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公开(公告)号：US20160120068A1
公开(公告)日：2016-04-28
申请号：US14890389
申请日：2014-05-12
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Pei Tien , Mihee Lee , Chao-Yuan Wang , Han-Yi Chung , Ching-Yi Liu , Kuo-Chung Lin , Wei-Yu Chen
CPC classification number: H05K7/20481 , B32B3/30 , B32B5/18 , B32B7/02 , B32B7/12 , B32B9/007 , B32B15/08 , B32B15/20 , B32B2266/0214 , B32B2266/0257 , B32B2266/14 , B32B2307/302 , B32B2307/304 , B32B2405/00 , B32B2457/00
Abstract: The present invention provides a heat spreading tape including at least one heat spreading layer adapted for heat dissipation and at least one heat insulating layer adhesively attached to the heat spreading layer. Void regions are formed in the at least one heat insulating layer and are adapted for acting as heat transfer barriers in a direction perpendicular to the major surfaces of the heat spreading tape, i.e. the thickness tape.
Abstract translation: 本发明提供了一种散热带，其包括至少一个适于散热的散热层和至少一个粘附在散热层上的绝热层。 在至少一个隔热层中形成空隙区域，并且适于在垂直于散热带的主表面即厚度带的方向上用作传热阻挡层。
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2.发明公开公开(公告)号：US20240174897A1
公开(公告)日：2024-05-30
申请号：US18284250
申请日：2022-03-28
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Aizoh Sakurai , Ching-Yi Liu
CPC classification number: C09J7/29 , C09J7/385 , C09J2203/326 , C09J2301/314 , C09J2301/41 , C09J2301/414 , C09J2400/10 , C09J2433/00 , C09J2479/086 , C09J2481/006
Abstract: A transparent heat resistive adhesive tape with antistatic performance and a method of use thereof are provided. The adhesive tape includes at least a transparent backing film layer, an electrically conductive transparent layer disposed on the backing film layer, and a transparent acrylic adhesive layer disposed on the electrically conductive transparent layer. The adhesive tape has heat resistivity and antistatic performance on an adhesive side of the tape while maintaining good optical transparency.
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3.发明公开公开(公告)号：US20230357477A1
公开(公告)日：2023-11-09
申请号：US18246364
申请日：2021-10-05
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Sung-Tso Lin , Ching-Yi Liu , Ying-Yuh Lu , Wei-Cheng Su
IPC: C08F265/10 , C09J151/00
CPC classification number: C08F265/10 , C09J151/003
Abstract: The present application is a composition including abase resin comprising between about 4% and about 15% acrylic acid monomer and an oligomer additive comprising (a) one of an acrylamide or meth(acrylamide) copolymer and (b) a high glass transition temperature monomer. The oligomer additive has a molecular weight range of between about 20,000 and about 1,000,000 and a glass transition temperature of between about 70° C. and about 115° C. The composition has a blending ratio of base resin to oligomer additive of between about 7 to about 30 parts per hundred of resin.
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公开(公告)号：US20180207901A1
公开(公告)日：2018-07-26
申请号：US15745724
申请日：2015-07-20
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Pei Tien , Chao-Yuan Wang , Ching-Yi Liu
IPC: B32B3/26 , H05K7/20 , B32B15/04 , B32B15/20 , B32B37/12 , B32B37/18 , B32B38/00 , C09J9/00 , C09J7/29 , C09J7/38
CPC classification number: B32B3/266 , B32B15/043 , B32B15/20 , B32B37/1284 , B32B37/18 , B32B38/0004 , B32B2255/06 , B32B2255/26 , B32B2264/102 , B32B2307/202 , B32B2307/206 , B32B2307/302 , B32B2311/24 , B32B2405/00 , B32B2457/20 , C09J7/29 , C09J7/385 , C09J9/00 , C09J2205/114 , C09J2433/00 , G06F1/203 , H01L23/36 , H01L23/3735 , H01L23/3737 , H05K7/20509
Abstract: The present invention provides a heat spreading structure comprising a first conductive layer and a composite layer that sequentially comprises a structured adhesive layer and a second conductive layer having a coating on the first conductive layer, wherein the structured adhesive layer comprises at least one polymeric region and at least one void region. The composite layer further has a grounding opening exposing a part of the first conductive layer for grounding purposes. The present invention also provides a heat spreading tape and a method for forming the same.
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