源的脱气室。 用于对衬底进行脱气的方法可以包括将包含聚合物或环氧树脂的衬底定位在维持在脱气温度和玻璃化转变温度之间的处理室内，将衬底暴露于可变频微波辐射，将衬底暴露于包含惰性的等离子体 气体，从室中除去含氧化合物，提高室中惰性气体的压力，并且在将衬底冷却至低于脱气温度的温度的同时保持惰性气体的压力。