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公开(公告)号：US09786609B2
公开(公告)日：2017-10-10
申请号：US14072572
申请日：2013-11-05
Applicant: ANALOG DEVICES GLOBAL
Inventor： Oliver J Kierse , Frank Poucher , Michael J Cusack , Padraig L Fitzgerald , Patrick Elebert
CPC classification number: H01L23/562 , H01L21/56 , H01L23/16 , H01L23/295 , H01L23/31 , H01L23/3107 , H01L2224/05554 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
Abstract: A stress shield for a plastic integrated circuit package is disclosed. A shield plate is attached by an adhesive to a top surface of an integrated circuit die such that the shield plate covers less than all of the top surface and leaves bond pads exposed. A molding material is applied over the shield plate and the integrated circuit die. The shield plate shields the integrated circuit die from stresses imparted by the molding material.
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公开(公告)号：US09299692B2
公开(公告)日：2016-03-29
申请号：US14271044
申请日：2014-05-06
Applicant: ANALOG DEVICES GLOBAL
Inventor： Frank Poucher , Colin G. Lyden
CPC classification number: H01L27/0207 , H01L23/293 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
Abstract: Physical layouts of ratioed circuit elements, such as transistors, are disclosed. Such layouts can maintain electrical characteristics of the ratioed circuit elements relative to one another in the presence of mechanical stresses applied to an integrated circuit, such as an integrated circuit encapsulated in plastic. The ratioed circuit elements can include first and second composite circuit elements formed of first and second groups of circuit elements, respectively, arranged around a center point. The first group of circuit elements can be arranged on a grid and the second group of circuit elements can include four circuit elements spaced approximately the same distance from the center point. Each of the circuit elements in the second group can be off the grid in at least one dimension. The first and second groups of circuit elements can be arranged around a perimeter of dummy circuit elements in some embodiments.
Abstract translation: 公开了诸如晶体管的比例电路元件的物理布局。 这样的布局可以在施加到集成电路的机械应力（例如封装在塑料中的集成电路）的存在下，保持比例的电路元件相对于彼此的电特性。 比例的电路元件可以包括分别围绕中心点布置的由第一组和第二组电路元件形成的第一和第二复合电路元件。 第一组电路元件可以布置在栅格上，第二组电路元件可以包括与中心点大致相同的距离的四个电路元件。 第二组中的每个电路元件可以在至少一个维度上离开网格。 在一些实施例中，第一和第二组电路元件可布置在虚拟电路元件的周边周围。
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公开(公告)号：US20150228636A1
公开(公告)日：2015-08-13
申请号：US14271044
申请日：2014-05-06
Applicant: ANALOG DEVICES GLOBAL
Inventor： Frank Poucher , Colin G. Lyden
IPC: H01L27/02 , H01L23/29 , H01L21/8222 , H01L27/082
CPC classification number: H01L27/0207 , H01L23/293 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
Abstract: Physical layouts of ratioed circuit elements, such as transistors, are disclosed. Such layouts can maintain electrical characteristics of the ratioed circuit elements relative to one another in the presence of mechanical stresses applied to an integrated circuit, such as an integrated circuit encapsulated in plastic. The ratioed circuit elements can include first and second composite circuit elements formed of first and second groups of circuit elements, respectively, arranged around a center point. The first group of circuit elements can be arranged on a grid and the second group of circuit elements can include four circuit elements spaced approximately the same distance from the center point. Each of the circuit elements in the second group can be off the grid in at least one dimension. The first and second groups of circuit elements can be arranged around a perimeter of dummy circuit elements in some embodiments.
Abstract translation: 公开了诸如晶体管的比例电路元件的物理布局。 这样的布局可以在施加到集成电路的机械应力（诸如封装在塑料中的集成电路）的存在下，保持比例的电路元件的电特性。 比例的电路元件可以包括分别围绕中心点布置的由第一组和第二组电路元件形成的第一和第二复合电路元件。 第一组电路元件可以布置在栅格上，第二组电路元件可以包括与中心点大致相同的距离的四个电路元件。 第二组中的每个电路元件可以在至少一个维度上离开网格。 在一些实施例中，第一和第二组电路元件可布置在虚拟电路元件的周边周围。
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