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    NON-UNIFORM DIELECTRIC LAYER CAPACITOR FOR VIBRATION AND ACOUSTICS IMPROVEMENT
    1.
    发明申请
    NON-UNIFORM DIELECTRIC LAYER CAPACITOR FOR VIBRATION AND ACOUSTICS IMPROVEMENT 有权
    用于振动和声学改进的非均匀电介质层电容器

    公开(公告)号：US20150243440A1

    公开(公告)日：2015-08-27

    申请号：US14285461

    申请日：2014-05-22

    Applicant: Apple Inc.

    Inventor： Zhong-Qing Gong ,  Kevin R. Richardson ,  Yanchu Xu ,  Connor R. Duke ,  Benjamin A. Bard

    IPC: H01G4/30 ,  H05K3/30 ,  H01G4/255 ,  H01G4/005 ,  H01G4/12 ,  H05K1/18

    CPC classification number: H01G4/30 ,  H01G4/005 ,  H01G4/12 ,  H01G4/255 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/611 ,  Y10T29/435

    Abstract: A Non-Uniform Dielectric Layer, Multi-Layer-Ceramic-Capacitor (MLCC) has upper and lower dielectric layers separating upper and lower electrode layers, where the lower dielectric layers have a greater vertical thickness than the upper dielectric layers to reduce piezoelectric effect driven capacitor reaction forces on a printed circuit board (PCB) on which the capacitor is mounted. Such an MLCC may include an upper set of dielectric layers that separate adjacent pairs of upper electrode layers in a top portion of the MLCC, and a lower set of dielectric layers that separate adjacent pairs of lower electrode layers in a bottom portion of the MLCC. A bottom portion of the MLCC may be mounted on a PCB. The thickness of the lower dielectric layers may be between 1.5 and 3.5 times greater than the upper dielectric layers to reduce piezoelectric effect driven capacitor reaction forces in the audio range of human hearing.

    Abstract translation: 非均匀电介质层，多层陶瓷电容器（MLCC）具有分隔上下电极层的上下电介质层，其中下电介质层具有比上电介质层更大的垂直厚度，以减少压电效应驱动 在其上安装电容器的印刷电路板（PCB）上的电容器反作用力。 这样的MLCC可以包括在MLCC的顶部分隔相邻的上电极层对的上部介电层和在MLCC的底部分隔相邻的下电极层对的下组电介质层。 MLCC的底部可以安装在PCB上。 下电介质层的厚度可以是上电介质层的1.5至3.5倍，以减少在人类听觉的音频范围内的压电效应驱动的电容器反作用力。

    Non-uniform dielectric layer capacitor for vibration and acoustics improvement
    5.
    发明授权
    Non-uniform dielectric layer capacitor for vibration and acoustics improvement 有权
    用于振动和声学改进的非均匀介质层电容器

    公开(公告)号：US09330849B2

    公开(公告)日：2016-05-03

    申请号：US14285461

    申请日：2014-05-22

    Applicant: Apple Inc.

    Inventor： Zhong-Qing Gong ,  Kevin R. Richardson ,  Yanchu Xu ,  Connor R. Duke ,  Benjamin A. Bard

    IPC: H01G4/30 ,  H01G4/12 ,  H05K1/18 ,  H01G4/255 ,  H01G4/005 ,  H05K3/34

    CPC classification number: H01G4/30 ,  H01G4/005 ,  H01G4/12 ,  H01G4/255 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/611 ,  Y10T29/435

    Abstract: A Non-Uniform Dielectric Layer, Multi-Layer-Ceramic-Capacitor (MLCC) has upper and lower dielectric layers separating upper and lower electrode layers, where the lower dielectric layers have a greater vertical thickness than the upper dielectric layers to reduce piezoelectric effect driven capacitor reaction forces on a printed circuit board (PCB) on which the capacitor is mounted. Such an MLCC may include an upper set of dielectric layers that separate adjacent pairs of upper electrode layers in a top portion of the MLCC, and a lower set of dielectric layers that separate adjacent pairs of lower electrode layers in a bottom portion of the MLCC. A bottom portion of the MLCC may be mounted on a PCB. The thickness of the lower dielectric layers may be between 1.5 and 3.5 times greater than the upper dielectric layers to reduce piezoelectric effect driven capacitor reaction forces in the audio range of human hearing.

    Abstract translation: 非均匀电介质层，多层陶瓷电容器（MLCC）具有分隔上下电极层的上下电介质层，其中下电介质层具有比上电介质层更大的垂直厚度，以减少压电效应驱动 在其上安装电容器的印刷电路板（PCB）上的电容器反作用力。 这样的MLCC可以包括在MLCC的顶部分隔相邻的上电极层对的上部介电层和在MLCC的底部分隔相邻的下电极层对的下组电介质层。 MLCC的底部可以安装在PCB上。 下电介质层的厚度可以是上电介质层的1.5至3.5倍，以减少在人类听觉的音频范围内的压电效应驱动的电容器反作用力。

    MULTI-LAYER CAPACITOR HAVING UPPER AND LOWER PORTIONS WITH DIFFERENT DIELECTRIC LAYER MATERIALS TO REDUCE ACOUSTIC VIBRATION
    7.
    发明申请
    MULTI-LAYER CAPACITOR HAVING UPPER AND LOWER PORTIONS WITH DIFFERENT DIELECTRIC LAYER MATERIALS TO REDUCE ACOUSTIC VIBRATION 审中-公开
    具有不同介质层材料的上层和下层的多层电容器可减少声振动

    公开(公告)号：US20160351330A1

    公开(公告)日：2016-12-01

    申请号：US14721956

    申请日：2015-05-26

    Applicant: APPLE INC.

    Inventor： Zhong-Qing Gong ,  Kevin R. Richardson ,  Connor R. Duke ,  Yanchu Xu ,  Benjamin A. Bard

    IPC: H01G4/12 ,  H05K3/30 ,  H01G4/236 ,  H05K1/18 ,  H01G4/30 ,  H01G4/012

    CPC classification number: H01G4/1227 ,  H01G2/06 ,  H01G4/30

    Abstract: A multi-layer capacitor such as a multi-layer-ceramic-capacitor (MLCC) has upper and lower dielectric layers separating upper and lower electrode layers, where the lower dielectric layers have a lower dielectric constant than the upper dielectric layers to reduce piezoelectric effect driven capacitor reaction forces on a printed circuit board (PCB) on which the capacitor is mounted. Such an MLCC may include the upper dielectric and electrode layers in a top portion of the MLCC; and the lower dielectric and electrode layers in a bottom portion of the MLCC. A bottom portion of the MLCC may be mounted on a PCB. As an example, the dielectric constant value of the lower dielectric layers may be between 1.5 and 3.5 times less than that of the upper dielectric layers to reduce piezoelectric effect driven capacitor reaction forces in the audio range of human hearing. Other embodiments are also described and claimed.

    Abstract translation: 诸如多层陶瓷电容器（MLCC）的多层电容器具有分隔上电极层和下电极层的上下电介质层，其中下介电层具有比上电介质层更低的介电常数以降低压电效应 驱动电容器反作用力在印刷电路板（PCB）上，其上安装有电容器。 这样的MLCC可以包括在MLCC的顶部的上电介质层和电极层; 以及MLCC的底部中的下部电介质层和电极层。 MLCC的底部可以安装在PCB上。 作为示例，下电介质层的介电常数值可以是上电介质层的介电常数值的1.5至3.5倍以减少在人类听觉的音频范围内的压电效应驱动的电容器反作用力。 还描述和要求保护其他实施例。

    HEEL FILLET CAPACITOR WITH NOISE REDUCTION
    8.
    发明申请
    HEEL FILLET CAPACITOR WITH NOISE REDUCTION 审中-公开
    具有噪音降低功能的HEEL FILLET CAPACITOR

    公开(公告)号：US20150364253A1

    公开(公告)日：2015-12-17

    申请号：US14500794

    申请日：2014-09-29

    Applicant: Apple Inc.

    Inventor： Shawn X. Arnold ,  Dennis R. Pyper ,  Gang Ning ,  Meng Chi Lee ,  Sascha Tietz ,  Sury N. Darbha ,  Zhong-Qing Gong

    IPC: H01G2/06 ,  G10K11/16 ,  H01G4/12 ,  H05K3/34 ,  H05K1/18

    CPC classification number: H01G2/065 ,  G10K11/16 ,  H01G4/232 ,  H01G4/30 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/094 ,  H05K2201/09427 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

    Abstract: Apparatus and methods are described for coupling a circuit component having piezoelectric properties, such as a ceramic capacitor, to a printed circuit board (PCB) by forming a first solder heel fillet and a second solder heel fillet that fixedly couple the circuit component to the PCB, where the first and second solder heel fillets have a height z that is less than a height h of the circuit component to reduce acoustic noise at the PCB caused by coupling the circuit component to the PCB. In various configurations, the first solder heel fillet and the second solder heel fillet can each fixedly coupled to: a bottom surface of the circuit component, a top surface of the PCB at a first solder pad and a second solder pad thereof, and a lower portion of each of a multiple side surfaces of the circuit component.

    Abstract translation: 描述了用于将具有压电特性的电路部件（例如陶瓷电容器）耦合到印刷电路板（PCB）的装置和方法，该方法通过形成将电路部件固定地耦合到PCB的第一焊脚跟内圆角和第二焊脚跟内圆角 其中第一和第二焊脚后视角具有低于电路部件的高度h的高度z，以减小由于将电路部件耦合到PCB而导致的PCB处的声学噪声。 在各种配置中，第一焊脚跟内圆角和第二焊脚跟内圆角可以各自固定地连接到：电路部件的底表面，PCB的顶表面处于第一焊盘和第二焊垫，下部 电路部件的多个侧表面中的每一个的部分。

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