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    POLISHING PADS AND SYSTEMS AND METHODS OF MAKING AND USING THE SAME
    1.
    发明申请
    POLISHING PADS AND SYSTEMS AND METHODS OF MAKING AND USING THE SAME 审中-公开

    公开(公告)号：US20180281148A1

    公开(公告)日：2018-10-04

    申请号：US15766643

    申请日：2016-10-07

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Duy K. Lehuu ,  David F. Slama

    IPC: B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24D3/28

    Abstract: The present disclosure relates to polishing pads which include a polishing layer, a porous substrate and an interfacial region. The present disclosure relates to a method of making the polishing pads. The present disclosure relates to a method of polishing a substrate, the method of polishing including: providing a polishing pad according to any one of the previous polishing pads; providing a substrate, contacting the working surface of the polishing pad with the substrate surface, moving the polishing pad and the substrate relative to one another while maintaining contact between the working surface of the polishing pad and the substrate surface, wherein polishing is conducted in the presence of a polishing solution.

    Polishing pads and systems and methods of making and using the same
    4.
    发明授权
    Polishing pads and systems and methods of making and using the same 有权

    公开(公告)号：US11154959B2

    公开(公告)日：2021-10-26

    申请号：US15766643

    申请日：2016-10-07

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Duy K. Lehuu ,  David F. Slama

    IPC: B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24D3/28 ,  B24D11/02 ,  B24D18/00 ,  H01L21/304

    Abstract: The present disclosure relates to polishing pads which include a polishing layer, a porous substrate and an interfacial region. The present disclosure relates to a method of making the polishing pads. The present disclosure relates to a method of polishing a substrate, the method of polishing including: providing a polishing pad according to any one of the previous polishing pads; providing a substrate, contacting the working surface of the polishing pad with the substrate surface, moving the polishing pad and the substrate relative to one another while maintaining contact between the working surface of the polishing pad and the substrate surface, wherein polishing is conducted in the presence of a polishing solution.

    POLYMERIC MULTILAYER FILMS AND METHODS TO MAKE THE SAME
    5.
    发明申请
    POLYMERIC MULTILAYER FILMS AND METHODS TO MAKE THE SAME 审中-公开
    聚合多层薄膜及其制备方法

    公开(公告)号：US20170001359A1

    公开(公告)日：2017-01-05

    申请号：US15038880

    申请日：2014-12-09

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： David F. Slama ,  Garth V. Antila ,  Brent R. Hansen

    IPC: B29C47/06 ,  B32B3/26 ,  B32B27/32 ,  B32B27/40 ,  B29C47/00 ,  B32B5/14

    CPC classification number: B29C48/18 ,  B29C48/022 ,  B29K2995/0002 ,  B29L2009/00 ,  B32B3/26 ,  B32B3/263 ,  B32B3/266 ,  B32B5/14 ,  B32B5/142 ,  B32B7/06 ,  B32B27/32 ,  B32B27/40 ,  B32B2250/03 ,  B32B2307/102

    Abstract: Polymeric multilayer film having first and second generally opposed major surfaces, and comprising first, second, and third layers, an array of blind openings between the first and second major surfaces, and an average thickness, wherein the first, second, and third layers each have a first average thickness excluding any thickness said first, second, and third layers having in any of the blind openings, wherein the first and second layers extend into the first average thickness of the third layer, wherein each of the first, second, and third layers each have a second average thickness (including a thickness of zero) in the blind holes, wherein the second average thickness of the first and third layers are each greater than zero, and wherein the ratio of the first average thickness of the second layer to the second average thickness of the second layer is at least 2.1; and method of making the same. Embodiments of polymeric multilayer film described herein are useful, for example, for acoustic absorption.

    Abstract translation: 具有第一和第二大致相对的主表面并且包括第一，第二和第三层的聚合多层膜在第一和第二主表面之间具有盲孔的阵列和平均厚度，其中第一，第二和第三层各自 具有不包括任何厚度的第一平均厚度，所述第一层，第二层和第三层具有在任何盲孔中的任何一个，其中第一层和第二层延伸到第三层的第一平均厚度，其中第一，第二和第三层 第三层各自在盲孔中具有第二平均厚度（包括零的厚度），其中第一和第三层的第二平均厚度均大于零，并且其中第二层的第一平均厚度 第二层的第二平均厚度为至少2.1; 和制作方法。 本文所述的聚合物多层膜的实施例可用于例如声吸收。

    MICROREPLICATED POLISHING SURFACE WITH ENHANCED CO-PLANARITY
    7.
    发明申请
    MICROREPLICATED POLISHING SURFACE WITH ENHANCED CO-PLANARITY 审中-公开

    公开(公告)号：US20200164484A1

    公开(公告)日：2020-05-28

    申请号：US16636348

    申请日：2018-08-02

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Kenneth A.P. Meyer ,  John J. Sullivan ,  Brian W. Lueck ,  Duy K. Lehuu ,  David J. Muradian ,  David F. Slama

    IPC: B24B37/26 ,  B24B37/22

    Abstract: An article includes a polishing layer that includes a plurality of raised cells separated by a plurality of channels. Each of the plurality of raised cells includes a microstructured working surface, a substantially vertical channel surface, and an offset surface between an edge of the working surface and an upper edge of the channel surface. The microstructured working surface includes a plurality of microstructures. Tops of the plurality of microstructures define a top plane and bases of the plurality of microstructures define a base plane. The substantially vertical channel surface defines a wall of a channel of the plurality of channels and the channel surface defines a channel plane. The offset surface includes a nonplanar portion of displaced material. The displaced material defines a displacement plane that is below the base plane or within a tolerance of the top plane.

    COEXTRUDED POLYMERIC LAYER
    10.
    发明申请
    COEXTRUDED POLYMERIC LAYER 有权

    公开(公告)号：US20220184916A1

    公开(公告)日：2022-06-16

    申请号：US17310942

    申请日：2020-03-11

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： David F. Slama ,  Garth V. Antila ,  Brent R. Hansen ,  Caitlin E. Meree

    IPC: B32B3/30 ,  B32B5/02 ,  B32B5/18 ,  B32B7/022 ,  B32B27/06 ,  B32B37/15

    Abstract: Coextruded polymeric layer having first and second opposed major surfaces, the coextruded polymeric layer comprising foam and the coextruded polymeric layer comprising features extending from or into the first major surface by at least 100 micrometers, the first major surface comprising a first material having a first percent elongation at break, the second major surface comprising a second material having a second percent elongation at break, wherein the first percent elongation at break is greater than 100 percent of the second percent elongation at break. Coextended polymeric layers described herein are useful, for example, in vibration damping applications (e.g., a vibration damping laminate comprising a kinetic spacer comprising the coextruded polymeric layers).

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